3D2D4G08UB2302CN-4A datasheet, PDF

3D2D4G08UB2302CN-4A: DescriptionDDR DRAM, 512MX8, CMOS, PBGA63, FBGA-63; Categorystorage storage; File Size95KB，2 Pages; Manufacturer3D PLUS

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3D2D4G08UB2302CN-4A Overview

DDR DRAM, 512MX8, CMOS, PBGA63, FBGA-63

Parameter Name	Attribute value
Objectid	1842937605
package instruction	FBGA, BGA63,9X11,32
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Other features	SELF REFRESH
I/O type	COMMON
JESD-30 code	R-PBGA-B63
length	14.7 mm
memory density	4294967296 bit
Memory IC Type	DDR2 DRAM
memory width	8
Number of functions	1
Number of ports	1
Number of terminals	63
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	512MX8
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	FBGA
Encapsulate equivalent code	BGA63,9X11,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, FINE PITCH
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	3.4 mm
self refresh	YES
Maximum standby current	0.01 A
Maximum slew rate	0.115 mA
Maximum supply voltage (Vsup)	1.9 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	12.2 mm

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