Glenair’s new 1000 Hour Grey over stainless steel.
Glenair’s standard olive drab zinc-nickel finish.
Glenair’s standard black zinc-nickel finish.
Glenair’s RoHs compliant black zinc-nickel.
Glenair’s standard black cadmium over stainless steel.
Glenair’s standard olive drab cadmium over stainless steel.
1000
1000
1000
1000
500
1000
2000
TABLE I - BACKSHELL INTERFACE DIMENSIONS
A
C*
D
08
E
08
F
08 [9]
G
H
09 [A]
08
08 [A]
03
10
10 [B]
12
12 [7] 12
14
14 [12] 14
16
16 [19] 16
18 [27]
18
20 [37]
20
22
22
22 [H]
24
61
24 [J]
25 [G]
24
28
28
32
32
36
36
40
40
40
44
44
48
48
33 [J]
36
29 [H]
32
28
24
24
24 [25] 23 [F]
25 [J]
24
24
22
22
22 [23]
23 [H]
24
20
20
20 [21]
21 [G]
19 [E]
20 [G]
22
22
22
18
18
18 [19]
19 [F]
17 [D]
18 [F]
20
20
20
16
16 [17]
17 [E]
15 [C]
16 [E]
18
18
18
12
14
12 [13]
13 [C]
11 [A]
14 [15]
15 [D]
13 [B]
14 [D]
16
16
16 [17]
14 [15]
14
14
12
12
10
10
10 [11]
11 [B]
12 [13]
10
11
10
10
J
K
08
L
08
S
08
.770 (19.6)
.890 (22.6)
.890 (22.6)
1.020 (25.9)
1.020 (25.9)
1.150 (29.2)
1.150 (29.2)
1.260 (32.0)
1.230 (31.2)
1.400 (35.6)
1.360 (34.5)
1.530 (38.9)
1.480 (37.6)
1.600 (40.6)
(40.6)
(49.3)
.820 (20.8)
1.060 (26.9)
.820 (20.8)
.940
1.170
.940
1.060
1.290
1.060
(23.8)
(29.7)
(23.8)
(26.9)
(32.7)
(26.9)
1.170 (29.7)
1.420 (36.1)
1.170 (29.7)
1.290 (32.7)
1.540 (39.1)
1.420 (36.0)
1.670 (42.4)
1.540 (39.1)
2.010 (51.1)
1.840 (46.7)
1.970 (50.0)
2.090 (53.1)
2.280 (57.9)
2.340 (59.4)
2.340 (59.4)
2.530 (64.3)
2.590 (65.8)
2.590 (65.8)
2.780 (70.6)
2.910 (73.9)
3.030 (77.0)
3.160 (80.3)
3.220 (81.8)
3.410 (86.6)
1.600
(43.9)
(43.9) 1.940
(43.2)
(42.4)
(49.3)
(46.2)
1.940
1.970 (50.0)
2.190 (55.6) 2.190
2.220 (56.4)
2.440 (62.0) 2.440
2.440
2.47 (62.7)
2.690
2.690
2.720 (69.1)
2.930
2.970 (75.4)
1.730
1.730
1.700
1.670
1.940
1.820
3.220 (81.8)
1.660 (42.2)
2.120 (53.8)
(49.3)
2.010 (51.1)
(55.6)
2.260 (57.4)
(62.0)
(62.0)
2.530 (64.3)
(68.3)
(68.3)
3.040 (77.2)
(74.4)
* Code C, MIL-C-22992, Left-Hand Thread. Connector designations depicted thus [ ] are for reference only and are not to be used in part number development.
BACKSHELL INTERFACE STANDARDS (See pages 15-17 for more information)
How to use C language programming in ADS1.2 development environment to realize the sound recording and playback functions on Liyutai 2410 development board. I would like to seek relevant experience an...
[i=s]This post was last edited by lvxinn2006 on 2019-1-11 08:55[/i] [align=left][font=Tahoma]The development board evaluated in this event[/font]ST NUCLEO-G071RB is provided by STMicroelectronics. Tha...
[p=24, null, left][color=rgb(31, 31, 31)][backcolor=rgb(255, 255, 255)][font=arial, 宋体][size=14px]Qualcomm, whose patent licensing business has been plagued by setbacks, finally has good news. Accordi...
1. Equipment Overview
Shell-and-tube heat exchangers are a common heat exchange device used in chemical evaporation and heating equipment. Currently, the tubesheets of shell-and-tube heat exch...[Details]
Nios II is a configurable 16-/32-bit RISC processor. Combined with a rich set of peripheral-specific instructions and hardware acceleration units, it provides a highly flexible and powerful SOPC sy...[Details]
"Have you set your calendar reminder?"
On August 24, Nvidia Robotics' official account posted a photo of a black gift box on a social media platform, with an attached greeting card sig...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Current Development Status of DVR Market
A DVR, or digital video recorder, uses a hard disk for recording, unlike traditional analog video recorders. It's often called a DVR because it's a com...[Details]
The structure of an LCD TV primarily consists of the LCD display module, power module, driver module (primarily including the main driver board and tuner board), and keypad module. LCD display modu...[Details]
On August 25th, TSMC, the world's leading contract chip manufacturer, attracted significant attention for its decision to build a chip manufacturing facility in Arizona. TSMC primarily manufactures...[Details]
Since its invention in the mid-1940s, the microwave oven has evolved from a humble beginning to commercial use, entering homes in the 1960s and rapidly gaining popularity. Its basic functionality a...[Details]
In June 2014, the Ministry of Industry and Information Technology issued 4G FD-LTE licenses to China Unicom and China Telecom. Together with the 4G TD-LTE licenses issued to China Mobile, China Uni...[Details]
Have you ever heard stories about "crazy appliances"? Think of microwaves that turn on automatically or ovens that preheat without any human input? With radios and electromagnetic interfaces ubiqui...[Details]
Smartphones have become essential digital devices, and the growing number of smartphone-centric applications is enriching people's lives. As users, they desire a better app experience and a wider r...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
Industrial computers with GPUs leverage powerful parallel processing to build deep learning models to analyze and respond to optical inputs. The systems develop an understanding of visual data to i...[Details]
With growing environmental awareness, the continuous improvement of three-electric technology and the increasing deployment of infrastructure such as charging stations, the electrification of new e...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
