EEWORLDEEWORLDEEWORLD

Part Number

Search

3SMAJ5931B-TP-HF

Description
Zener Diode, 18V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, SMA, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size332KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Environmental Compliance
Download Datasheet Parametric View All

3SMAJ5931B-TP-HF Overview

Zener Diode, 18V V(Z), 5%, 3W, Silicon, Unidirectional, DO-214AC, SMA, 2 PIN

3SMAJ5931B-TP-HF Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Parts packaging codeDO-214AC
package instructionR-PDSO-C2
Contacts2
Reach Compliance Codenot_compliant
ECCN codeEAR99
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JEDEC-95 codeDO-214AC
JESD-30 codeR-PDSO-C2
JESD-609 codee3
Humidity sensitivity level1
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
polarityUNIDIRECTIONAL
Maximum power dissipation3 W
Nominal reference voltage18 V
surface mountYES
technologyZENER
Terminal surfaceMatte Tin (Sn)
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperature10
Maximum voltage tolerance5%
Working test current20.8 mA
Base Number Matches1
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMAJ5913B
THRU
3SMAJ5956B
3SMAJ59
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
3.3thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
High specified maximum current(IZM)when adequately heat sinking
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
Surface Mount Application
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Junction
to
Ambient
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
R
thJA
25
/W
135
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085"
Note:
1.
2.
3.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
Lead temperature at T
A
=15
O
C
0.070"
Revision:
D
www.mccsemi.com
1 of 4
2013/04/11
【BLE 5.3 wireless MCU CH582】8. ADC sampling (internal bat, internal temperature, external input)
Series of articles: 【BLE 5.3 wireless MCU CH582】1. Getting to know the CH582 development board (unboxing) 【BLE 5.3 wireless MCU CH582】2. MounRiver IDE first experience 【BLE 5.3 wireless MCU CH582】3. N...
freeelectron Domestic Chip Exchange
Integrated power devices simplify FPGA and SoC design
[align=left][color=rgb(85, 85, 85)][font="][size=4] The development trend of industrial electronic products is smaller circuit board size, more fashionable appearance and more cost-effective Due to th...
Jacktang DSP and ARM Processors
What is the TFT controller on the LM3S9B96 development board?
What is the TFT controller on the LM3S9B96 development board?Which 4.3-inch TFTs can be replaced? Any recommendations?Is there a bigger screen?...
sptt1 Microcontroller MCU
PCB SMD component package pad design size standard
[size=4] When drawing component packages on PCB, we often encounter the problem of not being able to grasp the size of the pads, because the information we consult gives the size of the components the...
qwqwqw2088 PCB Design
Top 10 surprises from the World Cup
*************************************************** **************** Huang Jianxiang's crazy roar for Italy. Surprise index: 10When the two news stories "Italy won" and "Huang Jianxiang went crazy" we...
gaoyanmei Talking
How to implement interrupt nesting in MSP430? (Urgent)
I want to use the capture mode to measure the pulse width. Some of my other interrupts take too long, so cov is always set to 1. How can I allow the capture interrupt to be responded to in other inter...
407406136 Microcontroller MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2577  2545  1246  257  353  52  26  6  8  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号