Y163010K0000B0R datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> Y163010K0000B0R

Y163010K0000B0R: Descriptionres 10k ohm 1/4W .1% 1206; CategoryPassive components The resistor; File Size225KB，4 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

Download Datasheet Parametric View All

Y163010K0000B0R Overview

res 10k ohm 1/4W .1% 1206

Y163010K0000B0R Parametric

Parameter Name	Attribute value
Maker	Vishay
Reach Compliance Code	unknown
ECCN code	EAR99
Manufacturer's serial number	VFCP1206(ZFOIL)
Resistor type	FIXED RESISTOR

Preview

Download Datasheet

View All

VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)

Vishay Foil Resistors

UltraUltra High-Precision with ofFlip Chip Resistorng W TCR of gn

High-Pr sion Flip p stor TCR ±0.05

eci Z-Foil Chi Resi Z-Foil

ppm/°C, Space with ound

35%

Savi vs. rapar Desi

±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design

and PCR of 5 ppm at Rated Power

FEATURES

• Temperature coefficient of resistance (TCR):

± 0.05 ppm/°C nominal (0°C to + 60°C)

± 0.2 ppm/°C nominal (–55°C to +125°C, +25°C ref.)

(see Table 1 and Figure 2)

• Tolerance: to ±0.01% (100 ppm)

• Power coefficient “∆R due to self heating” 5 ppm at

rated power

• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)

• Power rating to: 600 mW at +70°C

• Electrostatic discharge (ESD): at least to 25 kV

• Resistance range: 5 Ω to 125 kΩ (for lower and higher

values, please contact us)

• Foil resistors are not restricted to standard values;

specific “as required” values can be supplied at no

extra cost or delivery (e.g., 1K2345 vs. 1K)

• Non-inductive, non-capacitive design

• Thermal stabilization time: <1 s (within 10 ppm of

steady state value)

• Short time overload: ≤0.005% (50 ppm)

• Non hot spot design

• Rise time: 1 ns effectively no ringing

• Current noise: <0.010 μV

rms

/ V of applied voltage

(<–40 dB)

• Voltage coefficient: <0.1 ppm/V

• Non-inductive: <0.08 μH

• Terminal finishes available: lead (Pb)-free, tin/lead alloy

• Compliant to RoHS directive 2002/95/EC*

• Matched sets are available per request

• Prototype quantities available in just 5 working days or

sooner. For more information, please contact us.

in the most critical applications by eliminating the need for

corrective circuitry and reducing the large land patterns

needed for a wrap-around configuration. The device’s flip-

chip configuration saves up to 35% PCB space compared

with a surface-mount chip with wraparound terminations

while also providing better strain relief to eliminate

cracked substrates and board delamination.

In addition to its remarkably improved load-life stability,

the VFCP Series is noise-free and provides ESD

protection of 25 kV or more for increased reliability. The

device’s solid element alloy is matched to the substrate,

forming a single entity with balanced resistance versus

temperature characteristics for an unusually low and

predictable TCR over a wide temperature range from

–55°C to more than +125°C. The adhesive that holds the

foil to the flat substrate withstands high temperatures,

pulsing power, moisture incursions, shock and vibration,

and low-temperature exposure while still holding securely

to the foil element. Resistance patterns are photo-etched

into the element to permit the trimming of resistance

values to very tight tolerances as low as 0.01%.

The Flip Chips devices are qualified as anti-sulfurated

resistors for use in environments with high levels of

contamination. Such environments include alternative

energy applications, industrial control systems,

sensors, RTDs, electric instrumentation, weather and

communication base stations, and any electronic

appliance used in high concentrations of sulfur. The

combination of flip-chip terminations and Z-Foil

construction and materials results in the most stable

resistors available, requiring the lowest error allowance.

This means that more error allowance can be transferred

to active devices—resulting in lower costs—or applied

to the foil resistors themselves, allowing for looser initial

tolerances than would be required for other resistor

technologies.

INTRODUCTION

Based on VFR’s next-generation Bulk Metal

Z-Foil

technology, the VFCP Series (foil resistor flip-chip)

excels over all previous stability standards for precision

resistors with an order of magnitude improvement in

high-temperature stability, load-life stability, and moisture

resistance. These new benchmark levels of performance

provide design engineers with the tools to build circuits

not previously achievable while reducing costs and space

Recommended Resources

DC coupling circuit b that raises the base potential of VT2

Two anti-theft alarm circuits

Stable and reliable light control circuit

Temperature controlled nickel-cadmium battery charger circuit

Ericsson GH338 charger circuit

Computer motherboard circuit diagram 820 1_50

DS18B20 temperature measurement program complete explanation: Hardware: 51 board (1) single-wire ds18b20 connected to P2.2 (2) use external power supply to power ds18b20, no parasitic power supply Software: Kei uVision 2 I didn't know much about timing at first,...; fsddd MCU

Weird problem found in PIC18: X[0] =0x7D1; Y[0] =0xA50; uint8mm(void) {uint16arg;uint16arg1;arg =X[0];arg1 =Y[0]if（argSoftware simulation should be fine. If you use icd2, this situation may occur. I have also encountered this situ...; ltbytyn Microchip MCU

I want to buy a LM3S9B96 board, how much does it cost approximately?: I want to buy a LM3S9B96 board, how much does it cost approximately?...; wzp2007 Microcontroller MCU

Detailed explanation of setting up the development environment for IMX6ULL - setting up SSH service: Based on Xunwei-IMX6ULL development board Whether we are developing SDK programs or Linux systems, we need to build a development environment first. If we have learned MCU development ( 51 , STM32 , e...; 马佳徐徐 ARM Technology

Qualcomm protocol advice: Does anyone know about Qualcomm protocol? I want to make one myself, but the protocol is not comprehensive enough and the phone cannot recognize it. Is there something about communication in the phone...; 雨后的梧桐 Download Centre

MSP430 UART baud rate calculation: Experts~ I am a little confused when studying UART baud rate conversion. Here is the sample code in the book: int_usart() { U0CTL|= SWRST; U0CTL|= CHAR; U0TCTL|= SSEL1; //SELECT SMCLK=1MHz UOBR0= 0Xa0...; irving800621 Microcontroller MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components