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MC0805S8F3902T5E

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 39000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
CategoryPassive components    The resistor   
File Size265KB,5 Pages
ManufacturerSPC Multicomp
Environmental Compliance
Download Datasheet Parametric View All

MC0805S8F3902T5E Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 39000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP

MC0805S8F3902T5E Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid8366994920
package instructionCHIP
Reach Compliance Codeunknown
YTEOL8.25
JESD-609 codee3
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.55 mm
Package length2 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.25 mm
method of packingTR
Rated power dissipation(P)0.125 W
Rated temperature70 °C
resistance39000 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage150 V
Thick Film Chip Resistors
Features:
Small size and lightweight
Suitable for both flow and reflow soldering
Reduction of assembly costs and matching with placement machines
Standard
: 2, 5 and 10% - A series
: 1%
- B series
Performance Specifications:
Temperature Coefficient
: 1
to 10
Ω ≤
±400 PPM/°C
11
to 100
Ω ≤
±200 PPM/°C
> 100
Ω ≤ ±100
PPM/°C (0201 > 100
Ω ≤
±200 PPM/°C)
: ±5% : ± (2% + 0.1
Ω)
Max.
±1% : ± (1% + 0.1
Ω)
Max.
: 1,000 MΩ
: No evidence of flashover, mechanical damage, arcing or insulation breakdown
: ± (1% + 0.05
Ω)
Max.
: Resistance change rate is ± (1% + 0.05
Ω)
Max.
: 95% coverage
: ±5% : ± (1% + 0.05
Ω)
Max.
±1% : ± (0.5% + 0.05
Ω)
Max.
: ±5% : ± (3% + 0.1
Ω)
Max.
±1% : ± (0.5% + 0.1
Ω)
Max.
: ±5% : ± (3% + 0.1
Ω)
Max.
±1% : ± (1% + 0.1
Ω)
Max.
: ±5% : ± (3% + 0.1
Ω)
Max.
±1% : ± (1% + 0.1
Ω)
Max.
Short-time Overload
Minimum Insulation Resistance
Dielectric Withstanding Voltage
Terminal Bending
Soldering Heat
Minimum Solderability
Temperature Cycling
Humidity (Steady State)
Load Life in Humidity
Load Life
Construction
Power Rating and Dimension
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Page <1>
06/01/12 V1.1

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