plerow
TM
ALN0140WT
Internally Matched LNA Module
Features
·
S
21
= 25.2 dB @ 125 MHz
= 24.8 dB @ 155 MHz
·
NF of 0.7 dB over Frequency
·
Unconditionally Stable
·
Single 5V Supply
·
High OIP3 @ Low Current
Description
The plerow
TM
ALN-series is the compactly designed surface-mount
module for the use of the LNA with or without the following gain blocks in
the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS,
PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communi-
cation terminals, CATV and so on. It has an exceptional performance of
low noise figure, high gain, high OIP3, and low bias current. The stability
factor is always kept more than unity over the application band in order
to ensure its unconditionally stable implementation to the application
system environment. The surface-mount module package including the
completed matching circuit and other components necessary just in case
allows very simple and convenient implementation onto the system
board in mass production level.
Specifications (in Production)
Typ. @ T = 25°C, V
s
= 5 V, Freq. =140 MHz, Z
o.sys
= 50 ohm
Parameter
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
S11 / S22
(1)
(2)
Unit
MHz
dB
dB
dB
dBm
dB
dBm
Specifications
Min
125
24
25
±
0.2
0.7
30
20
31
-12 / -18
21
73
5
50
C.W 23 ~ 25 (before fail)
Surface Mount Type, 10Wx10Lx3.8H
90
±
0.3
0.75
Typ
Max
155
1-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: sales@asb.co.kr
Tel: (82) 42-528-7223
Fax: (82) 42-528-7222
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Output P1dB
Switching Time
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
Package Type & Size
(3)
µsec
mA
V
Ω
dBm
mm
Operating temperature is -40°C to +85°C.
1) OIP3 is measured with two tones at an output power of +4 dBm / tone separated by 1 MHz.
2) S11/S22 (max) is the worst value within the frequency band.
3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to V
S
.
Outline Drawing (Unit: mm)
Pin Number
Function
RF In
RF Out
Vs
Ground
plerow
ALN0140WT
ASB Inc.
(Top View)
(Bottom View)
2
5
6
Others
Solder Stencil Area
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
(Side View)
Ø0.4
plated thru holes to ground plane
(Recommended Footprint)
1/4
www.asb.co.kr
March 2009
plerow
TM
ALN0140WT
Internally Matched LNA Module
Application Circuit
V
S
+
-
Tantal or MLC (Multi Layer Ceramic)
Capacitor
C1
IN
C2
ALN
OUT
1)
The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced
from the DC supply. The capacitance value may be determined by customer’s DC supply status. The ca-
pacitor should be placed as close as possible to V
s
pin and be connected directly to the ground plane for
the best electrical performance.
DC blocking capacitors are always necessarily placed at the input and output port for allowing only the
RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are in-
cluded inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added
just in case that the customer wants. The value of C1 & C2 is determined by considering the application
frequency.
2)
Recommended Soldering Reflow Process
Evaluation Board Layout
Vs
260°C
Ramp-up
(3˚C/sec)
200°C
20~40 sec
Ramp-down
(6°C/sec)
IN
OUT
150°C
60~180 sec
Size 25x25mm
(for ALN-AT, BT, T Series – 10x10mm)
4/4
www.asb.co.kr
March 2009
Integrated technical exchanges
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