BU21008MUV-E2 datasheet, PDF - EEWORLD Datasheet

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BU21008MUV-E2: DescriptionIC cap sensor switch 16ch 32vqfn; CategoryOther integrated circuit (IC) Consumption circuit; File Size426KB，15 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

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BU21008MUV-E2 Overview

IC cap sensor switch 16ch 32vqfn

BU21008MUV-E2 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	ROHM Semiconductor
Parts packaging code	QFN
package instruction	5 X 5 MM, ROHS COMPLIANT, VQFN-032
Contacts	32
Reach Compliance Code	compliant
Factory Lead Time	8 weeks
Other features	IT ALSO REQUIRES 1.7V TO 3.3V DIGITAL SUPPLY
Commercial integrated circuit types	CONSUMER CIRCUIT
JESD-30 code	S-XQCC-N32
length	5 mm
Number of functions	1
Number of terminals	32
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC32,.2SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3,3 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	5 mm

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Capacitive Sensor Control IC Series

Capacitive Sensor Switch

Control IC

BU21008MUV

No.09048EBY01

●Note

in capacitive sensor board design

Here, it explains a recommended value and recommended condition concerning the board, the overlay, and mounting when

BU21008MUV of capacitive sensor IC series and the composition by a solid board are assumed.

It is not the one to do the operation guarantee though a recommended value and recommended condition are made based

on the result of the real machine experiment by an experimental board. On the other hand, it is not the one to fix immovable

when not satisfying it either.

It treats as a reference of an initial examination, and finally, please experiment the principle by the use of a real machine, and

judge the quality of the system by the mounting experiment.

・Board

Item

Board material

Electrode

material

Electrode size

Electrode form

Wiring width

Wiring length

Via size

Material

FR4（glass epoxy)

Numerical value

thickness =1.6mm or more

thickness =10um-50um

36mm over - finger contact

area twice or less

0.2mm or less

100mm or less

0.4mm or less

Other condition

2 layer both sides structure

Shape doesn't influence sensitivity

The minimum value of the design rule

of the board is applied

The minimum value of the design rule

of the board is applied

1) About the size of the sensor electrode

①The

area of the sensor must do Hi and become twice or more the gross area of wiring.

②Please

give the twice the contact side product of the assumed finger to the upper bound of the area of the sensor as a

standard.

③Please

give 36mm to the lower bound of the area of the sensor as a standard.

2) About the form of the sensor electrode

①The

shape of the sensor doesn't have a big influence in the sensitivity of the sensor.

Given the shape of the finger-like circular and rectangular, and is appropriate.

②The

design with the copyright like the registration of a design etc. exists, and note special shape, please.

3) Method of setting up sensor electrode and wiring

①The

grand area arrangement around the sensor electrode and the sensor wiring is recommended.

Please arrange a grand area in the same to sensor electrode layer, and open the gap between a sensor electrode and

grand area by 1.0mm or more (To decrease a parasitic capacitance increase).

②The

grand area arrangement in the back of the sensor electrode and wiring is recommended.

Please arrange a grand area to cover all opposed the sensor electrodes with another layer on the back side of the

sensor electrode. The device that suppresses a parasitic capacitance increase such as grand shape being made a

mesh is necessary following the thickness 1.6mm in the FR4 board. In that case, please consult separately.

www.rohm.com

1/14

2009.04 - Rev.B

BU21008MUV

・Overlay

Item

Overlay material

Decorative material coat

Decorative material

deposition plating

Material

Acrylic , glass

nonconductive

low tin and deposition of

conductive metal plating

Numerical value

thickness =1.3mm or less

thickness =50um or less

Application Note

Other condition

High dielectric constant

material

The content of a metallic

material is noted

1) About the overlay material

In the resin system, the acrylic fiber is recommended. In the inorganic system, the glass is recommended. The material

with a high permittivity is recommended to be used.

2) The decorative metal-coating material on the carbon content and the volume of film and the low resistance, the sensor can

cause a loss of sensitivity. If you want to study painting, paint containing a conductive material and content of the

confirmation of whether the content of the variations (on mass) of the sample prepared please check acceptance.

3) By metal-plated decorative materials for the deposition

①It

is possible to make the sensor react by depositing the material of low conductive as tin in discontinuity.

When a metallic deposition is examined, I hope a panel manufacturer and prior meeting.

②Will

be decorating for the electrode surface, touch sensors at the bottom of a multi-electrode reaction at the same time a

situation occurs. Specifications for the film by evaporation the degree of impact varies, but as a fundamental measure,

the decorative film without a solid arrangement, the top surface of the sensor in the outer groove established electrical,

adjacent to the separation of electrical sensors to each other to make a film that is recommended.

・Mounting

Item

Fixed material

Material

Double-faced tape

Numerical value

thickness

＝100um

or less

Other condition

1) About a fixed material

①Both

sides must use the one of the composition that is the base material for the center for specification with the adhesive

especially like a no bur and the double-faced tape, etc. for the material, please use 100 um in total thickness following.

②The

thickness of the air-gap when bonding is canceled by the calibration function in case of 100um or less.

It is possible to correct it even by the one by a change with the lapse of time because it is done at the time of not the

setting done to the first stage of manufacturing but each power supply turning on.

2) Sensors on board sensors fixed to the board at the top of double-sided tape at the Ministry of fixed overlay method is

recommended.

Department back on board, Board recommended conditions (FR4 material, thickness = 1.6mm or more) points if you do not

pay attention to the special. If you have a thin or thick board, FPC and stability of shape if not, back to the structural changes in

fixed to reduce the parasitic capacitance to charity is required.

●OK

NG example of wiring pattern

Other signal line

Ground line

Sensor line

www.rohm.com

2/14

2009.04 - Rev.B

BU21008MUV

Application Note

●SREF

electrode

1) In case SREF (reference electrode) has a same area as sensor electrode.

In case SREF electrode is placed on a surface of sensor electrode, it has to be placed with a certain distance from the

noise source and the finger contact influence. When it is placed on the back side of the sensor electrode surface, same

caution must be taken.

Most recommended configuration is to place it into middle layer which are covered by ground area (both front and back

side surface).

2) In case capacitor is used.

When a capacitor is used as a SREF (reference electrode), please place capacitor in the LSI component side as close as

possible.

The selection of the capacitance value has to be determined by experiment/tuning. In a commonly used PCB material (no

middle connection components such as connectors), under 1 to 10pF is recommended. In conversion theory, because the

capacity value near the DC is expected and there is a calibration of the offset cancellation circuit, the capacitor accuracy

as well as the temperature characteristics can be satisfied with standard capacitor products.

●Calibration

There are 16 sensor ports in BU21008MUV able to use. In the BU21008MUV, Only even ports can calibrate difference of the

capacitance between the two sensors to correct. The odd ports will use a result of the even ports that executed calibration.

An ideal value of the 8bitADC that the calibration was executed is near to 128.

After calibration, the ADC value that first sense is an offset correction data and is kept in register OFFSET (4*h). An offset

value will be the difference between the offset correction data and center value 128.

The offset value will keep the ADC value center value 128 when the sensor was not touched.

Offset value = Offset correction data (4*h) - 128

If the offset correction data is less than 128, it is meaning SREF > SIN. (Gain x1)

If the offset correction data is more than 128, it is meaning SREF < SIN. (Gain x1)

As for the channel not corrected, the error margin of the offset correction value grows compared with the corrected channel.

Because correction value obtained with other channels is misappropriated.

Without exceeding the threshold value of turning on not moving at all can happen when this error margin is large.

1) The channel that doesn't do the calibration must be nearer IC than the channel that does the calibration.

2) SREF setting

The offset value of SIN1, 3, 5, 7, 9, 11, 13, 15(register address 40h – 4Fh) < 128

Adjust the highest one in SIN1 and SIN3, 5, 7, … SIN15 approach 128

Before calibration C vs. Digitized

Saturated

Ideal

Smaller sensor (- offset)

Bigger sensor (+ offset)

Actual out of bigger sensor

Plus offset

Minus offset

www.rohm.com

3/14

2009.04 - Rev.B

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