BU21010MUV-E2 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Other integrated circuit (IC)> Consumption circuit> BU21010MUV-E2

BU21010MUV-E2: DescriptionIC ctlr cap sensor 8ch 16vqfn; CategoryOther integrated circuit (IC) Consumption circuit; File Size429KB，14 Pages; ManufacturerROHM Semiconductor; Websitehttps://www.rohm.com/; Environmental Compliance

Download Datasheet Parametric View All

BU21010MUV-E2 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	BU21010MUV-E2	-	-	View	Buy Now

BU21010MUV-E2 Overview

IC ctlr cap sensor 8ch 16vqfn

BU21010MUV-E2 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Parts packaging code	QFN
package instruction	3 X 3 MM, ROHS COMPLIANT, VQFN-16
Contacts	16
Reach Compliance Code	compliant
Factory Lead Time	11 weeks
Is Samacsys	N
Commercial integrated circuit types	CONSUMER CIRCUIT
JESD-30 code	S-XQCC-N16
length	3 mm
Number of functions	1
Number of terminals	16
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	UNSPECIFIED
encapsulated code	HVQCCN
Encapsulate equivalent code	LCC16,.12SQ,20
Package shape	SQUARE
Package form	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3,3 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	3.3 V
Minimum supply voltage (Vsup)	2.5 V
surface mount	YES
Temperature level	INDUSTRIAL
Terminal form	NO LEAD
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	3 mm
Base Number Matches	1

Preview

Download Datasheet

View All

Capacitive Sensor Control IC Series

Capacitive Sensor Switch

Control IC

BU21010MUV

No.09048EBY03

●Note

in capacitive sensor board design

Here, it explains a recommended value and recommended condition concerning the board, the overlay, and mounting when

BU21010MUV of capacitive sensor IC series and the composition by a solid board are assumed.

It is not the one to do the operation guarantee though a recommended value and recommended condition are made based

on the result of the real machine experiment by an experimental board. On the other hand, it is not the one to fix immovable

when not satisfying it either.

It treats as a reference of an initial examination, and finally, please experiment the principle by the use of a real machine, and

judge the quality of the system by the mounting experiment.

・Board

Item

Board material

Electrode material

Electrode size

Electrode form

Wiring width

Wiring length

Via size

Material

FR4(glass epoxy)

Numerical value

thickness

＝1.6mm

or more

thickness

＝10um-50um

36mm over

finger

contact area twice or less

0.2½½or less

100mm or less

0.4mm or less

Other condition

2 layer both sides structure

Shape doesn't influence sensitivity

The minimum value of the design

rule of the board is applied

The minimum value of the design

rule of the board is applied

1) About the size of the sensor electrode

①The

area of the sensor must do Hi and become twice or more the gross area of wiring.

②Please

give the twice the contact side product of the assumed finger to the upper bound of the area of the sensor as a

standard.

③Please

give 36mm to the lower bound of the area of the sensor as a standard.

2) About the form of the sensor electrode

①The

shape of the sensor doesn't have a big influence in the sensitivity of the sensor.

Given the shape of the finger-like circular and rectangular, and is appropriate.

②The

design with the copyright like the registration of a design etc. exists, and note special shape, please.

3) Method of setting up sensor electrode and wiring

①The

grand area arrangement around the sensor electrode and the sensor wiring is recommended.

Please arrange a grand area in the same to sensor electrode layer, and open the gap between a sensor electrode and

grand area by 1.0mm or more (To decrease a parasitic capacitance increase).

②The

grand area arrangement in the back of the sensor electrode and wiring is recommended.

Please arrange a grand area to cover all opposed the sensor electrodes with another layer on the back side of the

sensor electrode. The device that suppresses a parasitic capacitance increase such as grand shape being made a

mesh is necessary following the thickness 1.6mm in the FR4 board. In that case, please consult separately.

www.rohm.com

1/13

2009.04 - Rev.B

BU21010MUV

・Overlay

Item

Overlay material

Decorative material coat

Decorative material

deposition plating

Application Note

Material

acrylic

・

glass

nonconductive

low tin and deposition of

conductive metal plating

Numerical value

thickness

＝1.3mm

or less

thickness

＝50um

or less

thickness

＝50um

or less

Other condition

High dielectric

material

constant

The content of a metallic

material is noted

1) About the overlay material

In the resin system, the acrylic fiber is recommended. In the inorganic system, the glass is recommended. The material

with a high permittivity is recommended to be used.

2) The decorative metal-coating material on the carbon content and the volume of film and the low resistance, the sensor can

cause a loss of sensitivity. If you want to study painting, paint containing a conductive material and content of the

confirmation of whether the content of the variations (on mass) of the sample prepared please check acceptance.

3) By metal-plated decorative materials for the deposition

①It

is possible to make the sensor react by depositing the material of low conductive as tin in discontinuity.

When a metallic deposition is examined, I hope a panel manufacturer and prior meeting.

②Will

be decorating for the electrode surface, touch sensors at the bottom of a multi-electrode reaction at the same time a

situation occurs. Specifications for the film by evaporation the degree of impact varies, but as a fundamental measure,

the decorative film without a solid arrangement, the top surface of the sensor in the outer groove established electrical,

adjacent to the separation of electrical sensors to each other to make a film that is recommended.

・Mounting

Item

Material

Numerical value

Other condition

thickness

＝100um

or less

Fixed material

Double-faced tape

1) About a fixed material

①Both

sides must use the one of the composition that is the base material for the center for specification with the

adhesive especially like a no bur and the double-faced tape, etc. for the material, please use 100 um in total thickness

following.

②The

thickness of the air-gap when bonding is canceled by the calibration function in case of 100um or less.

It is possible to correct it even by the one by a change with the lapse of time because it is done at the time of not the

setting done to the first stage of manufacturing but each power supply turning on.

2) Sensors on board sensors fixed to the board at the top of double-sided tape at the Ministry of fixed overlay method is

recommended.

Department back on board, Board recommended conditions (FR4 material, thickness = 1.6mm or more) points if you do

not pay attention to the special. If you have a thin or thick board, FPC and stability of shape if not, back to the structural

changes in fixed to reduce the parasitic capacitance to charity is required.

●OK

NG example of wiring pattern

Other signal line

Ground line

Sensor line

www.rohm.com

2/13

2009.04 - Rev.B

BU21010MUV

Application Note

●SREF

electrode

1) In case SREF (reference electrode) has a same area as sensor electrode.

In case SREF electrode is placed on a surface of sensor electrode, it has to be placed with a certain distance from the

noise source and the finger contact influence. When it is placed on the back side of the sensor electrode surface, same

caution must be taken.

Most recommended configuration is to place it into middle layer which are covered by ground area (both front and back

side surface).

2) In case capacitor is used.

When a capacitor is used as a SREF (reference electrode), please place capacitor in the LSI component side as close as

possible. The selection of the capacitance value has to be determined by experiment/tuning. In a commonly used PCB

material (no middle connection components such as connectors), under 1 to 10pF is recommended. In conversion theory,

because the capacity value near the DC is expected and there is a calibration of the offset cancellation circuit, the

capacitor accuracy as well as the temperature characteristics can be satisfied with standard capacitor products.

●Calibration

There are 16 sensor ports in BU21010MUV able to use. In the BU21010MUV, Only even ports can calibrate difference of the

capacitance between the two sensors to correct. The odd ports will use a result of the even ports that executed calibration.

An ideal value of the 8bitADC that the calibration was executed is near to 128.

After calibration, the ADC value that first sense is an offset correction data and is kept in register OFFSET (4*h). An offset

value will be the difference between the offset correction data and center value 128.

The offset value will keep the ADC value center value 128 when the sensor was not touched.

Offset value = Offset correction data (4*h) - 128

If the offset correction data is less than 128, it is meaning SREF > SIN. (Gain x1)

If the offset correction data is more than 128, it is meaning SREF < SIN. (Gain x1)

As for the channel not corrected, the error margin of the offset correction value grows compared with the corrected channel.

Because correction value obtained with other channels is misappropriated.

Without exceeding the threshold value of turning on not moving at all can happen when this error margin is large.

1) The channel that doesn't do the calibration must be nearer IC than the channel that does the calibration.

2) SREF setting

The offset value of SIN1, 3, 5, 7, 9, 11, 13, 15(register address 40h – 4Fh) < 128

Adjust the highest one in SIN1 and SIN3, 5, 7, … SIN15 approach 128

Before calibration C vs. Digitized out

Saturated

Ideal

Smaller sensor (- offset)

Bigger sensor (+ offset)

Actual out of bigger sensor

Plus offset

Minus offset

www.rohm.com

3/13

2009.04 - Rev.B

Recommended Resources

Color TV brightness limiting circuit

STR51213 internal circuit diagram

Frequency-sensitive rheostat starting circuit controlled by slip rate

Adjustable gain amplifier circuit

Highly clear! Electric bicycle circuit diagram 2

Simple single-chip karaoke circuit

Journey to the West: Ten Outstanding Young People: 1. Sun Wukong is an outstanding representative of the first batch of pilots in Chinese history. After long-term hard training, Sun Wukong finally mastered the flying skills that have never been seen b...; 张无忌1987 Talking

Hybrid electric vehicles are expected to become the leading product in the automotive industry: Early development of hybrid electric vehicles Hybrid electric vehicles (HEV) are new models that have been developed before the ideal high-quality specific energy and mass-to-power vehicle power suppl...; frozenviolet Automotive Electronics

Comparison and discussion of data processing speed between LPC1768 and LPC54102: 1. Purpose: To compare the data processing speed of 1768 and 54102 at 100MHz 2. Data: posdata_sum = 0x0; for(i=6;i>0;i--) { posdata_sum += posdata_tmp; } posdata_avg = posdata_sum >> 4; posdata_um = p...; liuyuedeyu NXP MCU

Help! Can LaunchPad use USB BSL to download programs?: TI says G2553 has BSL, but I still don't understand it after reading the technical manual for a long time... Can anyone tell me how to use USB BSL to download programs for G2553? I have a BSL download...; southwolf1813 Microcontroller MCU

Share some explanations of #define definitions in the IAR 430 header file: I found several questions when reading the header file cc430x613x.h in RF_Example_Code_v1.0. First, let's look at the three #define examples in cc430x613x.h: #define DEFC(name, address) __no_init vola...; fish001 Microcontroller MCU

Warehouse temperature alarm system based on GD32---Serial port debugging: After getting the development board, download the official demo package and develop on MDK5.0. First install the plug-in, then load the required compilation library based on GD32F350 in KEIL. Prelimin...; yin_wu_qing GD32 MCU

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components