5962-87647012X datasheet, PDF - EEWORLD Datasheet

5962-87647012X: DescriptionHC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20; Categorylogic logic; File Size96KB，3 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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5962-87647012X Overview

HC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20

Parameter Name	Attribute value
Parts packaging code	QLCC
package instruction	QCCN,
Contacts	20
Reach Compliance Code	compliant
series	HC/UH
JESD-30 code	S-CQCC-N20
length	8.89 mm
Load capacitance (CL)	50 pF
Logic integrated circuit type	NAND GATE
Number of functions	4
Number of entries	2
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	OPEN-DRAIN
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum supply current (ICC)	0.04 mA
Prop。Delay @ Nom-Sup	190 ns
propagation delay (tpd)	155 ns
Certification status	Qualified
Filter level	MIL-STD-883
Maximum seat height	2.03 mm
Maximum supply voltage (Vsup)	6 V
Minimum supply voltage (Vsup)	2 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
width	8.89 mm
Base Number Matches	1

	5962-87647012X	5962-8764701CX
Description	HC/UH SERIES, QUAD 2-INPUT NAND GATE, CQCC20, CERAMIC, LCC-20	HC/UH SERIES, QUAD 2-INPUT NAND GATE, CDIP14, CERAMIC, DIP-14
Parts packaging code	QLCC	DIP
package instruction	QCCN,	DIP,
Contacts	20	14
Reach Compliance Code	compliant	compliant
series	HC/UH	HC/UH
JESD-30 code	S-CQCC-N20	R-GDIP-T14
Load capacitance (CL)	50 pF	50 pF
Logic integrated circuit type	NAND GATE	NAND GATE
Number of functions	4	4
Number of entries	2	2
Number of terminals	20	14
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
Output characteristics	OPEN-DRAIN	OPEN-DRAIN
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED
encapsulated code	QCCN	DIP
Package shape	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
Maximum supply current (ICC)	0.04 mA	0.04 mA
Prop。Delay @ Nom-Sup	190 ns	190 ns
propagation delay (tpd)	155 ns	155 ns
Certification status	Qualified	Qualified
Filter level	MIL-STD-883	MIL-STD-883
Maximum seat height	2.03 mm	5.08 mm
Maximum supply voltage (Vsup)	6 V	6 V
Minimum supply voltage (Vsup)	2 V	2 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	MILITARY	MILITARY
Terminal form	NO LEAD	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	8.89 mm	7.62 mm
Base Number Matches	1	1

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