If any questions arise whether to use the Rated Ambient Temperature” the Rated Terminal Part Temperature” your usage conditions, please give priority to the Rated
“
or “
in
“
Terminal Part Temperature”
.
For more details, please refer to Introduction of the derating curves based on the terminal part temperature” page 14 to 17.
The substrate of chip resistors is alumina. Cracks may occur at the connection of solder (solder fillet portion) due to the difference of the coefficient of thermal
expansion from a mounting board when heat stress like heat cycle, etc. are repeatedly given to them. Care should be taken to the occurrence of the cracks when
the change in ambient temperature or ON/OFF of load is repeated, especially when large types of W2H/W3A which have large thermal expansion and also self
heating. By general temperature cycle test using glass-epoxy (FR-4) boards under the maximum/minimum temperatures of operating temperature range, the crack
does not occur easily in the types of 1F〜2E, but the crack tends to occur in the types of W2H/W3A. The occurrence of the crack by heat stress may be
influenced by the size of a pad, solder volume, heat radiation of mounting board etc., so please pay careful attention to designing when a big change in ambient
temperature and conditions for use like ON/OFF of load can be assumed.
●
Care should be taken that RK73B1F may be damaged when static electricity occurs and is applied in the equipment assembly process.
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