0.5 mm Pitch, 6.18 mm Height, Vertical Mount, Shielded FFC High Speed Connectors
FH48 Series
Supports the next generation chip
V-by-One
®
HS* by THine
*High speed serial interface
technology for picture transmission
■Features
1. Accepts impedance matched shielded FFC
The FH48 Series is equipped with a ground
terminal and can be used with impedance matched,
shielded FFC.
●Inserting
FFC
2. Impedance matched terminal design
The signal terminal is designed for impedance
control and is capable of handling high speed
transmissions.
3. Highly reliable and secure structure
The design of the FH48 series follows in the
footsteps of another popular Hirose connector, the
FH40 series. The FFC positioning mechanism and
rugged structure combine to prevent accidental
unlocking and produce a secure connection.
●Lock
completed
4. Simplified operations with a flip lock system
The flip lock design allows a smoother simpler FFC
operation. It requires less force to rotate the
actuator and delivers a tactile click to reinforce that
the lock has secured the connection.
5. Suitable for automatic pick-n-place mounting
O f fe r e d i n t a p e a n d r e e l p a ck a g i n g t h a t i s
compatible with automatic machine mounting.
(1,000 pieces per reel)
6. Halogen free
All materials and substances used to produce this
product comply with Halogen-free standards.*Standards
by IEC 61249-2-21Br: 900ppm or lower, Cl: 900ppm or
lower, Br+Cl: 1,500ppm or lower
Click
●
Uses the same FFC that the FH41 Series
(horizontal connection) uses.
●Shielded
FFC
Signal connection area
FH48 and FH41 use
the same FFC layout.
FFC
Ground contact connection area
2013.11
1
FH48 Series●0.5 mm Pitch, 6.18 mm Height, Vertical Mount, Shielded FFC High Speed Connectors
■Product
specifications
Storage
Operating
Rated
-10 to +50°C (Note 3)
-40 to +85°C (Note 2)
0.5A (Note 1)
temperature range
temperature range
current
Rating
Relative humidity of
Rated
Operating humidity
Storage humidity
AC 50 Vrms
90% or lower (no dew
voltage
range
range
condensation)
Relative humidity of
90% or lower (no dew
condensation)
Applicable FPC and FFC terminal specifications
Items
1. Insulation resistance
2. Withstanding voltage
3. Contact resistance
4. Durability
t= 0.3 ±0.05, gold plating (GND plate: t= 0.5 ±0.05, tin plating)
Conditions
Measured at DC 100 V.
AC 150 Vrms applied for 1 minute
Measured at 1mA.
20 mating cycles
Frequency 10 to 55Hz with half amplitude 0.75mm
in 3 directions, 10 cycles each.
Acceleration: 981m/s , duration time: 6ms, With
half sine waves in 3 both directions, 3 times
each.
Left for 96 hours at temperature 40ç, humidity 90
to 95%
Temperature: -40
➝
+15 to +35
➝
+85
➝
+15 to +35ç
Time:
30
➝
2 to 3
➝
30
➝
2 to 3 min.
5 cycles in the above conditions
Reflow: Recommended temperature profile
Manual soldering: 350±5ç for 5 sec.
2
Specifications
Minimum of 500 Mø
No flashover or insulation damage
Maximum of 100 mø
*Incl. FFC conductor resistance
Contact resistance: Maximum of 100 mø
No damage, cracks or loose part.
No electrical discontinuity for more than 1µs
Contact resistance: Maximum of 100 mø
No damage, cracks or loose part.
No electrical discontinuity for more than 1µs
Contact resistance: Maximum of 100 mø
No damage, cracked or loose parts.
Contact resistance: Maximum of 100 mø
Insulation resistance: Minimum of 50 Mø
No damage, cracked or loose parts.
Contact resistance: Maximum of 100 mø
Insulation resistance: Minimum of 50 Mø
No damage, cracked or loose parts.
No external deformation or significant shaking
of terminal
5. Vibration resistance
6. Impact resistance
7. Humidity resistance
in ordinary conditions
8. Temperature cycle
9. Solder heat
resistance
(Note 1) Use 70% of the rated current for all the cores.
(Note 2) Including the temperature increase when the power is on.
(Note 3) Here, the storage means that unused products are stored before installed on a board for a long period of time.
For the products installed on a board with no power supplied, the operating temperature and humidity ranges shall be
applied.
■Materials
Parts
Insulating parts
Terminal
Lock metal parts
Materials
LCP
Phosphor bronze
Phosphor bronze (plating material)
Color/finishing
Gray
Black
Gold plating
Pure tin reflow plating
Nickel plating
−
Remarks
UL94V-0
■Product
number structure
Refer to this page when determining product specifications by model types. Please place orders with part numbers listed in
this catalog. The characteristics and specifications of the product described in this catalog are reference values. Please
make sure to check the latest delivery specifications at the time of product use.
FH 48 − 50S − 0.5 SV
❶
❷
❸
❹
❺
❶
Series name: FH
❷
Series number: 48
❸
Number of contacts: 20 to 68
❹
Contact pitch: 0.5 mm
❺
Terminal shape
SV···SMT vertical implementation type
2
FH48 Series●0.5 mm Pitch, 6.18 mm Height, Vertical Mount, Shielded FFC High Speed Connectors
■Connector
dimension diagram
(6.47)
(4.1)
(A)
B
(1.6)
(9
(0.12)
2.5
0°
)
1
(2.31)
(0.12)
(C)
D
E
0.5
Locked
No. of contacts
Cavity no. indication
1.18
4.7
Note 1. The flatness of the terminal and the metal lead is 0.1 MAX.
2. This product is emboss packaged. For details, see the package specification diagram on page 6.
3. Black marks may appear in the mold resin, but they will not negatively affect the performance of
these connectors.
4. The color of the plating may change after the reflow process, but it will not negatively affect the
performance of these connectors.
■Connector
dimension table
Product number
FH48-20S-0.5SV
FH48-21S-0.5SV
FH48-31S-0.5SV
FH48-40S-0.5SV
FH48-50S-0.5SV
FH48-68S-0.5SV
HRS No.
CL580-3104-1-00
CL580-3103-9-00
CL580-3102-6-00
CL580-3100-0-00
CL580-3101-3-00
CL580-3105-4-00
Number of contacts
20
21
31
40
50
68
Number of ground contacts
4
4
6
8
10
13
A
10.57
11.07
16.07
20.57
25.57
34.57
B
7.5
7.5
12.5
17.5
22.5
30
C
8.37
8.87
10.37
10.37
10.37
10.37
D
9.5
10
15
19.5
24.5
33.5
(1.48)
0.75
Unit: mm
E
15
15.5
20.5
25
30
39
(Note 1) This product is packaged on tape and reel and is only sold in full reel quantities of 1,000 pieces per reel. Please place
orders by full reel quantities.
(3.47)
(5.32)
6.68
6.18
3
FH48 Series●0.5 mm Pitch, 6.18 mm Height, Vertical Mount, Shielded FFC High Speed Connectors
BRecommended
land and metal mask dimension diagram
BRecommended
FFC dimension diagram
F±0.1
G±0.07
D±0.05
0.5±0.05
0.3±0.03
17.7MAX
5.5MIN
2.6±0.5
2.1±0.5
0.5±0.1
R0
.2±
2-
0.1
R0
.2±
0.1
2-
0.5±0.1
1.9±0.1
2.6±0.1
3.8±0.1
0.5±0.05(Ground plate thickness)
0.3±0.05(End conductor thickness)
0.1MIN
Ground plate
1
2-R
0.2
2-R0
.2
MAX
MA
X
Shielded area
Note
: Place the shielded area on the ground plate.
BRecommended
land, metal mask and FFC dimension table
Unit: mm
Product number
FH48-20S-0.5SV
FH48-21S-0.5SV
FH48-31S-0.5SV
FH48-40S-0.5SV
FH48-50S-0.5SV
FH48-68S-0.5SV
HRS No.
CL580-3104-1-00
CL580-3103-9-00
CL580-3102-6-00
CL580-3100-0-00
CL580-3101-3-00
CL580-3105-4-00
Number of contacts Number of ground contacts
20
21
31
40
50
68
4
4
6
8
10
13
B
7.5
7.5
12.5
17.5
22.5
30
D
9.5
10
15
19.5
24.5
33.5
F
11.7
12.2
17.2
21.7
26.7
35.7
G
10.5
11
16
20.5
25.5
34.5
4
5.5MIN
FH48 Series●0.5 mm Pitch, 6.18 mm Height, Vertical Mount, Shielded FFC High Speed Connectors
BFH48
Series FFC material structure (recommended specifications)
Material name
Shielding Material
Materials
Total Thickness at Total Thickness at
Ground Plate (μm) End Conductor (μm)
Shielded area
Conductive Adhesive
Copper Foil (Tin plating)
Adhesive
Polyester Type
70
Acrylic Type
Polyester Type
Acrylic Type
Polyester Type
Polyester Type
24
12
24
25
35
35
Polyester Type
Polyester Type
Polyester Type
Polyester Type
Total
35
25
30
188
503
35
35
25
30
188
313
Ground plate
Base Film
Adhesive
Insulation Layer
Adhesive
Soft Copper Foil
(Nickel Under Plating + Gold Plating)
Adhesive
Insulator Layer
Shielded area
Adhesive
Stiffener
Contact
us to change this specifications and thickness configuration.
BTemperature
profile
MAX 250ç
250
230ç
200
200ç
150
150ç
Application conditions
Reflow type
: Reflow with far-infrared ray and hot
air combined
Reflow furnace atmosphere : Air
Solder
: Cream type Sn/3.0Ag/0.5Cu
(Senju Metal Industry, M705-221CM5-42-10.5)
Test board
: Board material and size
Glass epoxy 25x55x1.0mm
Land dimension 0.3x1.63, 0.3x1.2 mm
Metal mask
: Thickness 0.12 mm
Opening dimensions 0.28x1.21, 0.28x0.9 mm
This solder profile is based on the conditions provided
above.
Please check the mounting conditions before use,
conditions such as solder paste types, manufacturer,
PCB size and any other soldering materials may alter
the performance of such materials.
Temperature (ç)
100
50
25ç
(60 sec.)
0
Start
Time (sec.)
90 to 120 sec.
Pre-heat time
(60 sec.)
Soldering time
5
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