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PATT1206E11R0DGTS

Description
Fixed Resistor, Thin Film, 0.4W, 11ohm, 200V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size90KB,4 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

PATT1206E11R0DGTS Overview

Fixed Resistor, Thin Film, 0.4W, 11ohm, 200V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 1206, CHIP

PATT1206E11R0DGTS Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid262258151
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.9
Other featuresANTI-SULFUR, LASER TRIMMABLE, PRECISION
structureRectangular
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature250 °C
Minimum operating temperature-55 °C
Package height0.381 mm
Package length3.2 mm
Package formSMT
Package width1.6 mm
method of packingTR
Rated power dissipation(P)0.4 W
Rated temperature155 °C
GuidelineAEC-Q200
resistance11 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage200 V
PATT
www.vishay.com
Vishay Dale Thin Film
Precision Automotive High Temperature (155 °C at Full
Rated Power) Thin Film Chip Resistor, AEC-Q200 Qualified
FEATURES
• Resistance range: 1.0
Ω
to 1 MΩ
• AEC-Q200 qualified, table 7F
• AEC-Q200 qualified, ESD rated class 1C
(< 1 kΩ: 1 kV; > 1 kΩ: 2 kV)
• Laser trimmed to any value
• Intrinsic moisture protected resistor element
• Moisture resistant to MIL-STD-202, method 106
LINKS TO ADDITIONAL RESOURCES
Infographics
The terminations consist of an adhesion layer, a leach
resistant nickel barrier and gold plating compatible with high
temperature solder systems.
CONSTRUCTION
Passivation
Tantalum Nitride
Resistive Film
Gold
Nickel Barrier
High Purity
Alumina Substrate
Adhesion Layer
Tantalum nitride resistor film on alumina substrate
100 % visual inspected per MIL-PRF-55342
Laser-trimmed tolerances to ± 0.1 %
Load life stability 0.2 % at 1000 h at 155 °C and 100 %
rated power
• Very low noise and voltage coefficient
(< -30 dB, < 0.1 ppm/V)
• Sulfur resistant (per ASTM B809-95 humid vapor test)
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
TYPICAL PERFORMANCE
ABSOLUTE
TCR
TOL.
25
0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Resistance Range
TCR: Absolute
Tolerance: Absolute
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
(1)
Noise
Shelf Life Stability: Absolute
Note
(1)
Storage temperature rating is for device only
SPECIFICATIONS
Tantalum nitride
1.0
Ω
to 1 MΩ
± 25 ppm/°C to ± 100 ppm/°C
± 0.1 % to ± 1.0 %
± 0.2 %
Not applicable
Less than 0.1 ppm/V
75 V
-55 °C to +250 °C
-55 °C to +250 °C
< -30 dB
100 ppm
CONDITIONS
-
-
-55 °C to +175 °C
+25 °C
1000 h at 155 °C and 100 % rated power
-
-
-
-
-
-
1 year at 25 °C
COMPONENT RATINGS
CASE SIZE
0402
0603
0805
1206
Revision: 08-Mar-2021
POWER RATING (mW)
50
150
200
400
WORKING VOLTAGE (V)
75
75
100
200
RESISTANCE RANGE (Ω)
1.5 to 51K
2.75 to 120K
2.75 to 301K
1.0 to 1M
Document Number: 60124
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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