EEWORLDEEWORLDEEWORLD

Part Number

Search

AQ11EMR50DA1RE

Description
Ceramic Capacitor, Multilayer, Ceramic, 150V, 100% +Tol, 100% -Tol, 90+/-20ppm/Cel TC, 0.0000005uF, Surface Mount, 0606, CHIP
CategoryPassive components    capacitor   
File Size624KB,4 Pages
ManufacturerAVX
Environmental Compliance  
Download Datasheet Parametric View All

AQ11EMR50DA1RE Overview

Ceramic Capacitor, Multilayer, Ceramic, 150V, 100% +Tol, 100% -Tol, 90+/-20ppm/Cel TC, 0.0000005uF, Surface Mount, 0606, CHIP

AQ11EMR50DA1RE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1670482046
package instruction, 0606
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL8.1
capacitance5e-7 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
high0.979 mm
JESD-609 codee4
length1.4 mm
Manufacturer's serial numberAQ
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance100%
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Package formSMT
method of packingTR, EMBOSSED, 13 INCH
positive tolerance100%
Rated (DC) voltage (URdc)150 V
seriesAQ
size code0606
surface mountYES
Temperature Coefficient90+/-20ppm/Cel ppm/°C
Terminal surfacePalladium/Silver (Pd/Ag)
Terminal shapeWRAPAROUND
width1.4 mm
Microwave MLC’s
AQ Series
These porcelain and ceramic dielectric multilayer capacitor
(MLC) chips are best suited for RF/ Microwave applications
typically ranging from 10 MHz to 4.2 GHz. Characteristic is a
fine grained, high density, high purity dielectric material imper-
vious to moisture with heavy internal palladium electrodes.
These characteristics lend well to applications requiring:
1) high current carrying capabilities;
2) high quality factors;
3) very low equivalent series resistance;
4) very high series resonance;
5) excellent stability under stresses of changing volt-
age, frequency, time and temperature.
MECHANICAL DIMENSIONS:
W
T
L
inches (millimeters)
Width (W)
.055±.015
(1.40±.381)
.055±.015
(1.40±.381)
.110±.020
(2.79±.508)
.110±.010
(2.79±.508)
Case
AQ11
AQ12
Length (L)
.055±.015
(1.40±.381)
.055 + .015 - .010
(1.40+ .381 - .254)
.110±.020
(2.79±.508)
.110 + .020 - .010
(2.79 +.889 -.254)
Thickness (T)
.020/.057
(.508/1.45)
.020/.057
(.508/1.45)
.030/.102
(.762/2.59)
.030/.102
(.762/2.59)
Band Width (bw)
.010 + .010 -.005
(.254 +.254 -.127)
.010 + .010 -.005
(.254 +.254 -.127)
.015±.010
(.381±.254)
.015±.010
(.381±.254)
A 1J
10
bw
AQ13
AQ14
HOW TO ORDER
AQ
11
E
M
100
J
A
1
ME
Case
Size
AVX Style
AQ11, AQ12,
AQ13, AQ14
(See Chart)
Capacitance
Voltage
Code
5 = 50V
1 = 100V
E = 150V
2 = 200V
9 = 300V
7 = 500V
EIA Capacitance Code in pF.
First two digits = significant
figures or “R” for decimal
place.
Third digit = number of zeros
or after “R” significant figures.
Failure Rate
Code
A = Not
Applicable
Packaging*
Code
3A = 13" Reel Unmarked
ME = 7" Reel Marked
RE = 13" Reel Marked
WE = Waffle Pack Marked
BE = Bulk Marked
Temperature
Coefficient Code
M = +90±20ppm/°C (AQ11/12/13/14)
A = 0±30ppm/°C (AQ11/12/13/14)
C = 15% (“J” Termination only) (AQ12/14)
Capacitance
Tolerance
Code
B = ±.1 pF
C = ±.25 pF
D = ±.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
N = ±30%
Termination
Style Code
1 = Pd/Ag (AQ11/13 only)
7 = Ag/Ni/Au (AQ11/13 only)
J = Nickel Barrier Sn/Pb
(60/40) - (AQ12/14 only)
T = 100% Tin (AQ12/14 only)
9
PACKAGING
Standard Packaging = Waffle Pack (maximum quantity is 80)
Not RoHS Compliant
TAPE & REEL:
All tape and reel specifications are in compliance with EIA RS481
(equivalent to IEC 286 part 3).
LEAD-FREE COMPATIBLE
COMPONENT
Sizes SQCA through SQCB, CDR11/12 through 13/14.
—8mm carrier
—7" reel: ≤0.040" thickness = 2000 pcs
≤0.075" thickness = 2000 pcs
—13" reel: ≤0.075" thickness = 10,000 pcs
For RoHS compliant products,
please select correct termination style.
156
Capacitive Touch in Industrial HMI
[align=left][color=#000]In industrial applications, mechanical buttons on sensor nodes, industrial instruments and control panels can easily become covered in dust, which can eventually lead to equipm...
maylove Analogue and Mixed Signal
[TI's first low-power design competition] Let the development board speak
The board is back, I soldered it these days, and it made sound today, but it also has a disadvantage that the power amplifier consumes power, and the sound is not very good when using USB. I used the ...
ddllxxrr Microcontroller MCU
Strange behavior of EnumPrinterDrivers
BOOL ret; ret = EnumPrinterDrivers(NULL, NULL, 1, NULL, 0, &dwNeeded, &dwReturned); The return value is 1, but dwNeeded is 0 and dwReturned is also 0. Does anyone know what is going on?...
pansq Embedded System
Infant and child monitoring system【2014-3-23】
[i=s]This post was last edited by xiaofeng916636 on 2014-3-24 00:52[/i] The following is a rough block diagram of this solution:...
啸风916636 DSP and ARM Processors
You can come in and discuss the use of various modulation methods.
For example, what kind of modulation is used in what occasions, what are the advantages and disadvantages, for example, why does GSM use GMSK, etc. You can also talk about the knowledge of constellati...
flyingdsp RF/Wirelessly
vxWorks creates a hard disk using dosFs files - Asking for advice
Because I am writing an application for network file transfer recently, the application needs to realize file transfer between Windows XP and vxWorks. Because I am a beginner in this area, I have enco...
gga Real-time operating system RTOS

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2552  2376  2405  535  2598  52  48  49  11  53 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号