54170FMQB datasheet, PDF - EEWORLD Datasheet

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54170FMQB: DescriptionIC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM; Categorystorage storage; File Size94KB，4 Pages; ManufacturerNational Semiconductor（TI ）; Websitehttp://www.ti.com

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54170FMQB Overview

IC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM

54170FMQB Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	National Semiconductor（TI ）
package instruction	CERAMIC, FP-16
Reach Compliance Code	unknown
ECCN code	3A001.A.2.C
Maximum access time	40 ns
JESD-30 code	R-GDFP-F16
JESD-609 code	e0
length	9.6645 mm
memory density	16 bit
Memory IC Type	STANDARD SRAM
memory width	4
Number of functions	1
Number of ports	1
Number of terminals	16
word count	4 words
character code	4
Operating mode	ASYNCHRONOUS
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
organize	4X4
Output characteristics	OPEN-COLLECTOR
Exportable	NO
Package body material	CERAMIC, GLASS-SEALED
encapsulated code	DFP
Encapsulate equivalent code	FL16,.3
Package shape	RECTANGULAR
Package form	FLATPACK
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	5 V
Certification status	Not Qualified
Filter level	38535Q/M;38534H;883B
Maximum seat height	2.032 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	TTL
Temperature level	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	FLAT
Terminal pitch	1.27 mm
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
width	6.604 mm
Base Number Matches	1

54170FMQB Related Products

	54170FMQB	54170DMQB
Description	IC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM	IC 4 X 4 STANDARD SRAM, 40 ns, CDIP16, CERAMIC, DIP-16, Static RAM
Is it Rohs certified?	incompatible	incompatible
Maker	National Semiconductor（TI ）	National Semiconductor（TI ）
package instruction	CERAMIC, FP-16	CERAMIC, DIP-16
Reach Compliance Code	unknown	unknown
ECCN code	3A001.A.2.C	3A001.A.2.C
Maximum access time	40 ns	40 ns
JESD-30 code	R-GDFP-F16	R-GDIP-T16
JESD-609 code	e0	e0
length	9.6645 mm	19.43 mm
memory density	16 bit	16 bit
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	4	4
Number of functions	1	1
Number of ports	1	1
Number of terminals	16	16
word count	4 words	4 words
character code	4	4
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	125 °C	125 °C
Minimum operating temperature	-55 °C	-55 °C
organize	4X4	4X4
Output characteristics	OPEN-COLLECTOR	OPEN-COLLECTOR
Exportable	NO	NO
Package body material	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED
encapsulated code	DFP	DIP
Encapsulate equivalent code	FL16,.3	DIP16,.3
Package shape	RECTANGULAR	RECTANGULAR
Package form	FLATPACK	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED
power supply	5 V	5 V
Certification status	Not Qualified	Not Qualified
Filter level	38535Q/M;38534H;883B	38535Q/M;38534H;883B
Maximum seat height	2.032 mm	5.08 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	TTL	TTL
Temperature level	MILITARY	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	FLAT	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	DUAL	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED
width	6.604 mm	7.62 mm
Base Number Matches	1	1

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