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54170FMQB

Description
IC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM
Categorystorage    storage   
File Size94KB,4 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
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54170FMQB Overview

IC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM

54170FMQB Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerNational Semiconductor(TI )
package instructionCERAMIC, FP-16
Reach Compliance Codeunknown
ECCN code3A001.A.2.C
Maximum access time40 ns
JESD-30 codeR-GDFP-F16
JESD-609 codee0
length9.6645 mm
memory density16 bit
Memory IC TypeSTANDARD SRAM
memory width4
Number of functions1
Number of ports1
Number of terminals16
word count4 words
character code4
Operating modeASYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize4X4
Output characteristicsOPEN-COLLECTOR
ExportableNO
Package body materialCERAMIC, GLASS-SEALED
encapsulated codeDFP
Encapsulate equivalent codeFL16,.3
Package shapeRECTANGULAR
Package formFLATPACK
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply5 V
Certification statusNot Qualified
Filter level38535Q/M;38534H;883B
Maximum seat height2.032 mm
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)4.5 V
Nominal supply voltage (Vsup)5 V
surface mountYES
technologyTTL
Temperature levelMILITARY
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width6.604 mm
Base Number Matches1

54170FMQB Related Products

54170FMQB 54170DMQB
Description IC 4 X 4 STANDARD SRAM, 40 ns, CDFP16, CERAMIC, FP-16, Static RAM IC 4 X 4 STANDARD SRAM, 40 ns, CDIP16, CERAMIC, DIP-16, Static RAM
Is it Rohs certified? incompatible incompatible
Maker National Semiconductor(TI ) National Semiconductor(TI )
package instruction CERAMIC, FP-16 CERAMIC, DIP-16
Reach Compliance Code unknown unknown
ECCN code 3A001.A.2.C 3A001.A.2.C
Maximum access time 40 ns 40 ns
JESD-30 code R-GDFP-F16 R-GDIP-T16
JESD-609 code e0 e0
length 9.6645 mm 19.43 mm
memory density 16 bit 16 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
memory width 4 4
Number of functions 1 1
Number of ports 1 1
Number of terminals 16 16
word count 4 words 4 words
character code 4 4
Operating mode ASYNCHRONOUS ASYNCHRONOUS
Maximum operating temperature 125 °C 125 °C
Minimum operating temperature -55 °C -55 °C
organize 4X4 4X4
Output characteristics OPEN-COLLECTOR OPEN-COLLECTOR
Exportable NO NO
Package body material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
encapsulated code DFP DIP
Encapsulate equivalent code FL16,.3 DIP16,.3
Package shape RECTANGULAR RECTANGULAR
Package form FLATPACK IN-LINE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V
Certification status Not Qualified Not Qualified
Filter level 38535Q/M;38534H;883B 38535Q/M;38534H;883B
Maximum seat height 2.032 mm 5.08 mm
Maximum supply voltage (Vsup) 5.5 V 5.5 V
Minimum supply voltage (Vsup) 4.5 V 4.5 V
Nominal supply voltage (Vsup) 5 V 5 V
surface mount YES NO
technology TTL TTL
Temperature level MILITARY MILITARY
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form FLAT THROUGH-HOLE
Terminal pitch 1.27 mm 2.54 mm
Terminal location DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED
width 6.604 mm 7.62 mm
Base Number Matches 1 1
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