LD13HA510JAX1A datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> LD13HA510JAX1A

LD13HA510JAX1A: DescriptionCeramic Capacitor, Multilayer, Ceramic, 3000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000051uF, Surface Mount, 1825, CHIP; CategoryPassive components capacitor; File Size59KB，2 Pages; ManufacturerAVX

Download Datasheet Parametric View All

LD13HA510JAX1A Overview

Ceramic Capacitor, Multilayer, Ceramic, 3000V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.000051uF, Surface Mount, 1825, CHIP

LD13HA510JAX1A Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Objectid	1852944416
package instruction	, 1825
Reach Compliance Code	not_compliant
ECCN code	EAR99
YTEOL	7.68
capacitance	0.000051 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	2.54 mm
JESD-609 code	e0
length	4.5 mm
Manufacturer's serial number	LD13
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	5%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, 7 INCH
positive tolerance	5%
Rated (DC) voltage (URdc)	3000 V
series	LD(HIGH VOLTAGE)
size code	1825
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	30ppm/Cel ppm/°C
Terminal surface	Tin/Lead (Sn/Pb)
Terminal shape	WRAPAROUND
width	6.4 mm

Preview

Download Datasheet

View All

High Voltage MLC Chips

Tin/Lead Termination “B”

For 600V to 5000V Applications

AVX Corporation will support those customers for commercial and military

Multilayer Ceramic Capacitors with a termination consisting of 5% minimum

lead. This termination is indicated by the use of a “B” in the 12th position of the

AVX Catalog Part Number. This fulfills AVX’s commitment to providing a full

range of products to our customers. AVX has provided in the following pages, a

full range of values that we are offering in this “B” termination.

Larger physical sizes than normally encountered chips are used to make high

voltage MLC chip product. Special precautions must be taken in applying these

chips in surface mount assemblies. The temperature gradient during heating or

cooling cycles should not exceed 4ºC per second. The preheat temperature must

be within 50ºC of the peak temperature reached by the ceramic bodies through

the soldering process. Chip sizes 1210 and larger should be reflow soldered only.

Capacitors may require protective surface coating to prevent external arcing.

For 1825, 2225 and 3640 sizes, AVX offers leaded version in either thru-hole or

SMT configurations (for details see section on high voltage leaded MLC chips).

NEW 630V RANGE

HOW TO ORDER

LD08

271

Capacitance Code

(2 significant digits

+ no. of zeros)

Examples:

10 pF = 100

100 pF = 101

1,000 pF = 102

22,000 pF = 223

220,000 pF = 224

1 μF = 105

Capacitance

Tolerance

C0G: J = ±5%

K = ±10%

M = ±20%

X7R: K = ±10%

M = ±20%

Z = +80%, -20%

Voltage

Temperature

AVX

600V/630V = C

Coefficient

Style

1000V = A

C0G = A

LD05 - 0805

1500V = S

X7R = C

LD06 - 1206

2000V = G

LD10 - 1210

2500V = W

LD08 - 1808

3000V = H

LD12 - 1812

4000V = J

LD13 - 1825

5000V = K

LD20 - 2220

LD14 - 2225

LD40 - 3640

***

Test

Termination

Packaging Special Code

Level

B = 5% Min Pb 1 = 7" Reel** A = Standard

A = Standard X = FLEXITERM

3 = 13" Reel

with 5% min. 9 = Bulk

Pb*

Notes: Capacitors with X7R dielectrics are not intended for applications across AC supply mains or AC line filtering with polarity reversal. Contact plant for recommendations.

Contact factory for availability of Termination and Tolerance options for Specific Part Numbers.

FLEXITERM is not available in the LD40 Style

The LD40 Style is not available on 7" Reels.

***

AVX offers nonstandard chip sizes. Contact factory for details.

Not RoHS Compliant

DIMENSIONS

SIZE

(L) Length

millimeters (inches)

LD05 (0805)

LD06 (1206)

LD10* (1210) LD08* (1808) LD12* (1812) LD13* (1825) LD20* (2220) LD14* (2225) LD40* (3640)

2.01 ± 0.20

3.20 ± 0.20

4.57 ± 0.25

4.50 ± 0.30

5.70 ± 0.40

5.72 ± 0.25

9.14 ± 0.25

(0.079 ± 0.008) (0.126 ± 0.008) (0.126 ± 0.008) (0.180 ± 0.010) (0.177 ± 0.012) (0.177 ± 0.012) (0.224 ± 0.016) (0.225 ± 0.010) (0.360 ± 0.010)

(W) Width

1.25 ± 0.20

1.60 ± 0.20

2.50 ± 0.20

2.03 ± 0.25

3.20 ± 0.20

6.40 ± 0.30

5.00 ± 0.40

6.35 ± 0.25

10.2 ± 0.25

(0.049 ±0.008) (0.063 ± 0.008) (0.098 ± 0.008) (0.080 ± 0.010) (0.126 ± 0.008) (0.252 ± 0.012) (0.197 ± 0.016) (0.250 ± 0.010) (0.400 ± 0.010)

(T) Thickness

1.30

1.52

1.70

2.03

2.54

3.30

2.54

Max.

(0.051)

(0.060)

(0.067)

(0.080)

(0.100)

(0.130)

(0.100)

(t) terminal min. 0.50 ± 0.25

0.25 (0.010)

0.76 (0.030)

max. (0.020 ± 0.010) 0.75 (0.030)

0.75 (0.030)

1.02 (0.040)

1.52 (0.060)

* Reflow soldering only.

Performance of SMPS capacitors can be simulated by downloading SpiCalci software program -

http://www.avx.com/SpiApps/default.asp#spicalci

Custom values, ratings and configurations are also available.

104

Recommended Resources

Simple transceiver external microphone circuit

Triple voltage rectifier circuit

IR2167 ballast integrated circuit

555 simple color TV additional remote control circuit

4-way signal alternate display circuit

Temperature measurement circuit using operational amplifier as differential amplifier

Run program from internal flash: Downloaded from the TI website, it tells you how to write the flash CMD file, copy it from the internal falsh to RAM, and burn the program!...; gaoxiao Microcontroller MCU

I'm going to post a little game for everyone to play, maybe you can win a prize: Fluke's prize game [url=http://65.fluke.com.cn/game/?utm_source=FlukeEDM201307]http://65.fluke.com.cn/game/?utm_source=FlukeEDM201307[/url] I ended up killing myself. It took too long and was too tiri...; wangfuchong Talking

MEMS: Packaging is a difficult point and standard process is expected: 据预测，2007年全球MEMS(微机电系统)市场的销售额将达到190亿美元，2009年市场规模将增至260亿美元。2006年，全球MEMS市场继续保持增长，各主要市场都已经接受MEMS技术和产品，其中应用于通信产业的产品的复合年增长率超过60%。然而，与IC产业不同的是，由于应用面极广且定制化程度较高导致难以采用标准工艺，在MEMS产业的发展过程中，产品的封装成为阻碍产业发展的一大瓶颈，MEMS市...; PCB Design

Shenma Hardware Interpretation, let's join in the fun activity: Are you interested in such activities? Welcome experts from all walks of life to sign up to become members of the expert group, and welcome everyone to participate actively. :victory: [b]Hardware Inte...; 安_然 Discrete Device

Zhejiang University 2009 Electronic Competition Training Materials.rar: [i=s]This post was last edited by paulhyde on 2014-9-15 04:13[/i] Zhejiang University 2009 Electronic Competition Training Materials.rar...; dtcxn Electronics Design Contest

Question: STEPLDR reads FLASH block error?: I first burned STEPLDR.NB1 at block 0, and the serial port print output was normal after startup; but after burning eboot.nb0, an error message was printed: ECC ERROR block 0x00000002 page 0x00000000,...; 请求权 Embedded System

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components