|
SCAN90CP02SP |
SCAN90CP02VY |
| Description |
Analog & Digital Crosspoint ICs |
Analog & Digital Crosspoint ICs |
| Is it lead-free? |
Contains lead |
Contains lead |
| Is it Rohs certified? |
incompatible |
incompatible |
| Maker |
Texas Instruments |
Texas Instruments |
| Parts packaging code |
QFN |
QFP |
| package instruction |
HVQCCN, LCC28,.2SQ,20 |
LQFP, QFP32,.35SQ,32 |
| Contacts |
28 |
32 |
| Reach Compliance Code |
not_compliant |
compliant |
| Other features |
CONFIGURABLE AS 2:1 MUX OR 1:2 SPLITTER |
CONFIGURABLE AS 2:1 MUX OR 1:2 SPLITTER |
| Analog Integrated Circuits - Other Types |
CROSS POINT SWITCH |
CROSS POINT SWITCH |
| JESD-30 code |
S-PQCC-N28 |
S-PQFP-G32 |
| length |
5 mm |
7 mm |
| Number of channels |
2 |
2 |
| Number of functions |
1 |
1 |
| Number of terminals |
28 |
32 |
| Maximum operating temperature |
85 °C |
85 °C |
| Minimum operating temperature |
-40 °C |
-40 °C |
| output |
SEPARATE OUTPUT |
SEPARATE OUTPUT |
| Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| encapsulated code |
HVQCCN |
LQFP |
| Encapsulate equivalent code |
LCC28,.2SQ,20 |
QFP32,.35SQ,32 |
| Package shape |
SQUARE |
SQUARE |
| Package form |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
FLATPACK, LOW PROFILE |
| Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
260 |
| power supply |
3.3 V |
3.3 V |
| Certification status |
Not Qualified |
Not Qualified |
| Maximum seat height |
0.6 mm |
1.6 mm |
| Maximum supply voltage (Vsup) |
3.6 V |
3.6 V |
| Minimum supply voltage (Vsup) |
3 V |
3 V |
| Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
| surface mount |
YES |
YES |
| Maximum disconnect time |
12 ns |
12 ns |
| Maximum connection time |
150 ns |
150 ns |
| switch |
BREAK-BEFORE-MAKE |
BREAK-BEFORE-MAKE |
| technology |
CMOS |
CMOS |
| Temperature level |
INDUSTRIAL |
INDUSTRIAL |
| Terminal form |
NO LEAD |
GULL WING |
| Terminal pitch |
0.5 mm |
0.8 mm |
| Terminal location |
QUAD |
QUAD |
| Maximum time at peak reflow temperature |
NOT SPECIFIED |
40 |
| width |
5 mm |
7 mm |