S-S
ERIES
U
LTRA
-L
OW
ESR C
APACITORS
K
EY
F
EATURES
• RoHS Compliant
• Lowest available ESR
• Custom Values & Tolerances Available
• Self Resonant Frequencies to 25.0 GHz
Dielectric
RF Performance
S Series
BEST
C Series BETTER
L Series BETTER
NPO
?
• Lead Free Terminations Standard (“V” Code)
• Sn/Pb Terminations Optional (“T” Code)
• Free MLCSoft® for SPICE & S-Parameter Modeling Data
A
PPLICATIONS
• Base station Products
• Wireless LAN
• RF Integrated Circuits
• Portable Wireless Products
• Cable Components
• RF Matching Networks
• Decoupling, By-pass, DC Blocking
A
VAILABLE
C
APACITANCE
S
ELECTION
R07 / 0402 (1005)
Inches
(mm)
Length
.040 ±.004
(1.02 ±0.1)
Width
.020 ±.004
(0.51 ±0.1)
Thickness
.020 ±.004
(0.51 ±0.1)
End Band
.010 ±.006
(0.25 ±.15)
L
E/B
W
50 VDC
25 V
25 V
0.2
p
0.3 F
p
0.4 F
p
0.5 F
p
0.6 F
p
0.7 F
p
0.8 F
p
0.9 F
p
1.0 F
p
1.1 F
pF
1.2
p
1.3 F
p
1.5 F
p
1.8 F
pF
2.0
p
2.2 F
p
2.4 F
p
2.7 F
pF
3.0
p
3.3 F
pF
3.6
p
3.9 F
p
4.3 F
p
4.7 F
pF
5.1
p
5.6 F
p
6.2 F
p
6.8 F
pF
7.5
p
8.2 F
pF
9.1
p
10 F
pF
11
p
12 F
p
13 F
pF
15
p
16 F
p
18 F
p
20 F
pF
22
p
24 F
pF
27
p
30 F
p
33 F
pF
T
R14 / 0603 (1608)
Inches
(mm)
Length
.062 ±.006
(1.57 ±0.15)
Width
.032 ±.006
(0.81 ±0.15)
Thickness
.030 +.005 -.003
(0.76 +.13-.08)
End Band
.014 ±.006
(0.35 ±.15)
R15 / 0805 (2012)
Selection charts represents basic C/V capability in this series. Please contact the factory for capacitance, voltage, case size combinations not shown.
6
0.3
p
0.5 F
p
0.7 F
p
0.9 F
p
1.0 F
p
1.1 F
pF
1.2
p
1.3 F
p
1.5 F
p
1.8 F
pF
2.0
p
2.2 F
p
2.4 F
p
2.7 F
pF
3.0
p
3.3 F
pF
3.6
p
3.9 F
pF
4.3
p
4.7 F
pF
5.1
p
5.6 F
p
6.2 F
p
6.8 F
pF
7.5
p
8.2 F
pF
9.1
p
10 F
pF
11
p
12 F
p
13 F
pF
15
p
16 F
p
18 F
p
20 F
pF
22
p
24 F
pF
27
p
30 F
pF
33
p
36 F
pF
39
p
43 F
p
47 F
p
56 F
p
68 F
p
82 F
p
10 F
0p
12 F
0
15 pF
0
18 pF
0
22 pF
0p
F
0.2
p
0.3 F
p
0.4 F
p
0.5 F
p
0.6 F
p
0.7 F
p
0.8 F
p
0.9 F
p
1.0 F
p
1.1 F
pF
1.2
p
1.3 F
p
1.5 F
p
1.8 F
pF
2.0
p
2.2 F
pF
2.4
p
2.7 F
pF
3.0
p
3.3 F
pF
3.6
p
3.9 F
p
4.3 F
p
4.7 F
pF
5.1
p
5.6 F
pF
6.2
p
6.8 F
pF
7.5
p
8.2 F
pF
9.1
p
10 F
pF
11
p
12 F
p
13 F
pF
15
p
16 F
pF
18
p
20 F
pF
22
p
24 F
pF
27
p
30 F
p
33 F
p
36 F
pF
39
p
43 F
pF
47
p
56 F
p
68 F
p
82 F
p
10 F
0p
F
250 VDC
Inches
(mm)
Length
.080 ±.008
(2.03 ±0.20)
Width
.050 ±.008
(1.27 ±0.20)
Thickness
.040 ±.006
(1.02 ±.15)
End Band
.020 ±.010
(0.50 ±.25)
250 VDC
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D
IELECTRIC
C
HARACTERISTICS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR:
INSULATION RESISTANCE:
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
0 ± 30ppm /°C, -55 to 125°C
2,500 min.,10,000 typical
>10 G @ 25°C,WVDC;
125°C IR is 10% of 25°C rating.
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
Size 0402:
Size 0603:
Size 0805:
0.2 - 33 pF
0.2 - 100 pF
0.3 - 220 pF
Frequency (GHz)
10.0
25.0
R07/0402
R14/0603
Typical Series Resonant Frequency
1.0
0.5
0.1
1
Capacitance (pF)
10
100
M
ECHANICAL
& E
NVIRONMENTAL
C
HARACTERISTICS
SPECIFICATION
SOLDERABILITY:
RESISTANCE TO
SOLDERING HEAT:
Solder coverage 90% of metalized areas
No termination degradation
No mechanical damage
Capacitance change: ±2.5% or 0.25pF
Q>500 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Capacitance change: 2% or 0.5pF Max
No mechanical damage
Capacitance change: ±3.0% or 0.3 pF
Q>500 I.R. >1 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>2000 I.R. >10 G Ohms
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. 1 G-Ohm
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±5.0% or 0.50pF max.
Q>300 I.R. = 1 G-Ohm min.
Breakdown voltage: 2.5 x WVDC
No mechanical damage.
Capacitance change: ±2.5% or 0.25pF
Q>1000 I.R. 10 G-Ohm
Breakdown voltage: 2.5 x WVDC
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec., dip terminals in rosin flux
then dip in Sn62 solder @ 240°±5°C for 5±1 sec
Preheat device to 80°-100°C for 60 sec.
followed by 150°-180°C for 60 sec.
Dip in 260°±5°C solder for 10±1 sec.
Measure after 24±2 hour cooling period
Linear pull force* exerted on axial leads soldered to each terminal.
*0402 2.0lbs, 0603 2.0lbs (min.)
Glass epoxy PCB: 0.5 mm deflection
Applied voltage: 200% rated voltage, 50 mA max.
Temperature: 125°±3°C
Test time: 1000+48-0 hours
5 cycles of: 30±3 minutes @ -55°+0/-3°C,
2-3 min. @ 25°C, 30±3 min. @ +125°+3/-0°C,
2-3 min. @ 25°C
Measure after 24±2 hour cooling period
Relative humidity: 90-95%
Temperature: 40°±2°C
Test time: 500 +12/-0 Hours
Measure after 24±2 hour cooling period
Applied voltage: 1.5 VDC, 50 mA max.
Relative humidity: 85±2% Temperature: 40°±2°C
Test time: 240 +12/-0 Hours
Measure after 24±2 hour cooling period
Cycle performed for 2 hours in each of three perpendicular directions
Frequency range 10Hz to 55 Hz to 10 Hz traversed
in 1 minute. Harmonic motion amplitude: 1.5mm
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL CYCLE:
HUMIDITY,
STEADY STATE:
HUMIDITY,
LOW VOLTAGE:
VIBRATION:
H
OW TO
O
RDER
251
VOLTAGE
500 = 50 V
251 = 250 V
R14
CASE SIZE
See Chart
S
DIELECTRIC
S = S Dielectric
101
CAPACITANCE
1st two digits are
significant; third digit
denotes number of
zeros, R = decimal.
1R0 = 1.0 pF
101 = 100 pF
J
TOLERANCE
** A = ± 0.05 pF
* B = ± 0.10 pF
* C = ± 0.25 pF
F = ±1%
G = ± 2%
J = ± 5%
K = ± 10%
* Values < 10 pF
** Values < 2.0 pF
V
TERMINATION
V = Ni/Sn
T = Ni/SnPb
MARKING
4 = Unmarked
(Not Available)
6 = EIA “J” Code *
* 0805 Only
4
Y
TAPE MODIFIER
Code Type Reel
SIZES 0201 - 0603:
T
Paper 7”
Y
Paper
5”
SIZE 0805:
E Embossed 7”
Z Embossed 5”
Tape specifications
conform to EIA RS481
Part number written: 251R14S101JV4Y
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7
Microcontroller MCU
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