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CXP973F064GA-1

Description
Microcontroller, 16-Bit, FLASH, SPC970 CPU, 34.5MHz, CMOS, PBGA104, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFLGA-104
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size450KB,42 Pages
ManufacturerSONY
Websitehttp://www.sony.co.jp
Download Datasheet Parametric Compare View All

CXP973F064GA-1 Overview

Microcontroller, 16-Bit, FLASH, SPC970 CPU, 34.5MHz, CMOS, PBGA104, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFLGA-104

CXP973F064GA-1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?incompatible
Parts packaging codeLGA
package instructionLFBGA, LGA104,13X13,32
Contacts104
Reach Compliance Codeunknown
ECCN code3A991.A.2
Has ADCYES
Other featuresALSO OPERATES AT 2.7V MIN SUPPLY
Address bus width16
bit size16
CPU seriesSPC970
maximum clock frequency34.5 MHz
DAC channelNO
DMA channelNO
External data bus width8
JESD-30 codeS-PBGA-BU104
JESD-609 codee0
length11 mm
Number of I/O lines87
Number of terminals104
Maximum operating temperature85 °C
Minimum operating temperature-30 °C
PWM channelYES
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeLGA104,13X13,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3/3.3 V
Certification statusNot Qualified
RAM (bytes)11776
rom(word)131072
ROM programmabilityFLASH
Maximum seat height1.4 mm
speed34.5 MHz
Maximum slew rate57 mA
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formBUTT
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width11 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
Base Number Matches1
CXP973F064
CMOS 16-bit Single Chip Microcomputer
Description
The CXP973F064 is a CMOS 16-bit microcomputer
integrating on a single chip an A/D converter, serial
interface, I
2
C bus interface, timer, PWM output
circuit, programmable pattern generator, remote
control receive circuit, parallel interface, FLASH
ROM interface, and as well as basic configurations
like a 16-bit CPU, ROM, RAM, and I/O port.
This LSI also provides the sleep/stop functions that
enable lower power consumption.
100 pin QFP (Plastic)
100 pin LQFP (Plastic)
104 pin LFLGA (Plastic)
Features
An efficient instruction set as a controller
— Direct addressing, numerous abbreviated forms,
multiplication and division instructions
Instruction sets for C language and RTOS
— Highly quadratic instruction system, general-
purpose register of 16-bit
×
8-pin
×
16-bank
configuration
Minimum instruction cycle
58.8ns at 34MHz operation (3.0 to 3.6V)
66.7ns at 30MHz operation (2.7 to 3.6V)
Incorporated EEPROM capacity 256K bytes
Incorporated RAM capacity
11.5K bytes
Peripheral functions
— A/D converter
8-bit 12-analog input, successive approximation system,
3-stage FIFO (Conversion time: 1.55µs at 40MHz)
— Serial interface
Asynchronous serial interface (UART)
128-byte buffer RAM, 3 channels
2
C bus interface
—I
64-byte buffer RAM
(supports master/slave and automatic transfer mode)
— Timers
8-bit timer/counter, 2 channels (with timing output)
16-bit capture timer/counter (with timing output)
16-bit timer, 4 channels, watchdog timer
— PWM output circuit
14-bit PWM, 4 channels
(2-channel of binary output switch function by PPG)
— Programmable pattern generator 16-bit output, 64-byte buffer RAM, 1 channel
— Remote control receive circuit
8-bit pulse measurement counter, 10-stage FIFO
— Parallel interface
External register interface (8-bit parallel bus), 4-chip select
Interruption
Standby mode
Package
33 factors, 33 vectors, multi-interruption and priority selection possible
Sleep/stop
100-pin plastic QFP
100-pin plastic LQFP
104-pin plastic LFLGA
CXP971000
CXP972032/973032/973064
Piggy/evaluation chip
Mask ROM
Structure
Silicon gate CMOS IC
Perchase of Sony's I
2
C components conveys a licence under the Philips I
2
C Patent Rights to use these components
in an I
2
C system, provided that the system conforms to the I
2
C Standard Specifications as defined by Philips.
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E99Z25B15-PS

CXP973F064GA-1 Related Products

CXP973F064GA-1 CXP973F064R-1 CXP973F064Q-1
Description Microcontroller, 16-Bit, FLASH, SPC970 CPU, 34.5MHz, CMOS, PBGA104, 11 X 11 MM, 0.80 MM PITCH, PLASTIC, LFLGA-104 Microcontroller, 16-Bit, FLASH, SPC970 CPU, 34.5MHz, CMOS, PQFP100, 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 Microcontroller, 16-Bit, FLASH, SPC970 CPU, 34.5MHz, CMOS, PQFP100, 14 X 20 MM, PLASTIC, QFP-100
Is it lead-free? Lead free Lead free Lead free
Is it Rohs certified? incompatible incompatible incompatible
Parts packaging code LGA QFP QFP
package instruction LFBGA, LGA104,13X13,32 14 X 14 MM, 0.50 MM PITCH, PLASTIC, LQFP-100 14 X 20 MM, PLASTIC, QFP-100
Contacts 104 100 100
Reach Compliance Code unknown unknown unknown
ECCN code 3A991.A.2 3A991.A.2 3A991.A.2
Has ADC YES YES YES
Other features ALSO OPERATES AT 2.7V MIN SUPPLY ALSO OPERATES AT 2.7V MIN SUPPLY ALSO OPERATES AT 2.7V MIN SUPPLY
Address bus width 16 16 16
bit size 16 16 16
CPU series SPC970 SPC970 SPC970
maximum clock frequency 34.5 MHz 34.5 MHz 34.5 MHz
DAC channel NO NO NO
DMA channel NO NO NO
External data bus width 8 8 8
JESD-30 code S-PBGA-BU104 S-PQFP-G100 R-PQFP-G100
JESD-609 code e0 e0 e0
length 11 mm 14 mm 20 mm
Number of I/O lines 87 87 87
Number of terminals 104 100 100
Maximum operating temperature 85 °C 85 °C 85 °C
Minimum operating temperature -30 °C -30 °C -30 °C
PWM channel YES YES YES
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code LFBGA LFQFP QFP
Encapsulate equivalent code LGA104,13X13,32 QFP100,.63SQ,20 QFP100,.7X.9
Package shape SQUARE SQUARE RECTANGULAR
Package form GRID ARRAY, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
Peak Reflow Temperature (Celsius) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 3/3.3 V 3/3.3 V 3/3.3 V
Certification status Not Qualified Not Qualified Not Qualified
RAM (bytes) 11776 11776 11776
rom(word) 131072 131072 131072
ROM programmability FLASH FLASH FLASH
Maximum seat height 1.4 mm 1.7 mm 3.1 mm
speed 34.5 MHz 34.5 MHz 34.5 MHz
Maximum slew rate 57 mA 57 mA 57 mA
Maximum supply voltage 3.6 V 3.6 V 3.6 V
Minimum supply voltage 3 V 3 V 3 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V
surface mount YES YES YES
technology CMOS CMOS CMOS
Temperature level OTHER OTHER OTHER
Terminal surface Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal form BUTT GULL WING GULL WING
Terminal pitch 0.8 mm 0.5 mm 0.65 mm
Terminal location BOTTOM QUAD QUAD
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 11 mm 14 mm 14 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER
Base Number Matches 1 1 1
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