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3D2D4G08UB2302MS-6E

Description
DDR DRAM, 512MX8, CMOS, PBGA63, FBGA-63
Categorystorage    storage   
File Size95KB,2 Pages
Manufacturer3D PLUS
Download Datasheet Parametric View All

3D2D4G08UB2302MS-6E Overview

DDR DRAM, 512MX8, CMOS, PBGA63, FBGA-63

3D2D4G08UB2302MS-6E Parametric

Parameter NameAttribute value
Objectid1842937512
package instructionFBGA, BGA63,9X11,32
Reach Compliance Codeunknown
ECCN codeEAR99
access modeMULTI BANK PAGE BURST
Other featuresSELF REFRESH
I/O typeCOMMON
JESD-30 codeR-PBGA-B63
length14.7 mm
memory density4294967296 bit
Memory IC TypeDDR2 DRAM
memory width8
Number of functions1
Number of ports1
Number of terminals63
word count536870912 words
character code512000000
Operating modeSYNCHRONOUS
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize512MX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeFBGA
Encapsulate equivalent codeBGA63,9X11,32
Package shapeRECTANGULAR
Package formGRID ARRAY, FINE PITCH
Certification statusNot Qualified
refresh cycle8192
Filter levelESCC9000
Maximum seat height3.4 mm
self refreshYES
Maximum standby current0.01 A
Maximum slew rate0.115 mA
Maximum supply voltage (Vsup)1.9 V
Minimum supply voltage (Vsup)1.7 V
Nominal supply voltage (Vsup)1.8 V
surface mountYES
technologyCMOS
Temperature levelMILITARY
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
width12.2 mm
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