54F 74F240
54F 74F241
54F 74F244
Octal Buffers Line Drivers with TRI-STATE Outputs
May 1995
54F 74F240
54F 74F241
54F 74F244
Octal Buffers Line Drivers with TRI-STATE Outputs
General Description
The ’F240 ’F241 and ’F244 are octal buffers and line driv-
ers designed to be employed as memory and address driv-
ers clock drivers and bus-oriented transmitters receivers
which provide improved PC and board density
Features
Y
Y
Y
Y
Y
TRI-STATE outputs drive bus lines or buffer memory
address registers
Outputs sink 64 mA (48 mA mil)
12 mA source current
Input clamp diodes limit high-speed termination effects
Guaranteed 4000V minimum ESD protection
Commercial
74F240PC
Military
Package
Number
N20A
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Dual-In-Line
54F240DM (Note 2)
74F240SC (Note 1)
74F240SJ (Note 1)
54F240FM (Note 2)
54F240LM (Note 2)
74F241PC
54F241DM (Note 2)
J20A
M20B
M20D
W20A
E20A
N20A
J20A
74F241SC (Note 1)
74F241SJ (Note 1)
74F244PC
74F244SC (Note 1)
74F244SJ (Note 1)
74F244MSA (Note 1)
O
C
1995 National Semiconductor Corporation
TL F 9501
Note 1
Devices also available in 13 reel Use Suffix
e
SCX SJX and MSAX
Note 2
Military grade device with environmental and burn-in processing Use suffix
e
DMQB FMQB and LMQB
TRI-STATE is a registered trademark of National Semiconductor Corporation
bs
ol
20-Lead Ceramic Dual-In-Line
M20B
M20D
54F241FM (Note 2)
54F241LM (Note 2)
W20A
20-Lead Cerpack
E20A
N20A
J20A
54F244DM (Note 2)
20-Lead Ceramic Dual-In-Line
M20B
M20D
MSA20
54F244FM (Note 2)
54F244LM (Note 2)
W20A
20-Lead Cerpack
E20A
et
20-Lead Cerpack
20-Lead Ceramic Leadless Chip Carrier Type C
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Ceramic Leadless Chip Carrier Type C
20-Lead (0 300 Wide) Molded Dual-In-Line
20-Lead Molded Shrink Small Outline EIAJ Type II
20-Lead Ceramic Leadless Chip Carrier Type C
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
20-Lead (0 300 Wide) Molded Small Outline JEDEC
20-Lead (0 300 Wide) Molded Small Outline EIAJ
e
Package Description
RRD-B30M75 Printed in U S A
Connection Diagrams
Pin Assignment for LCC
’F240
’F241
’F244
TL F 9501 – 6
TL F 9501– 2
TL F 9501 – 4
Pin Assignment for DIP SOIC SSOP and Flatpak
TL F 9501– 1
IEEE IEC
’F240
O
TL F 9501– 7
bs
ol
IEEE IEC
’F241
TL F 9501 – 8
Logic Symbols
et
TL F 9501 – 3
2
e
TL F 9501 – 5
IEEE IEC
’F244
TL F 9501 – 9
Unit Loading Fan Out
54F 74F
Pin Names
Description
UL
HIGH LOW
1 0 1 667
1 0 1 667
1 0 1 667
1 0 2 667
600 106 6 (80)
Input I
IH
I
IL
Output I
OH
I
OL
20
mA
b
1 mA
20
mA
b
1 mA
20
mA
b
1 mA
20
mA
b
1 6 mA
b
12 mA 64 mA (48 mA)
OE
1
OE
2
OE
2
I
0
–I
7
I
0
–I
7
O
0
–O
7
O
0
– O
7
TRI-STATE Output Enable Input (Active LOW)
TRI-STATE Output Enable Input (Active HIGH)
Inputs (’F240)
Inputs (’F241 ’F244)
Outputs
Worst-case ’F240 enabled ’F241 ’F244 disabled
Truth Tables
’F240
OE
1
H
L
L
D
1n
X
H
L
O
1n
Z
L
H
’F241
OE
1
H
L
L
D
1n
X
H
L
O
1n
Z
H
L
OE
2
L
H
H
D
2n
X
H
L
O
2n
Z
H
L
OE
2
H
L
L
D
2n
X
H
L
O
2n
Z
L
H
OE
1
H
L
L
D
1n
X
H
L
O
1n
Z
H
L
’F244
OE
2
H
L
L
D
2n
X
H
L
O
2n
Z
H
L
H
e
HIGH Voltage Level
L
e
LOW Voltage Level
X
e
Immaterial
Z
e
High Impedance
O
3
bs
ol
et
e
Absolute Maximum Ratings
(Note 1)
If Military Aerospace specified devices are required
please contact the National Semiconductor Sales
Office Distributors for availability and specifications
Storage Temperature
Ambient Temperature under Bias
Junction Temperature under Bias
Plastic
V
CC
Pin Potential to
Ground Pin
b
65 C to
a
150 C
b
55 C to
a
125 C
b
55 C to
a
175 C
b
55 C to
a
150 C
b
0 5V to
a
7 0V
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
Commercial
Supply Voltage
Military
Commercial
b
55 C to
a
125 C
0 C to
a
70 C
a
4 5V to
a
5 5V
a
4 5V to
a
5 5V
b
0 5V to
a
7 0V
Input Voltage (Note 2)
b
30 mA to
a
5 0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
b
0 5V to V
CC
Standard Output
b
0 5V to
a
5 5V
TRI-STATE Output
Current Applied to Output
in LOW State (Max)
twice the rated I
OL
(mA)
Note 1
Absolute maximum ratings are values beyond which the device may
be damaged or have its useful life impaired Functional operation under
these conditions is not implied
Note 2
Either voltage limit or current limit is sufficient to protect inputs
Symbol
V
IH
V
IL
V
CD
V
OH
Parameter
Min
Input HIGH Voltage
Input LOW Voltage
Input Clamp Diode Voltage
Output HIGH
Voltage
20
54F 74F
Typ
V
OL
I
IH
I
BVI
I
CEX
V
ID
Output LOW
Voltage
Input HIGH
Current
Input HIGH Current
Breakdown Test
Output HIGH
Leakage Current
Input Leakage
Test
O
74F
74F
I
OD
I
IL
Output Leakage
Circuit Current
Input LOW Current
I
OZH
I
OZL
I
OS
I
ZZ
Output Leakage Current
Output Leakage Current
Output Short-Circuit Current
Bus Drainage Test
bs
ol
54F 10% V
CC
54F 10% V
CC
74F 10% V
CC
74F 10% V
CC
74F 5% V
CC
54F 10% V
CC
74F 10% V
CC
54F
74F
24
20
24
20
27
V
Min
I
OH
I
OH
I
OH
I
OH
I
OH
e
e
e
e
e
b
3 mA
b
12 mA
b
3 mA
b
15 mA
b
3 mA
54F
74F
54F
74F
4 75
3 75
b
1 0
b
1 6
b
100
et
Units
V
V
CC
Conditions
Max
Recognized as a HIGH Signal
08
V
Recognized as a LOW Signal
b
1 2
DC Electrical Characteristics
V
Min
0 55
0 55
V
Min
20 0
50
100
70
mA
mA
mA
V
mA
Max
Max
Max
00
00
250
50
mA
mA
mA
mA
mA
Max
Max
Max
Max
0 0V
50
b
50
b
225
500
4
e
I
IN
e b
18 mA
I
OL
e
48 mA
I
OL
e
64 mA
V
IN
e
2 7V
V
IN
e
7 0V
V
OUT
e
V
CC
I
ID
e
1 9
mA
All Other Pins Grounded
V
IOD
e
150 mV
All Other Pins Grounded
V
IN
e
0 5V (OE
1
OE
2
OE
2
D
n
(’F240))
V
IN
e
0 5V (D
n
(’F241 ’F244))
V
OUT
e
2 7V
V
OUT
e
0 5V
V
OUT
e
0V
V
OUT
e
5 25V
ESD Last Passing Voltage (Min)
4000V
DC Electrical Characteristics
Symbol
I
CCH
I
CCL
I
CCZ
I
CCH
I
CCL
I
CCZ
Parameter
(Continued)
54F 74F
Min
Typ
19
50
42
40
60
60
Max
29
75
63
60
90
90
mA
mA
mA
mA
mA
mA
Max
Max
Max
Max
Max
Max
V
O
e
HIGH
V
O
e
LOW
V
O
e
HIGH Z
V
O
e
HIGH
V
O
e
LOW
V
O
e
HIGH Z
Units
V
CC
Conditions
Power Supply Current (’F240)
Power Supply Current (’F240)
Power Supply Current (’F240)
Power Supply Current
(’F241 ’F244)
Power Supply Current
(’F241 ’F244)
Power Supply Current
(’F241 ’F244)
AC Electrical Characteristics
74F
Symbol
Parameter
Min
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
t
PLH
t
PHL
t
PZH
t
PZL
t
PHZ
t
PLZ
Propagation Delay
Data to Output (’F240)
Output Enable Time (’F240)
Output Disable Time (’F240)
Propagation Delay
Data to Output (’F241 ’F244)
Output Enable Time
(’F241 ’F244)
30
20
20
40
20
20
25
25
20
20
20
20
T
A
e a
25 C
V
CC
e a
5 0V
C
L
e
50 pF
Typ
51
35
Max
70
47
54F
T
A
V
CC
e
Mil
C
L
e
50 pF
74F
T
A
V
CC
e
Com
C
L
e
50 pF
Min
30
20
Max
80
57
Units
et
35
69
40
60
47
90
53
80
20
40
20
20
65
10 5
65
12 5
65
70
70
85
70
75
20
40
20
20
40
40
43
54
45
45
52
52
57
70
60
60
20
20
20
20
20
20
25
25
20
20
20
20
240 241 244
S
C
X
5
e
Min
30
20
Max
90
60
57
10 0
63
95
62
65
67
80
70
70
Special Variations
QB
e
Military grade device with
environmental and burn-in
processing
X
e
devices shipped in 13 reel
Temperature Range
C
e
Commercial (0 C to
a
70 C)
M
e
Military (
b
55 C to
a
125 C)
NOTE
Not required for MSA package
code
ns
ns
bs
ol
Output Disable Time
(’F241 ’F244)
74F
ns
ns
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows
O
Device Type
Temperature Range Family
74F
e
Commercia
54F
e
Military
Package Code
P
e
Plastic DIP
D
e
Ceramic DIP
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC JEDEC
MSA
e
Shrink Small Outline Package (EIAJ SSOP)
(’244 only)
SJ
e
Small Outline SOIC EIAJ
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