EEWORLDEEWORLDEEWORLD

Part Number

Search

BDS2A300100KJ

Description
RESISTOR, METAL GLAZE/THICK FILM, 300W, 5%, 150ppm, 100000ohm, CHASSIS MOUNT
File Size65KB,1 Pages
ManufacturerTE Connectivity
Websitehttp://www.te.com
Download Datasheet Parametric View All

BDS2A300100KJ Overview

RESISTOR, METAL GLAZE/THICK FILM, 300W, 5%, 150ppm, 100000ohm, CHASSIS MOUNT

BDS2A300100KJ Parametric

Parameter NameAttribute value
Objectid1891877611
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL5.6
Other featuresRATED POWER IS DISSIPATED USING HEATSINK
Manufacturer's serial numberBDS300
Installation featuresCHASSIS MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
Rated power dissipation(P)300 W
Rated temperature85 °C
resistance100000 Ω
Resistor typeFIXED RESISTOR
surface mountNO
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient150 ppm/°C
Terminal shapeFLEXIBLE WIRE
Tolerance5%
Operating Voltage5000 V
Thick Film Power Resistors
Type BDS300 Series
Type BDS300 Series
Characteristics -
Electrical
Resistance Values:
Resistance Tolerance:
Temperature Coefficient:
Power Rating:
Capacitance / Mass:
Capacitance / Parallel:
Inductance:
Maximum Working Voltage:
Insulation Voltage:
Single Shot Voltage:
Insulation Resistance:
Partial Discharge:
R505 to 100K
±5% or ±10%
±150ppm/°C (others upon request)
300W at 85°C
110 pF
40 pF
80 nH
5,000VDC
6kVrms, 50Hz,1Min.
up to 12 kV Normwave (1.5/50µ secs)
10GΩ Min. at 500V
3kVrms <10pC
The BDS300 has been designed for
use as a snubber resistor where
compensatation is required for C-R
peaks in traction power supply
equipment.
The
High alumina
metallized ceramic is ideally suited
to allowing maximum connection to
the main heatsink. The resin filled
epoxy casing provides large creep
distance to mass, large air distance
between the terminals and high
insulation resistance, whilst the
design of the Resitive element
element allows for perfect current
yeild over the entire component.
Characteristics -
Environmental
Operation Temperature:
Short Time Overload:
-55°C to +150°C
1.5x rated power = 450W at 70°C for 10 sec,
∆R
= 0.4% max.
Characteristics -
Mechanical
Terminal Size:
Max. Torque for Contacts:
Max. Torque for Mounting:
Creeping Distance:
Air Distance:
M4 or M5 Screws
2 Nm
1.8 Nm
42mm Minimum
14mm Minimum
Key Features
I
I
Easy connection with M4
or M5 screws
Connector heights
available from
25 to 42mm
Increased creep distance
up to 85mm
Potted cable connections
available on request
Custom Designs available
Dimensions
7.0
18.0
ø4.1 ±
0.2
0.05
36.0±0.3
5.0 ±0.5
I
I
I
15.0
30.0 ±0.5
32.0 ±0.5
34.0 ±0.2
57.0 ±0.2
65.0
øM5
Derating Curve
120
100
Rated Power (%)
80
60
40
20
0
0
25
50
75
100 125
150
Case Temperature °C
175
200
Pulse Energy
100000
10000
1000
Energy (W/s)
100
10
1
0.1
0.01
0.001
0.01
0.1
1
10
100
Time (msecs)
1000
10000 100000
Applications
I
I
I
I
I
Snubbing
(Low inductance)
Balancing Resistor
(Multi-resistor package)
Filter (Low inductance)
High Voltage
High Frequency
How to Order
BDS 2
Common Part
A
Circuit Type
300
Power Dissipation
1K0
Resistance Value
0.5Ω (500mΩ) R50
BDS 2 (2 Terminal)
A: Standard
300 - 300 Watts
1Ω (1000mΩ) 1R0
1K (1000Ω) 1KO
60.0
J
Tolerance
J - 5%
K - 10%
Literature No. 1773187
Issued: 07-06
Dimensions are shown for
reference purposes only.
Dimensions are in millimetres
unless otherwise specified.
Specifications subject to
change.
www.tycoelectronics.com
passives.tycoelectronics.com
msp430g2533 iic (gpio emulation iic)
[color=#555555]#include [/color] [color=#555555]#include [/color] [color=#555555]#define SCLBIT6;[/color] [color=#555555]#define SDABIT7;[/color] [color=#555555]#define uchar unsigned char[/color] [co...
wuweiwangyao Microcontroller MCU
New here, report
~~Newbie, please teach me more in the future...
矜天 Embedded System
What tool can edit txt files under wince?
What software can be used to edit txt files under wince?...
yuyang4812 Embedded System
What do you think of the domestically produced high-performance HiSilicon Kirin 920 chip?
[i=s]This post was last edited by jameswangsynnex on 2015-3-3 19:52[/i] Huawei Honor 6 was released. This phone is the first product to use Huawei's latest HiSilicon Kirin 920. Honor 6 uses HiSilicon ...
youluo Mobile and portable
Altium Designer 10 Design Grid Description
...
qin552011373 Analog electronics
How does stm407 implement 1588?
I bought a stm3240G development board, but I didn't find a corresponding method to implement 1588. Can you tell me if I need to connect some external 1588 hardware? I'm confused. . ....
hbu_ami stm32/stm8

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 786  1581  1151  2843  470  16  32  24  58  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号