K64P144M120SF5 datasheet, PDF - EEWORLD Datasheet

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K64P144M120SF5: Description120mhz cortex-m4f 512kb/1mb flash 100-144pin; Categorysemiconductor The embedded processor and controller; File Size1MB，85 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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K64P144M120SF5 Overview

120mhz cortex-m4f 512kb/1mb flash 100-144pin

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document number K64P144M120SF5

Rev. 6, 08/2015

Kinetis K64F Sub-Family Data

Sheet

120 MHz ARM® Cortex®-M4-based Microcontroller with FPU

The K64 product family members are optimized for cost-sensitive

applications requiring low-power, USB/Ethernet connectivity, and

up to 256 KB of embedded SRAM. These devices share the

comprehensive enablement and scalability of the Kinetis family.

This product offers:

• Run power consumption down to 250 μA/MHz. Static

power consumption down to 5.8 μA with full state retention

and 5 μs wakeup. Lowest Static mode down to 339 nA

• USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO

Vreg, with USB device crystal-less operation

• 10/100 Mbit/s Ethernet MAC with MII and RMII interfaces

MK64FN1M0Vxx12

MK64FX512Vxx12

121 XFBGA

8 x 8 x 0.5 mm Pitch

0.65 mm

144 LQFP

20 x 20 x 1.6 mm Pitch

0.5 mm

144 MAPBGA

13 x 13 x 1.46 mm

Pitch 1 mm

100 QFP

14 x 14 x 1.7 mm Pitch

0.5 mm

Performance

• Up to 120 MHz ARM® Cortex®-M4 core with DSP

instructions and floating point unit

Memories and memory interfaces

• Up to 1 MB program flash memory and 256 KB RAM

• Upto 128 KB FlexNVM and 4 KB FlexRAM on devices

with FlexMemory

• FlexBus external bus interface

System peripherals

• Multiple low-power modes, low-leakage wake-up unit

• Memory protection unit with multi-master protection

• 16-channel DMA controller

• External watchdog monitor and software watchdog

Security and integrity modules

• Hardware CRC module

• Hardware random-number generator

• Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

• 128-bit unique identification (ID) number per chip

Analog modules

• Two 16-bit SAR ADCs

• Two 12-bit DACs

• Three analog comparators (CMP)

• Voltage reference

Communication interfaces

• Ethernet controller with MII and RMII interface

• USB full-/low-speed On-the-Go controller

• Controller Area Network (CAN) module

• Three SPI modules

• Three I2C modules. Support for up to 1 Mbit/s

• Six UART modules

• Secure Digital Host Controller (SDHC)

• I2S module

Timers

• Two 8-channel Flex-Timers (PWM/Motor control)

• Two 2-channel FlexTimers (PWM/Quad decoder)

• IEEE 1588 timers

• 32-bit PITs and 16-bit low-power timers

• Real-time clock

• Programmable delay block

Clocks

• 3 to 32 MHz and 32 kHz crystal oscillator

• PLL, FLL, and multiple internal oscillators

• 48 MHz Internal Reference Clock (IRC48M)

Operating Characteristics

• Voltage range: 1.71 to 3.6 V

• Flash write voltage range: 1.71 to 3.6 V

• Temperature range (ambient): –40 to 105°C

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................... 5

1.1 Thermal handling ratings................................................. 5

1.2 Moisture handling ratings................................................ 5

1.3 ESD handling ratings....................................................... 5

1.4 Voltage and current operating ratings............................. 5

2 General................................................................................... 6

2.1 AC electrical characteristics.............................................6

2.2 Nonswitching electrical specifications..............................6

2.2.1

Voltage and current operating requirements.....6

2.2.2

LVD and POR operating requirements............. 8

2.2.3

Voltage and current operating behaviors.......... 8

2.2.4

Power mode transition operating behaviors......10

2.2.5

Power consumption operating behaviors.......... 11

2.2.6

EMC radiated emissions operating behaviors...16

2.2.7

Designing with radiated emissions in mind....... 17

2.2.8

Capacitance attributes...................................... 17

2.3 Switching specifications...................................................17

2.3.1

Device clock specifications............................... 17

2.3.2

General switching specifications....................... 18

2.4 Thermal specifications..................................................... 19

2.4.1

Thermal operating requirements....................... 19

2.4.2

Thermal attributes............................................. 20

3 Peripheral operating requirements and behaviors.................. 21

3.1 Core modules.................................................................. 21

3.1.1

Debug trace timing specifications..................... 21

3.1.2

JTAG electricals................................................ 22

3.2 System modules.............................................................. 25

3.3 Clock modules................................................................. 25

3.3.1

MCG specifications........................................... 25

3.3.2

IRC48M specifications...................................... 27

3.3.3

Oscillator electrical specifications..................... 28

3.3.4

32 kHz oscillator electrical characteristics.........30

3.4 Memories and memory interfaces................................... 31

3.4.1

3.4.2

3.4.3

Flash (FTFE) electrical specifications............... 31

EzPort switching specifications......................... 36

Flexbus switching specifications....................... 37

3.6.2

3.6.3

3.6.4

CMP and 6-bit DAC electrical specifications.....45

12-bit DAC electrical characteristics................. 47

Voltage reference electrical specifications........ 50

3.7 Timers..............................................................................51

3.8 Communication interfaces............................................... 51

3.8.1

Ethernet switching specifications...................... 52

3.8.2

3.8.3

3.8.4

3.8.5

3.8.6

3.8.7

USB electrical specifications............................. 54

USB DCD electrical specifications.................... 54

USB VREG electrical specifications..................55

CAN switching specifications............................ 55

DSPI switching specifications (limited voltage

range)................................................................55

DSPI switching specifications (full voltage

range)................................................................57

3.8.8

Inter-Integrated Circuit Interface (I2C) timing....59

3.8.9

UART switching specifications.......................... 60

3.8.10 SDHC specifications......................................... 60

3.8.11 I2S switching specifications.............................. 61

4 Dimensions............................................................................. 67

4.1 Obtaining package dimensions....................................... 67

5 Pinout...................................................................................... 68

5.1 K64 Signal Multiplexing and Pin Assignments.................68

5.2 Unused analog interfaces................................................ 75

5.3 K64 Pinouts..................................................................... 75

6 Ordering parts......................................................................... 79

6.1 Determining valid orderable parts....................................79

7 Part identification.....................................................................80

7.1 Description.......................................................................80

7.2 Format............................................................................. 80

7.3 Fields............................................................................... 80

7.4 Example...........................................................................81

8 Terminology and guidelines.................................................... 81

8.1 Definitions........................................................................ 81

8.2 Examples......................................................................... 82

8.3 Typical-value conditions.................................................. 82

8.4 Relationship between ratings and operating

requirements....................................................................83

8.5 Guidelines for ratings and operating requirements..........83

9 Revision History...................................................................... 84

3.5 Security and integrity modules........................................ 40

3.6 Analog............................................................................. 40

3.6.1

ADC electrical specifications.............................41

Freescale Semiconductor, Inc.

Kinetis K64F Sub-Family Data Sheet, Rev.6, 08/2015.

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