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BU-63825F6-351S

Description
Mil-Std-1553 Controller, 0.125MBps, CMOS, CQFP70, FLATPACK-70
File Size257KB,4 Pages
ManufacturerData Device Corporation
Download Datasheet Parametric View All

BU-63825F6-351S Overview

Mil-Std-1553 Controller, 0.125MBps, CMOS, CQFP70, FLATPACK-70

BU-63825F6-351S Parametric

Parameter NameAttribute value
Objectid2008968912
package instructionQFF,
Reach Compliance Codecompliant
Country Of OriginTaiwan, USA
YTEOL7.55
Other featuresWD-MAX
Address bus width
boundary scanNO
maximum clock frequency16 MHz
letter of agreementMIL-STD-1553
Data encoding/decoding methodsBIPH-LEVEL(MANCHESTER)
Maximum data transfer rate0.125 MBps
External data bus width
JESD-30 codeR-CQFP-F70
length48.26 mm
low power modeYES
Number of serial I/Os2
Number of terminals70
Maximum operating temperature70 °C
Minimum operating temperature
Package body materialCERAMIC, METAL-SEALED COFIRED
encapsulated codeQFF
Package shapeRECTANGULAR
Package formFLATPACK
Filter levelMIL-PRF-38534
Maximum seat height5.46 mm
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelCOMMERCIAL
Terminal formFLAT
Terminal pitch1.27 mm
Terminal locationQUAD
width26 mm
uPs/uCs/peripheral integrated circuit typeSERIAL IO/COMMUNICATION CONTROLLER, MIL-STD-1553
www.ddc-web.com
MIL-STD-1553 Terminals for
Space Applications:
MODEL:BU-63825(925) and BU-63705
FEATURES:
BU-63705:
Drop-in Replacement for BU-61582 (83)
Drop-in Replacement for BU-65142
Rad Tolerant & Rad Hard Versions*
Rad Tolerant & Rad Hard Versions*
Fully Integrated Remote Terminal
Fully Integrated 1553 - BC/RT/MT
Including:
Flexible Processor Interface
- Low-Power Transceivers
16K x 16 Internal RAM
- Complete RT Protocol
Intelligent RT Data Buffering
Direct Interface to Processorless
Multiple Ordering Options;
Systems
+5V (Only), +5V/-15V, +5V/-12V
High Reliability Screening
+5V/Transceiverless (Contact Factory for
Multiple Ordering Options;
Availability)
+5V (Only), +5V/-15V, and +5V/-12V
+5V (Only, with Transmit Inhibits)
BU-63825(925):
DESCRIPTION
The BU-63825/925 BC/RT/MT Sp’ACE-II and BU-63705 Space-RT-II series of MIL-STD-1553 terminals continues Data
Device Corporation’s (DDC’s) commitment to producing hybrids with enhanced processing and screening for space
borne, radiation and Hi-Rel applications. Both terminals are designed specifically to be hardware and software
compatible, direct drop-in replacements for the equivalent Sp’ACE and Space RT series.
The BU-63825/925 Sp’ACE-II is a complete integrated interface between a 1553 bus and a host processor, and
replaces the BU-61582/83 Sp’ACE ( Space Advanced Communication Engine) pin-for-pin with the same 1.9 square
inch package.
The BU-63705 Space RT-II is a terminal for simple, non-CPU based applications, and shares the same 3.78 square inch
package as BU-65142 Space RT, which it replaces.
APPLICATIONS
The new generation of Sp’ACE-II and Space-RT-II terminals are designed for applications requiring the highest levels
of reliability and radiation tolerance*, including such platforms as launch vehicles, satellites and the International
Space Station.
DESIGN
The manufacturing of hybrids for space applications involves enhancements in the area of layout design, processing
and screening. The principle goal of the hybrid mechanical design is to improve the ease of wire bonding and
inspection. All of DDC's space grade terminals utilize ceramic packaging. Ceramic packages eliminate the potential
hermeticity problems associated with the glass beads of KOVAR (metal) packages. In addition, ceramic packages
facilitate improved thermal properties and feature reduced weight and lower cost.
®
*Contact Factory For Radiation Reports and Test Conditions
All trademarks are the property of their respective owners
© 2006 Data Device Corporation
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