Si 7 0 1 3 - A1 0
I
2
C H
UMIDITY
Features
AND
T
W O
- Z
ONE
T
EMPERATURE
S
ENSOR
Precision Relative Humidity Sensor
± 3% RH (max), 0–80% RH
High Accuracy Temperature Sensor
±0.4 °C (max), –10 to 85 °C
0 to 100% RH operating range
Up to –40 to +125 °C operating
range
Low Voltage Operation (1.9 to 3.6 V)
Low Power Consumption
150 µA active current
60 nA standby current
Factory-calibrated
I
2
C Interface
Integrated on-chip heater
Auxiliary Sensor input
Direct readout of remote
thermistor temperature in °C
Package: 3x3 mm DFN
Excellent long term stability
Optional factory-installed cover
Low-profile
Protection during reflow
Excludes liquids and particulates
Si7013
Ordering Information:
See page 38.
Applications
HVAC/R
Thermostats/humidistats
Instrumentation
White goods
Micro-environments/data centers
Industrial Controls
Indoor weather stations
Pin Assignments
Description
The Si7013 I
2
C Humidity and 2-Zone Temperature Sensor is a monolithic CMOS
IC integrating humidity and temperature sensor elements, an analog-to-digital
converter, signal processing, calibration data, and an I
2
C Interface. The patented
use of industry-standard, low-K polymeric dielectrics for sensing humidity enables
the construction of low-power, monolithic CMOS Sensor ICs with low drift and
hysteresis, and excellent long term stability.
The humidity and temperature sensors are factory-calibrated and the calibration
data is stored in the on-chip non-volatile memory. This ensures that the sensors
are fully interchangeable, with no recalibration or software changes required.
An auxiliary sensor input with power management can be tied directly to an
external thermistor network or other voltage-output sensor. On-board logic
performs calibration/linearization of the external input using user-programmable
coefficients. The least-significant bit of the Si7013's I
2
C address is programmable,
allowing two devices to share the same bus.
The Si7013 is available in a 3x3 mm DFN package and is reflow solderable. The
optional factory-installed cover offers a low profile, convenient means of protecting
the sensor during assembly (e.g., reflow soldering) and throughout the life of the
product, excluding liquids (hydrophobic/oleophobic) and particulates.
The Si7013 offers an accurate, low-power, factory-calibrated digital solution ideal
for measuring humidity, dew-point, and temperature, in applications ranging from
HVAC/R and asset tracking to industrial and consumer platforms.
SDA
AD0/VOUT
GNDD
GNDA
VSNS
1
2
3
4
5
Top View
10
SCL
9 VDDD
8 VDDA
7
6
VINN
VINP
Patent Protected. Patents pending
Rev. 1.0 5/14
Copyright © 2014 by Silicon Laboratories
Si7013-A10
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Si7013-A10
Functional Block Diagram
VSNS
Vdd
Si7013
Humidity
Sensor
1.25V
Ref
Calibration
Memory
AD0/VOUT
Temp
Sensor
ADC
Control Logic
VINP
VINN
Analog
Input
I
2
C Interface
SDA
SCL
GND
2
Rev. 1.0
Si7013-A10
T
ABLE
Section
OF
C
ONTENTS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
2. Typical Application Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1. Relative Humidity Sensor Accuracy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2. Hysteresis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.3. Prolonged Exposure to High Humidity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
4.4. PCB Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.5. Protecting the Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6. Bake/Hydrate Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.7. Long Term Drift/Aging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5. I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1. Issuing a Measurement Command . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5.2. Reading and Writing User Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.3. Measuring Analog Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
5.4. Nonlinear Correction of Voltage Inputs: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.5. Firmware Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.6. Heater . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
5.7. Electronic Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
6. Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
6.1. Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
7. Pin Descriptions: Si7013 (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
9. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.1. Package Outline: 3x3 10-pin DFN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
9.2. Package Outline: 3x3 10-pin DFN with Protective Cover . . . . . . . . . . . . . . . . . . . . . 40
10. PCB Land Pattern and Solder Mask Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11. Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
11.1. Si7013 Top Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
11.2. Top Marking Explanation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12. Additional Reference Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Rev. 1.0
3
Si7013-A10
1. Electrical Specifications
Unless otherwise specified, all min/max specifications apply over the recommended operating conditions.
Table 1. Recommended Operating Conditions
Parameter
Power Supply
Operating Temperature
Operating Temperature
Symbol
V
DD
T
A
T
A
I and Y grade
G grade
Test Condition
Min
1.9
–40
–40
Typ
—
—
—
Max
3.6
+125
+85
Unit
V
°C
°C
Table 2. General Specifications
1.9 < V
DD
< 3.6 V; T
A
= –40 to 85 °C (G grade) or –40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
Parameter
Input Voltage High
Input Voltage Low
Input Voltage Range
Input Leakage
Symbol
V
IH
V
IL
V
IN
I
IL
Test Condition
AD0, SCL, SDA, VSNS pins
AD0, SCL, SDA, VSNS pins
SCL, SDA, VSNS pins with respect to
GND
SCL, SDA pins; V
IN
= GND
VSNS pin (200K nominal pull up);
Vin = GND
Min
0.7xV
DD
—
0.0
—
Typ
—
—
—
—
5xV
DD
Max
—
0.3xV
DD
V
DD
1
Unit
V
V
V
μA
μA
Output Voltage Low
V
OL
SDA pin; I
OL
= 2.5 mA; V
DD
= 3.3 V
SDA pin; I
OL
= 1.2 mA;
V
DD
= 1.9 V
—
—
—
—
—
—
—
0.6
0.4
—
—
—
V
V
V
V
V
Output Voltage High
V
OH
VOUT pin, I
OH
= –0.5 mA, V
DD
= 2.0 V V
DD
– 0.2
VOUT pin, I
OH
= –10
μA
V
DD
– 0.1
VOUT pin, I
OH
= –1.7 mA, V
DD
= 3.0 V V
DD
– 0.4
Notes:
1.
Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be t
CONV
(RH) + t
CONV
(T).
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, Read Firmware Version, Read/Write
Thermistor Coefficients and Measure Analog Voltage or Thermistor Temperature. Duration is <50
μs
for all commands
except Measure Analog Voltage or Thermistor Temperature, which has <150
μs
duration when Thermistor Correction is
enabled.
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
6.
Additional current consumption when HTRE bit enabled. See Section “5.6. Heater” for more information.
4
Rev. 1.0
Si7013-A10
Table 2. General Specifications (Continued)
1.9 < V
DD
< 3.6 V; T
A
= –40 to 85 °C (G grade) or –40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
Parameter
Current Consump-
tion
Symbol
I
DD
Test Condition
RH conversion in progress
Temperature conversion in progress
Standby, –40 to +85 °C
2
Standby, –40 to +125 °C
2
Peak IDD during powerup
3
Peak IDD during I
2
C operations
4
After writing to user registers
5
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Typ
150
90
0.06
0.06
3.5
3.5
20
3.1 to 94.2
10
5.8
3.7
2.6
7
4
2.4
1.5
—
—
18
—
5
Max
180
120
0.62
3.8
4.0
4.0
—
—
12
7
4.5
3.1
10.8
6.2
3.8
2.4
7
3.1
25
80
15
Unit
μA
μA
μA
μA
mA
mA
μA
mA
Heater Current
6
Conversion Time
1
I
HEAT
t
CONV
12-bit RH
11-bit RH
10-bit RH
8-bit RH
14-bit temperature
13-bit temperature
12-bit temperature
11-bit temperature
Voltage Normal
Voltage Fast
ms
Powerup Time
t
PU
From V
DD
≥
1.9 V to ready for a
conversion, 25 °C
From VDD
≥
1.9 V to ready for a
conversion, full temperature range
After issuing a software reset
command
ms
ms
ms
Notes:
1.
Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be t
CONV
(RH) + t
CONV
(T).
2.
No conversion or I
2
C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I
2
C commands for Reset, Read/Write User Registers, Read EID, Read Firmware Version, Read/Write
Thermistor Coefficients and Measure Analog Voltage or Thermistor Temperature. Duration is <50
μs
for all commands
except Measure Analog Voltage or Thermistor Temperature, which has <150
μs
duration when Thermistor Correction is
enabled.
5.
IDD after a user register write. Initiating any other subsequent I
2
C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I
2
C devices) will transition the device to standby mode.
6.
Additional current consumption when HTRE bit enabled. See Section “5.6. Heater” for more information.
Rev. 1.0
5
MEMS sensors
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