Resistors
Thick Film Chip Arrays
BCN Series
Sulphur resistant version available (Tested to ASTM-B809)
AEC-Q200 (BCN10, BCN164AB and BCN4D)
Convex terminations
Isolated and bussed versions
All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Summary of Types
Type
BCN10
BCN164
BCN168
BCN4D
BCN31
Part Number
Start
BCN104AB
BCN164A
BCN164AB
BCN168SB
BCN168RB
BCN4D
BCN318SB
BCN318RB
3.1
1.6
0603 x 8
1206 x 4
1206 x 8
Bussed
Isolated
Bussed
1
2112
2512
Width (mm)
1.0
Resistor
Elements
0402 x 4
0603 x 4
Isolated
1206
Circuit
Package Size
0804
Scalloped
Convex
Square
Convex
Note 1
– For R/2R ladder circuit see separate BCN31L datasheet
Electrical Data
BCN10
Resistor power rating @70°C
Package power rating @70°C
Limiting element voltage
Maximum overload voltage
Resistance range
Resistance tolerance
TCR
Standard values
Ambient temperature range
°C
mW
mW
V
V
ohms
%
ppm/°C
1, 5
25
63
10R – 1M0
1, 2, 5
63
250
50
125
25
63
100R – 1M0
5
±200
E24 preferred, E96 available
-55 to +155
75
188
10R – 1M0
1, 5
BCN164
BCN168
32
BCN4D
125
500
50
125
22R – 1M0
1, 2, 5
BCN31
63
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
10.19
Resistors
Thick Film Chip Arrays
BCN Series
Circuits
Isolated
BCN 06 4, BCN 4D, BCN 10 & BCN 16 4
R1
R2
R3
R4
R1 = R2 = R3 = R4
Standard Bussed
BCN 16 8S & BCN 31 8S
10
9
8
7
6
Reverse Bussed
BCN 16 8R & BCN 31 8R
10
9
8
7
6
1
2
3
4
5
1
2
3
4
5
Environmental Data
Test
Load life
Short term overload
High temperature operation
Temperature cycling
Moisture resistance
Resistance to solder heat
Sulphur resistance
1
Note 1 – Anti-sulphur construction only
Condition
1000 hrs cyclic load @ 70°C
2.5 x rated voltage for 5s
1000 hrs @ 155°C
5 cycles, -55 to +155°C
1000 hrs @ 40°C, 95% RH
260°C for 10s
1000 hrs @ 50°C, 92% RH, 3-5ppm H
2
S
ΔR% (+0.1Ω)
3
2
3
1
3
1
0.5
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
10.19
Resistors
Thick Film Chip Arrays
BCN Series
Physical Data (Inch /mm)
Scalloped Edge: Models BCN 4D, 16 4A
BCN 2D, 2D, 4D, 16
L (BCN 4D, BCN 16 4A)
Exterior Termination (Convex)
Square Edge: Models BCN 16 4AB, 31
L (BCN 31)
L (BCN 4D, BCN 10,BCN 16 4A)
C
W
W
C
B
H
H
P
B
P
B1
L
BCN 4D
BCN 10
BCN 16 4A/ AB
BCN 31
.210 ±.008
5.34 ±0.20
.079 ±.004
2.00 ±0.10
.126 ±.004
3.20 ±0.10
.252 ±.008
6.40 ±0.20
W
.122 ±.008
3.10 ±0.20
.039 ±.004
1.00 ±0.10
.063 ±.004
1.60 ±0.10
.122+.012,-.008
3.1 +0.3, -0.2
H
.022 ±.004
0.55±0.10
.018 ±.004
0.45 ±0.10
.020 ±.004
0.50 ±0.10
.022 ±.004
0.55 ±0.10
P
.050 ±.008
1.27±0.20
.020 ±.002
0.50 ±0.05
.031 ±.002
0.80 ±0.05
.050 ±.002
1.27 ±0.051
B
.030 ±.008
0.80 ±0.20
.012 ±.002
0.30 ±0.05
.020 ±.004
0.50 ±0.10
.032 ±.004
0.80 ±0.10
B1
-
.016±.002
0.40 ±0.05
-
.041±.004
1.05±0.10
C
.012 ±.008
0.30 ±0.20
.012±.006
0.3 ±0.15
.009 ±.005
0.229 ±0.125
.012 ±.004
0.30 ±0.10
Exterior Termination (Convex)
Square Edge: Models BCN 16 8R, 8S
L
B1
T
A
W
C
P
B2
L
.126 ±.008
3.20 ±0.20
W
.063 ±.008
1.60 ±0.20
T
.020 ±.004
0.50 ±0.10
A
.012 ±.006
0.30 ±0.15
B1
.014 ±.006
0.36 ±0.15
B2
.020 ±.006
0.50 ±0.15
C
.008
0.20
P
.025
0.64
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
10.19
Resistors
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 31 Only
BCN 16 4A
Y
A
B
Y
C
X
P
Wave Solder Process
P
BCN 4D
BCN 16 4A, AB
BCN 31 8R, 8S
.050
1.27
.032
0.80
.050
1.27
A
.087
2.20
.039
1.00
.084
2.10
B
.169
4.30
.118
3.00
.148
3.70
C
.022
0.57
.014
0.35
.014
0.35
X
.028
0.70
.018
0.45
.036
0.90
Y
.041
1.05
.039
1.00
.032
0.80
A
.087
2.20
.039
1.00
.084
2.10
Re-flow Solder Process
B
.154
3.90
.118
3.00
.148
3.70
C
.022
0.57
.014
0.35
.014
0.35
X
.028
0.70
.018
0.45
.036
0.90
Y
.034
0.85
.039
1.00
.032
0.80
BCN 16 8RB / 8SB
Y
A
P
B
Y
X
X1
Wave Solder Process
P
BCN 16 8RB / 8SB
.025
0.64
A
.048
1.20
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
A
.048
1.20
Re-flow Solder Process
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
10.19
Resistors
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 10
L
Y
A
P
P1
B
X
X1
P
BCN 10
.024
0.60
P1
.020
0.50
A
.020 ±.004
0.50 ±0.10
B
.060 ±.004
1.50 ±0.10
X
010 ±.004
0.25 ±0.15
X1
.018 ±.004
0.45 ±0.10
Y
.020 ±.004
0.50 ±0.10
L
.085 ±.004
2.15 ±0.10
Construction
Passivation:
Glass or Resin
Resistor: Ruthenium Oxide
Alumina Substrate
100% Tin
Conductor
Nickel Barrier
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
10.19
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