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CDF-N08052M210,5%50PPM/KKP20

Description
Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2210000ohm, 150V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP
File Size72KB,2 Pages
ManufacturerMicrotech GmbH Electronic
Environmental Compliance
Download Datasheet Parametric View All

CDF-N08052M210,5%50PPM/KKP20 Overview

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2210000ohm, 150V, 0.5% +/-Tol, 50ppm/Cel, Surface Mount, 0805, CHIP

CDF-N08052M210,5%50PPM/KKP20 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid7248075269
package instructionCHIP
Reach Compliance Codecompliant
Country Of OriginGermany
ECCN codeEAR99
YTEOL8.25
structureRectangular
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package height0.65 mm
Package length2.15 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width1.4 mm
method of packingTR, CARDBOARD, 13 INCH
Rated power dissipation(P)0.125 W
Rated temperature70 °C
resistance2210000 Ω
Resistor typeFIXED RESISTOR
size code0805
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient50 ppm/°C
Terminal shapeWRAPAROUND
Tolerance0.5%
Operating Voltage150 V
microtech GmbH electronic Teltow
Chip resistors - Made in Germany
ISO 9001:2015
ISO 14001:2015
Thick film series - Standard
Type: CDF
Sizes: 0402, 0603, 0805, 1206
Characteristics:
Chip resistors in thick film technology
Resistance area coated with glass and varnish passivation
High stability and reliability
Tight tolerances (≥0,5%) – low temperature coefficient
RoHS-conform and Halogen-free according to IEC 61249-2-21 / IPC 4101B
Customer specific barcodes available - also in 2D
All sizes can be manufactured with the following contact variants
Electroplated pure tin
Contact with low rest permeability -N, suitable only for reflow soldering method
(The recommended storage time should not exceed 1 year after date code)
Epoxy bondable contact –K
Special corrosive gas resistant contact –S, Sulfur resistance verified according to ASTM B 809
Dimensions (in mm):
Size
L
Length
Min
Max
W
Width
Min
Max
H
Depth
Min
Max
t
Contact
back
Min
Max
T
Contact
front
Min
Max
H
t
0402
0603
0805
1206
0,95
1,50
1,85
2,90
1,05
1,70
2,15
3,35
0,45
0,75
1,10
1,45
0,55
0,95
1,40
1,75
0,25
0,35
0,35
0,35
0,40
0,55
0,65
0,65
0,10
0,10
0,15
0,25
0,35
0,50
0,60
0,75
0,05
0,10
0,15
0,15
0,35
0,50
0,60
0,75
T
L
W
Packaging units:
Reel
Ø
180 mm
330 mm
Samples on request
Card tape
acc. EN 60286-3
5 T pcs.
10 T pcs. for size 0402
10 T pcs.
20 T pcs.
.
10 T pcs. for size 0402
20 T pcs. for size 0402
Blister tape
Ordering information:
CDF
Type
-N
Contact
0603
Size
0402
0603
0805
1206
10k
1%
50ppm/K
±
TCR
50
100
K
Marking
P
Packaging
5
(optional)
R-
±
Tolerance
Value
1R
.
pcs. / Reel
(T pcs.)
CDF Standard (without
add.)
-N (non magnetic)
-K (epoxy bondable)
-S (corrosive gas
resistant)
to
.
0,5
1,0
10M
K- with
P- Card tape
Depends on
size and
(from size 0603) B- Blister tape
packaging
N- without
S- Bulk
unit
(only size 0402)
Page 1
Revision: 27-Oct-20
Catalog microtech GmbH electronic
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