EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202GA-03-1051-D

Description
Fixed Resistor, Thin Film, 0.25W, 1050ohm, 100V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 0202, CHIP
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202GA-03-1051-D Overview

Fixed Resistor, Thin Film, 0.25W, 1050ohm, 100V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 0202, CHIP

B0202GA-03-1051-D Parametric

Parameter NameAttribute value
Objectid1579388780
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance1050 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient25 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.5%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
How to get a stable voltage source
Can anyone tell me how to get a stable voltage source from a 4-20mA current loop? Thank you....
华子 Power technology
Requesting the source code for Windows Driver Model
The source code of Windows Driver Model is available on the website, but I can't download it. Can someone send a copy to my email address ch609@163.com? Thank you in advance....
lvjg Embedded System
sd driver problem solving~
My system and platform are wince5.0 + 2416. Question: After entering the wince device, insert the sd card, the system will quickly display the sd drive letter, and the sd access is also normal. Howeve...
woshiyigeren Embedded System
107USB OTG Hardware Problems
I developed my own 107 USB OTG. Are there any special things I need to pay attention to in the hardware circuit? The board has been opened, and the USB V_Bus power supply is fine, but the voltages on ...
贝多芬爵士 stm32/stm8
Do you think the Android learning method recommended by a certain training institution is reliable?
I just saw an article on someone's blog about a training organization's introduction to Android learning methods. Let's discuss, evaluate, and reflect on this method. Is this learning method really go...
Wince.Android Embedded System
pyboardCN V2 will adopt the structure of core board + expansion board
In terms of overall design, pyboardCN V2 is prepared to adopt the structure of core board + expansion board. The core board has USB, RTC, TF, LDO, user buttons, LED, expansion interface, etc.; while W...
dcexpert MicroPython Open Source section

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2798  1330  1613  1624  1649  57  27  33  34  29 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号