EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202AG-01-1260-D

Description
Fixed Resistor, Thin Film, 0.25W, 126ohm, 100V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP
CategoryPassive components    The resistor   
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202AG-01-1260-D Overview

Fixed Resistor, Thin Film, 0.25W, 126ohm, 100V, 0.5% +/-Tol, 100ppm/Cel, Surface Mount, 0202, CHIP

B0202AG-01-1260-D Parametric

Parameter NameAttribute value
Objectid1579357417
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance126 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient100 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.5%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
May 26 DIY Oscilloscope Weekly Update
We were all very excited when we got the board. We wrote programs on it and shared a lot of experiences. Mengzhilv set a good example for us and published three experiences in one night. We are very g...
zhang5157098 Microcontroller MCU
Relay and secondary circuit knowledge (3)
II. Relay-related knowledge (4) 1. How many accuracy levels does a current transformer have? Where are the different accuracy levels applicable? 2. What requirements should a current transformer meet?...
wanggq Industrial Control Electronics
HyperTerminal Problem
I successfully burned Eboot.bin and downloaded Eboot.nb0, but there is no Bootloader menu option in the HyperTerminal. Why? Sometimes it can be displayed in some test boxes. And why is there no Wince ...
dise2a Embedded System
There are Bluetooth modules and Wi-Fi modules on the PCB board.
There are two modules on the PCB board, the Bluetooth module and the Wi-Fi module. How should the antennas of these two modules be placed? Is it better to place it vertically or horizontally at 180 de...
dianhang PCB Design
Thirty-three MCU (microcontroller) input/output interface circuits
[i=s]This post was last edited by tiankai001 on 2018-12-2 18:44[/i] [b]1. Reliable logic high level I/O circuit (input) [/b][p=28, null, left][color=rgb(34, 34, 34)]The maximum voltage that the microc...
tiankai001 MCU
How to implement a 3-wire serial communication program with only output and no input
Using EZUSBFX2, some commands use 3-wire serial communication, data is only output but not input, how to implement the program...
kiney Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 519  545  2478  704  1806  11  50  15  37  10 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号