AC Film Capacitors
Motor Run
B 32 329
UL Series
UL 810
Construction
n
Dielectric: polypropylene film
n
Plastic case
n
Polyurethane resin
Features
n
Self-healing properties
n
Low dissipation factor
n
High insulation resistance
Typical applications
For general sine wave applications,
mainly as motor run capacitor
Terminals
n
Flexile lead wires
Mounting parts
n
Metal stud (max. torque = 5 Nm)
Technical data and specifications
Standard
Rated capacitance
C
N
Tolerance
Rated voltage
U
N
Rated frequency
f
N
Life expectancy
Maximum ratings
Maximum permissible voltage
U
max
Maximum permissible current
I
max
1,1 x U
N
(U
N
: rated voltage)
1,3 x I
N
(I
N
: rated current)
IEC / EN 60252 / UL810
2 .. 60 µF
±
5% ,
±10%
250 .. 450 Vac
50.. 60 Hz
10.000 h (Class B according to
IEC / EN 60252)
Issue No. 3
07/02
Page 1 of 6
AC Film Capacitors
Motor Run
B 32 329
UL Series
Technical data (cont`d)
Test data
AC test voltage terminal to terminal
U
TT
Insulation voltage terminals to case
Insulation resistance
R
is
or time constant
t
at 20 °C
Rel. Humidity
£
65 °C (minimum value)
Dissipation factor tand at 20 °C
Maximumr rate of voltage rises du/dt
max
Climatic data
Climatic category
Lower category
T
min
Upper category
T
max
Damp heat test
t
test
Permitted capacitance
DC/C
25/085/21
in accordance with IEC 60068-1
-25 °C
+85 °C
21 days
£
3%
3000 s
£
1,0 x 10
10 V/ms
-3
2 x U
N
, 60 s
2000 Vac
(120 Hz)
Note
:
It should be noted that presence of harmonics produces over voltage & over current on capacitors. Resonance may cause
serious damage to installation if a siginificant level of total harmonic distortion level exists for voltage or current. In such
cases, series reactors must be considered.
1)
Operating temperature class: In accordance with the reference standards, these temperatures are those measured on
the surface on the capacitor
Approved marks*
UL 810
(1)
EN 60252
250
(2)
, 400 and 450V
(3)
.
(1) Currently available from Epcos do Brasil
(2) Only from Epcos do Brasil, homologation in process to EPCOS India.
(3) Class C (3000h)
Issue No. 3
07/02
Page 2 of 6
Embedded System
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