4 Pad Ceramic Crystal, 2.5mm x 2.0mm
Product Features:
SMD Package
Small package Foot Print
Supplied in Tape and Reel
Compatible with Leadfree Processing
Fundamental Mode up to 60MHz
ILCX18 Series
Applications:
PCMCIA Cards
Storage
PC’s
GSM Cell Phone
Wireless Lan
USB
GSM Cell Phone
Electrical Specifications
Frequency
Equivalent Series Resistance
12MHz – 19.999999MHz
20MHz – 29.999999MHz
30MHz – 39.999999MHz
40MHz – 60MHz
Shunt Capacitance (C0)
Frequency Tolerance (at 25°C)
Frequency Stability (over Temperature)
Mode of Operation
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature Range
Storage Temperature Range
12MHz to 60MHz
100 Ohms Maximum
80 Ohms Maximum
60 Ohms Maximum
40 Ohms Maximum
3.5pF Maximum
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
Fundamental
AT Cut
8pF to 32pF or Specify
100µW Maximum
3ppm/Year
Maximum
See Part Number Guide
-40°C to +125°C
Mechanical and Solder Pad Dimensions
Part Number Guide
Sample Part Number: ILCX18 – FB1F18 – 20.000 MHz
Package
Frequency
Tolerance
B = ±50ppm
F = ±30ppm
G = ±25ppm
H = ±20ppm
ILCX18 -
I = ±15ppm
J = ±10ppm
Frequency
Stability
B = ±50ppm
F = ±30ppm
G = ±25ppm
H = ±20ppm
I = ±15ppm**
J = ±10ppm**
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C*
8 = -30°C to +85°C*
9 = -10°C to +50°C
D = -10°C to +105°C*
E = -40°C to +105°C*
Mode of
Operations
Load Capacitance
Frequency
F = Fundamental
8pF to 32pF or
Specify
- 20.000 MHz
** Not available at all frequencies.
* Not available for all frequency stability options.
Rev: 09/26/18_H
Page 1 of 2
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
4 Pad Ceramic Crystal, 2.5mm x 2.0mm
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak Temperature
ILCX18 Series
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10
seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Package Information:
MSL = 1
Termination = e4 (Au over Ni over W base metallization)
Tape and Reel Information:
PITCH
TAPE WIDTH
REEL DIA
QTY PER REEL
4.00
8.00
180
3,000
Environmental Specifications:
Thermal Shock
Moisture Resistance
Mechanical Shock
Mechanical Vibration
Resistance to Soldering Heat
Hazardous Substance
Solderability
Terminal Strength
Gross Leak
Fine Leak
Solvent Resistance
MIL-STD-883, Method 1011, Condition A
MIL-STD-883, Method 1004
MIL-STD-883, Method 2002, Condition B
MIL-STD-883, Method 2007, Condition A
J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max)
Pb-Free / RoHS / Green Compliant
JESD22-B102-D Method 2 (Preconditioning E)
MIL-STD-883, Method 2004, Test Condition D
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s
MIL-STD-202, Method 215
Marking:
Line 1: I-Date Code (Date Code = YWW)
Line 2: Frequency
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 09/26/18_H
Page 2 of 2
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