Resistors
Thick Film Chip Arrays
BCN Series
Sulphur resistant version available (Tested to ASTM-B809)
AEC-Q200 (BCN10, BCN164AB and BCN4D)
Convex terminations
Isolated and bussed versions
Note - BCN4D will be End of Life in September 2021
All parts are Pb-free and comply with EU Directive 2011/65/EU amended by (EU) 2015/863 (RoHS3)
Summary of Types
Type
BCN10
BCN164
BCN168
BCN4D
Part Number
Start
BCN104AB
BCN164A
BCN164AB
BCN168SB
BCN168RB
BCN4D
3.1
1.6
0603 x 8
1206 x 4
Bussed
Isolated
2112
Width (mm)
1.0
Resistor
Elements
0402 x 4
0603 x 4
Isolated
1206
Circuit
Package Size
0804
Scalloped
Convex
Square
Convex
Electrical Data
BCN10
Resistor power rating @70°C
Package power rating @70°C
Limiting element voltage
Maximum overload voltage
Resistance range
Resistance tolerance
TCR
Standard values
Ambient temperature range
°C
mW
mW
V
V
ohms
%
ppm/°C
1, 5
25
63
10R – 1M0
1, 2, 5
±200
E24 (for 2% or 5% tolerance), E96 (for 1% tolerance)
-55 to +155
63
250
50
125
25
63
100R – 1M0
5
BCN164
BCN168
32
BCN4D
125
500
75
188
10R – 1M0
1, 5
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
03.21
Thick Film Chip Arrays
BCN Series
Circuits
Isolated
BCN4D, BCN10 & BCN16 4
R1
R2
R3
R4
R1 = R2 = R3 = R4
Standard Bussed
BCN168S
10
9
8
7
6
Reverse Bussed
BCN168R
10
9
8
7
6
1
2
3
4
5
1
2
3
4
5
Environmental Data
Test
Load life
Short term overload
High temperature operation
Temperature cycling
Moisture resistance
Resistance to solder heat
Sulphur resistance
1
Note 1 – Anti-sulphur construction only
Condition
1000 hrs cyclic load @ 70°C
2.5 x rated voltage for 5s
1000 hrs @ 155°C
5 cycles, -55 to +155°C
1000 hrs @ 40°C, 95% RH
260°C for 10s
1000 hrs @ 50°C, 92% RH, 3-5ppm H
2
S
ΔR% (+0.1Ω)
3
2
3
1
3
1
0.5
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
03.21
Thick Film Chip Arrays
BCN Series
Physical Data (Inch /mm)
BCN4D, BCN164A (scalloped convex)
L
BCN10, BCN164AB (square convex)
L
C
W
W
C
B
H
H
P
B
P
B1
L
BCN 4D
BCN 10
BCN 16 4A/ AB
.210 ±.008
5.34 ±0.20
.079 ±.004
2.00 ±0.10
.126 ±.004
3.20 ±0.10
W
.122 ±.008
3.10 ±0.20
.039 ±.004
1.00 ±0.10
.063 ±.004
1.60 ±0.10
H
.022 ±.004
0.55±0.10
.018 ±.004
0.45 ±0.10
.020 ±.004
0.50 ±0.10
P
.050 ±.008
1.27±0.20
.020 ±.002
0.50 ±0.05
.031 ±.002
0.80 ±0.05
B
.030 ±.008
0.80 ±0.20
.012 ±.002
0.30 ±0.05
.020 ±.004
0.50 ±0.10
B1
-
.016±.002
0.40 ±0.05
-
C
.012 ±.008
0.30 ±0.20
.012±.006
0.3 ±0.15
.009 ±.005
0.229 ±0.125
BCN168 (square convex)
L
B1
T
A
W
C
P
B2
L
.126 ±.008
3.20 ±0.20
W
.063 ±.008
1.60 ±0.20
T
.020 ±.004
0.50 ±0.10
A
.012 ±.006
0.30 ±0.15
B1
.014 ±.006
0.36 ±0.15
B2
.020 ±.006
0.50 ±0.15
C
.008
0.20
P
.025
0.64
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
03.21
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN4D, BCN164
Y
A
B
Y
C
X
P
Wave Solder Process
P
BCN 4D
BCN 16 4A, AB
.050
1.27
.032
0.80
A
.087
2.20
.039
1.00
B
.169
4.30
.118
3.00
C
.022
0.57
.014
0.35
X
.028
0.70
.018
0.45
Y
.041
1.05
.039
1.00
A
.087
2.20
.039
1.00
Re-flow Solder Process
B
.154
3.90
.118
3.00
C
.022
0.57
.014
0.35
X
.028
0.70
.018
0.45
Y
.034
0.85
.039
1.00
BCN168
BCN 16 8RB / 8SB
Y
A
P
B
Y
X
X1
Wave Solder Process
P
BCN 16 8RB / 8SB
.025
0.64
A
.048
1.20
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
A
.048
1.20
Re-flow Solder Process
B
.096
2.40
X
.012
0.30
X1
.018
0.45
Y
.024
0.60
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
03.21
Thick Film Chip Arrays
BCN Series
Solder pad layout (Inch / mm)
BCN 10
L
Y
A
P
P1
B
X
X1
P
BCN 10
.024
0.60
P1
.020
0.50
A
.020 ±.004
0.50 ±0.10
B
.060 ±.004
1.50 ±0.10
X
010 ±.004
0.25 ±0.15
X1
.018 ±.004
0.45 ±0.10
Y
.020 ±.004
0.50 ±0.10
L
.085 ±.004
2.15 ±0.10
Construction
Passivation:
Glass or Resin
Resistor: Ruthenium Oxide
Alumina Substrate
100% Tin
Conductor
Nickel Barrier
General Note
TT Electronics reserves the right to make changes in product specification without notice or liability.
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.
BI Technologies IRC Welwyn
www.ttelectronics.com/resistors
© TT Electronics plc
03.21
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