AHC/VHC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERPACK-16
| Parameter Name | Attribute value |
| package instruction | DFP, |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Other features | 3 ENABLE INPUTS |
| series | AHC/VHC |
| JESD-30 code | R-GDFP-F16 |
| length | 9.6645 mm |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Output polarity | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Certification status | Not Qualified |
| Maximum seat height | 2.032 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 6.604 mm |
| Base Number Matches | 1 |
| 54VHC138W/883 | 74VHC138J/883 | 74VHC138E/883 | 74VHC138W/883 | |
|---|---|---|---|---|
| Description | AHC/VHC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERPACK-16 | AHC/VHC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDIP16, CERAMIC, DIP-16 | AHC/VHC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CQCC20, CERAMIC, LCC-20 | AHC/VHC SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, CDFP16, CERPACK-16 |
| package instruction | DFP, | DIP, | QCCN, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknow |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Other features | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS | 3 ENABLE INPUTS |
| series | AHC/VHC | AHC/VHC | AHC/VHC | AHC/VHC |
| JESD-30 code | R-GDFP-F16 | R-GDIP-T16 | S-CQCC-N20 | R-GDFP-F16 |
| length | 9.6645 mm | 19.43 mm | 8.89 mm | 9.6645 mm |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 16 | 16 | 20 | 16 |
| Maximum operating temperature | 125 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -55 °C | -40 °C | -40 °C | -40 °C |
| Output polarity | INVERTED | INVERTED | INVERTED | INVERTED |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DFP | DIP | QCCN | DFP |
| Package shape | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 2.032 mm | 5.08 mm | 1.905 mm | 2.032 mm |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V |
| surface mount | YES | NO | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | FLAT | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | DUAL | QUAD | DUAL |
| width | 6.604 mm | 7.62 mm | 8.89 mm | 6.604 mm |
| Base Number Matches | 1 | 1 | 1 | - |
| Maker | - | Texas Instruments | Texas Instruments | Texas Instruments |
| propagation delay (tpd) | - | 18 ns | 18 ns | 18 ns |