Excellent stability in different environmental conditions
Best in class pulse load capability
AEC – Q200 Qualified
Intrinsic sulfur resistance
RoHs & REACH Compliant
Type
Historical Part Number
Nominal Power
P
70
Rating
Resistance Range
(Other values upon request)
E-Series
Tolerances
Temperature Coefficient
IEC60115-1 clause 4.2 ; 4.8
(+20 / -55[°C] and (+20 /
+125[°C])
Working Temperature Range
Permissible film temperature
(
ϑ
F max.)
Max. Working Voltage
Dielectric Withstanding
Voltage
IEC115-1 clause 4.7 (1[min])
±[%]
±[10 K ]
[ºC]
[ºC]
[AC or DC]
RMS
[V]
RMS
-6* -1
ZCM102
SMD
[W]
[Ω]
Min
Máx
-
0,2
10R
2M21
B = 0,1%, F = 1%
ZCM204
ZC0204
0,4
0R22
10M
E24 / E96 / E192
ZCM207
ZC0207
1,0
0R16
10M
B = 0,1% , C = 0,25% , D = 0,5% , F = 1% , G = 2% , J = 5%
Depends on the value, please check the table below
-55 … +125
125
150
200
200
300
-55 … +155
155
350
500
Type
ZCM102
ZCM204
ZCM207
5,8 +0 /-0,3
2,2 ±0,2
2,6 min.
D +0 /-0,2
1,25 ±0,2
77
Recommended solder pads dimensions
Type
ZCM102
ZCM204
ZCM207
Wave soldering
I
0.7
1,5
2,4
a
1.2
1,5
2,3
b
1.5
1,8
2,6
c
3.1
4,5
7,0
I
1.1
1,7
2,6
Reflow soldering
a
0.8
1,2
2,0
b
1.3
1,6
24
c
2.7
4,1
6,6
1
1
File Nr. 3900.18-450.113.20 |
Revision: 202010
Historical
P/N:
-
ZC0204
ZC0207
L
2,2
+0 /-0,15
Ø
D
L
1
1,2
min.
1,8 min.
Ø
D
1
A
0,40
±0,05
0,80 ±0,10
MASS
(mg)
1,1
+0 /-0,1
D
+0 /-0,1
D +0 /-0,15
7
22
3,6 +0 /-0,2 1,4 +0 /-0,1
ZCM Series Datasheet
Type
Historical Part Number
Climatic Category
Short Time Overload
Standard
IEC60115-1 clause 4.13
(U=2,5*
[s])
,
≤2*
U
max,
5
ZCM102
-
0,1 (<211kΩ) ;
0,15(>211kΩ)
-
-
ZCM204
ZC0204
55/155/56
0,03 (≤1M) ; 0,15 (>1M)
0,05
(≤1M) ; 0,15 (>1M)
0,15
0,15
0,15
0,3
≤ 0,1
ZCM207
ZC0207
0,03 (≤1M) ; 0,15 (>1M)
0,05
(≤1M) ; 0,15 (>1M)
0,25
0,5
0,15
0,3
operation
Single pulse high
voltage overload
10[µs]/700[µs]
Power
operation
Standard
operation
Power
operation
Standard
operation
Power
operation
±[%]
IEC60115-1 clause 4.27
(U=10*
,
Severity 4, 10 pulses
±[%]
-
-
Periodic electric
overload
(U=15*
2.5[s]off,1000 cycles
cont. lev.)
IEC60115-1 clause 4.39
±[%]
[10
-9
h
-1
]
±[%]
±[%]
±[%]
±[%]
1000h
8000h
1000h
8000h
1000h
8000h
125ºC
155ºC
,
0.1[s]on,
-
Failure Rate
(Total,
ϑ0 ,
max, 60[%]
Endurance at 70ºC,
IEC60115-1 clause
4.25.1
(U=
0,5[h]OFF)
U
max,
, 1,5[h]ON ;
Precision
operation
Standard
operation
Power
operation
-
-
0,25 (<211kΩ) ;0,5(>211kΩ)
0,5 (<211kΩ) ; 1 (>211kΩ)
-
-
0,25 (<211kΩ) ; 1 (>211kΩ)
-
0,5 (<211kΩ) ; 1 (>211kΩ)
0.05 (10R≤1M)
0.1 (10R≤1M)
0.15 (<10R) ; 0.1 (10R≤1M) ; 0.25
0.3 (<10R) ; 0.2 (10R≤1M) ; 0.5
0.25
0.5
0,15
(≤1M) ; 0,5 (>1M)
0,3
(≤1M) ; 1 (>1M)
0,25 (≤ 1M) ; 1 (>1M)
Endurance at upper Category
Temp.
IEC60115-1 clause 4.25.3
( 1000[h]
0.05 (10R≤1M)
0.1 (10R≤1M)
0.15 (≤1M) ; 0.5 (>1M)
0.3 (≤1M) ; 1 (>1M)
0,25
(≤1M) ; 0,5 (>1M)
0,5 (≤1M) ; 1 (>1M)
0.15 (<10R) ; 0.1 (10R≤1M) ; 0.25
(>1M)
0.3 (<10R) ; 0.2 (10R≤1M) ; 0.5
(>1M)
0,25 (≤ 1M) ; 1 (>1M)
Damp Heat, Steady State
IEC60115-1 clause 4.24
(40 [°C], 93 [% r.h.], 56[d])
±2
±3
±[%]
Damp Heat, Steady State,
Accelerated
IEC60115-1 clause 4.37
(85
±2
[°C], 85
±5
[%RH], U = 0.3*
±[%]
-55~125ºC
-
-
-
0,25 (≤ 1M) ; 2 (>1M)
0,25
0,5
0,5 (≤ 1M) ; 2 (>1M)
0,25
0,5
Temperature Cycling
( 30[min] each , 1000 cycles)
)
IEC60068-2-14 ; IEC60115-1 clause
4.19
±[%]
-55~155ºC
Vibration
IEC60068-2-6 ; IEC60115-1 clause
4.22
(10;2000[Hz],
≤1,5[mm]
, or
≤200[m/s
]
7,5[h])
2
±[%]
-
0,05 (≤ 1M) ; 0,1 (>1M)
0,05
Resistance to Soldering Heat
IEC60115-1 clause 4.18
±5
±1
±[%]
±[%]
(260 [°C], 10 [s])Solder bath method
0,1 (<211kΩ) ;
0,25(>211kΩ)
-
0,1 (≤
10R) ; 0,05 (>10R)
0,1 (≤ 10R)
; 0,05 (>10R)
Electrostatic Discharge
IEC60115-1 clause 4.38 ; IEC61340-
3-1
( 3 positives + 3 negatives discharges)
0,5 [2 kV]
0,5 [4 kV]
File Nr. 3900.18-450.113.20 |
Revision: 202010
Voltage proof
Flammability
IEC60115-1 clause 4.7
U
RMS
=U
INS
, 60 [s]
IEC60115-1 clause 4.35, IEC60695-
11-5
Needle flame test, 10[s]
-
No flash over or breakdown
-
No burning after 30[s]
Solderability
IEC60068-2-20 ; IEC60115-1 clause
4.17
(235
±3
[ºC] 2
±0,2
[s],SnAg
3
Cu
0.5
or SnAg
3.5
)
-
≥ 95% covered, no visible damage
2
1
ZCM Series Datasheet
Component Resistance to
Solvents
(50[ºC] method 2)
IEC60068-2-45 ; IEC60115-1 clause
4.29
No visible damage
Resistance to solvents of
Marking
(50[ºC] method 1)
IEC60068-2-45 ; IEC60115-1 clause
4.30
Marking visible , no visible damage
Marking
IEC60062
Color code
•
ZCM204
NOTES: MARKING [COLOR CODE]:
•
ZCM207
Color code marking is applied according to IEC 60062 in four (E24 series) or six bands (E96 series). Each color band appears as a single
Zero ohm jumpers
are marked with one centered black band.
Color code marking is applied according to IEC 60062 in four bands (E24 series) for 5 % tolerance, or in five bands (E96 or E192 series). Each color band appears as a single solid
line, voids are permissible if at least
2/3
of the band is visible from each radial angle of view. The last color band for tolerance is approximately 50 % wider than the other bands.
2/
of the band is visible from each radial angle of view. The last color band represents the TCR for resistors with TCR
≤50
ppm/K and nominal tolerance
≤1
%.
3
solid line, voids are permissible if at least
ZCM102
-
-
10R…2M21
-
-
-
100R… 100K
-
-
100R… 100K
Jumper
I
max
= 2A
ZCM204
Resistance range
0R22 … 0R91
0R82… 10M
10R… 1M65
10R… 1M65
22R… 1M65
22R… 1M65
10R… 221K
22R… 221K
43R… 221K
Jumper
I
max
= 3A
ZCM207
0R16 … 0R91
0R22 … 0R91
1R… 10M
1R… 2M21
43R… 1M
43R… 1M
43R… 1M
100R… 511K
100R… 511K
100R… 511K
Jumper
I
max
= 5A
Tolerance
± 5%
± 2%
± 1%
± 0,5%
± 0,5%
± 0,25%
± 0,1%
± 0,5%
± 0,25%
± 0,1%
≤ 10 mΩ
TCR
± 100 ppm/K
± 50 ppm/K
± 25 ppm/K
E-Series
E24
E24 / E96
E24 / E192
E24 / E192
± 15 ppm/K
E24 / E192
The body coating color is light green for jumpers and for a temperature coefficient of ±50 or 100 [ppm], pink for ±25[ppm] and violet for ±15[ppm]
A suitable low thermal resistance of the circuit board assembly must be safeguarded in order to maintain the film temperature of the resistors within the specified limits.
EVC4.0+sp3+ppc2003, all works fine on my colleague's machine. When I install it on my machine, the compile time is acceptable, but the single-step debugging becomes super slow, and it takes more than ...
As the title says: CCS is V3.3, the emulator is the Development Board Home Enhanced USB Emulator, make sure the driver has been successfully installed before setting up
According to the instructions, ...
Yesterday at around nine o'clock on the subway, a big boy put his schoolbag on the ground and picked up his guitar. I thought he was just another subway singer, so I sat there and didn't take it serio...
Advertisement: The current economical boyfriend is for sale. All parts are intact. Fully functional. Healthy and cute. Cheap and good quality. Super value and durable! With camera (add QQ to see). Mod...
By controlling supply voltages for the RF power amplifier in a CDMA/W-CDMA cellular phone, you can improve the PA efficiency, minimize heat, and dramatically extend the phone''s data/talk time.To meet...
On August 24th, Jin Yuzhi, CEO of Huawei's Intelligent Automotive Solutions BU, announced the first automotive application of Huawei Qiankun's unique Limera technology. This technology eliminates t...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
EtherCAT (Ethernet for Control Automation Technology) is a real-time industrial fieldbus communication protocol based on an Ethernet-based development framework. EtherCAT is one of the fastest indu...[Details]
introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
The most significant feature of IPS panels is that both electrodes are located on the same surface, unlike other LCD panels, which have electrodes arranged on top and bottom surfaces in a three-dim...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
With the increasing number of new energy vehicles on the road, the deployment of supporting facilities for these vehicles has accelerated, and new energy vehicles have gradually entered the vision ...[Details]
Reflow soldering is one of the most commonly used methods in electronics manufacturing, allowing for the soldering of large numbers of components in a relatively short time. However, any experience...[Details]
"We have successfully launched the first version of our dedicated chip for EMB brake-by-wire. Second-generation samples have also been successfully completed, and we are actively planning a third-g...[Details]
Over the past decade, the narrative surrounding fuel vehicles has been one of decline and replacement. Under the onslaught of new energy vehicles, traditional automakers have been forced to acceler...[Details]
Electric vehicles will revolutionize transportation, changing fuel consumption, carbon emissions, costs, maintenance, and driving habits. Currently, a major selling point for electric vehicles is t...[Details]
Civilian internal combustion engines operate in the range of approximately 1000-4000 rpm. This results in the engine's kinetic energy being ineffective at low or high rpm, making starting difficult...[Details]
"I want to ask why there are so many manufacturers making mobile phone CPUs, but only Intel and AMD make computer CPUs?"
The progress of domestic PC CPU production has disappointed many ...[Details]
introduction
With the development of society, people's requirements for the quality of refrigerated and frozen foods are constantly improving. The changes in food appearance and nutritional co...[Details]
Embedded System
京公网安备 11010802033920号
EEWORLD
