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W78E058DDG

Description
IC mcu 8-bit 32k flash 40-dip
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size845KB,90 Pages
ManufacturerNuvoton Technology Corporation
Websitehttp://www.nuvoton.com.cn/hq/
Environmental Compliance
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W78E058DDG Overview

IC mcu 8-bit 32k flash 40-dip

W78E058DDG Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNuvoton Technology Corporation
package instructionDIP, DIP40,.6
Reach Compliance Codecompliant
Has ADCNO
Address bus width16
bit size8
boundary scanNO
CPU series8052
maximum clock frequency40 MHz
DAC channelNO
DMA channelNO
External data bus width8
FormatFIXED POINT
Integrated cacheNO
JESD-30 codeR-PDIP-T40
length52.2 mm
low power modeYES
Number of external interrupt devices2
Number of I/O lines32
Number of serial I/Os1
Number of terminals40
On-chip program ROM width8
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
PWM channelNO
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP40,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
RAM (number of words)512
rom(word)36864
ROM programmabilityFLASH
Maximum seat height5.33 mm
speed40 MHz
Maximum slew rate0.05 mA
Maximum supply voltage5.5 V
Minimum supply voltage2.4 V
Nominal supply voltage3.3 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
width15.24 mm
uPs/uCs/peripheral integrated circuit typeMICROCONTROLLER
W78E516D/W78E058D Data Sheet
8-BIT MICROCONTROLLER
Table of Contents-
1
2
3
4
5
6
7
GENERAL DESCRIPTION ......................................................................................................... 4
FEATURES ................................................................................................................................. 5
PARTS INFORMATION LIST ..................................................................................................... 6
3.1
Lead Free (RoHS) Parts information list......................................................................... 6
PIN CONFIGURATIONS............................................................................................................. 7
PIN DESCRIPTIONS .................................................................................................................. 9
BLOCK DIAGRAM .................................................................................................................... 10
FUNCTIONAL DESCRIPTION.................................................................................................. 11
7.1
On-Chip Flash EPROM ................................................................................................ 11
7.2
I/O Ports........................................................................................................................ 11
7.3
Serial I/O ....................................................................................................................... 11
7.4
Timers ........................................................................................................................... 11
7.4.1
Clock ..............................................................................................................................12
7.5
7.6
7.7
Interrupts....................................................................................................................... 12
Data Pointers ................................................................................................................ 12
Architecture................................................................................................................... 12
7.7.1
7.7.2
7.7.3
7.7.4
7.7.5
7.7.6
7.7.7
ALU ................................................................................................................................12
Accumulator ...................................................................................................................12
B Register.......................................................................................................................12
Program Status Word .....................................................................................................12
Stack Pointer ..................................................................................................................13
Scratch-pad RAM ...........................................................................................................13
AUX-RAM.......................................................................................................................13
8
MEMORY ORGANIZATION...................................................................................................... 14
8.1
Program Memory (on-chip Flash) ................................................................................. 14
8.2
Scratch-pad RAM and Register Map ............................................................................ 14
8.2.1
8.2.2
8.2.3
8.2.4
Working Registers ..........................................................................................................16
Bit addressable Locations ..............................................................................................16
Stack ..............................................................................................................................16
AUX-RAM.......................................................................................................................16
9
10
11
12
13
SPECIAL FUNCTION REGISTERS ......................................................................................... 17
9.1
SFR Detail Bit Descriptions .......................................................................................... 19
INSTRUCTION.......................................................................................................................... 37
INSTRUCTION TIMING ............................................................................................................ 45
POWER MANAGEMENT.......................................................................................................... 46
12.1 Idle Mode ...................................................................................................................... 46
12.2 Power Down Mode ....................................................................................................... 46
RESET CONDITIONS............................................................................................................... 47
Publication Release Date: Feb 15, 2011
Revision A09
-1-

W78E058DDG Related Products

W78E058DDG W78E516DPG W78E516DFG W78E058DPG W78E058DFG
Description IC mcu 8-bit 32k flash 40-dip IC mcu 8-bit 64k flash 44-plcc IC mcu 8-bit 64k flash 44-pqfp IC mcu 8-bit 32k flash 44-plcc IC MCU 8BIT 32KB FLASH 44QFP
Is it Rohs certified? conform to conform to conform to conform to conform to
Maker Nuvoton Technology Corporation Nuvoton Technology Corporation Nuvoton Technology Corporation Nuvoton Technology Corporation Nuvoton Technology Corporation
package instruction DIP, DIP40,.6 PLCC-44 PQFP-44 PLCC-44 QFP, QFP44,.52SQ,32
Reach Compliance Code compliant compli compli compliant compliant
Has ADC NO NO NO NO NO
Address bus width 16 16 16 16 16
bit size 8 8 8 8 8
boundary scan NO NO NO NO NO
CPU series 8052 8052 8052 8052 8052
maximum clock frequency 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
DAC channel NO NO NO NO NO
DMA channel NO NO NO NO NO
External data bus width 8 8 8 8 8
Format FIXED POINT FIXED POINT FIXED POINT FIXED POINT FIXED POINT
Integrated cache NO NO NO NO NO
JESD-30 code R-PDIP-T40 S-PQCC-J44 S-PQFP-G44 S-PQCC-J44 S-PQFP-G44
length 52.2 mm 16.59 mm 10 mm 16.59 mm 10 mm
low power mode YES YES YES YES YES
Number of external interrupt devices 2 4 4 4 4
Number of I/O lines 32 36 36 36 36
Number of serial I/Os 1 1 1 1 1
Number of terminals 40 44 44 44 44
On-chip program ROM width 8 8 8 8 8
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C
PWM channel NO NO NO NO NO
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code DIP QCCJ QFP QCCJ QFP
Encapsulate equivalent code DIP40,.6 LCC44,.65SQ QFP44,.52SQ,32 LCC44,.65SQ QFP44,.52SQ,32
Package shape RECTANGULAR SQUARE SQUARE SQUARE SQUARE
Package form IN-LINE CHIP CARRIER FLATPACK CHIP CARRIER FLATPACK
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
RAM (number of words) 512 512 512 512 512
rom(word) 36864 69632 69632 36864 36864
ROM programmability FLASH FLASH FLASH FLASH FLASH
Maximum seat height 5.33 mm 4.7 mm 2.7 mm 4.7 mm 2.7 mm
speed 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Maximum slew rate 0.05 mA 0.05 mA 0.05 mA 0.05 mA 0.05 mA
Maximum supply voltage 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
Minimum supply voltage 2.4 V 2.4 V 2.4 V 2.4 V 2.4 V
Nominal supply voltage 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form THROUGH-HOLE NO LEAD GULL WING NO LEAD GULL WING
Terminal pitch 2.54 mm 1.27 mm 0.8 mm 1.27 mm 0.8 mm
Terminal location DUAL QUAD QUAD QUAD QUAD
width 15.24 mm 16.59 mm 10 mm 16.59 mm 10 mm
uPs/uCs/peripheral integrated circuit type MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER

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