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KMPC8541EPXAPF

Description
IC mpu powerquicc iii 783-fcpbga
Categorysemiconductor    The embedded processor and controller   
File Size1MB,88 Pages
ManufacturerFREESCALE (NXP)
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IC mpu powerquicc iii 783-fcpbga

Freescale Semiconductor
Technical Data
MPC8541EEC
Rev. 4.2, 1/2008
MPC8541E PowerQUICC™ III
Integrated Communications Processor
Hardware Specification
The MPC8541E integrates a PowerPC™ processor core
built on Power Architecture™ technology with system logic
required for networking, telecommunications, and wireless
infrastructure applications. The MPC8541E is a member of
the PowerQUICC™ III family of devices that combine
system-level support for industry-standard interfaces with
processors that implement the embedded category of the
Power Architecture technology. For functional
characteristics of the processor, refer to the
MPC8555E
PowerQUICC™ III Integrated Communications Processor
Reference Manual.
To locate any published errata or updates for this document
refer to http://www.freescale.com or contact your Freescale
sales office.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 7
Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12
Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 15
DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Ethernet: Three-Speed, MII Management . . . . . . . . . . 21
Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . . 54
Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
System Design Information . . . . . . . . . . . . . . . . . . . . . 76
Document Revision History . . . . . . . . . . . . . . . . . . . . 83
Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . 84
© Freescale Semiconductor, Inc., 2008. All rights reserved.

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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