KMPC8555EVTAPF datasheet, PDF - EEWORLD Datasheet

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KMPC8555EVTAPF: DescriptionIC mpu powerquicc iii 783-fcpbga; Categorysemiconductor The embedded processor and controller; File Size1MB，88 Pages; ManufacturerFREESCALE (NXP); Environmental Compliance

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Freescale Semiconductor

Technical Data

MPC8555EEC

Rev. 4.2, 1/2008

MPC8555E PowerQUICC™ III

Integrated Communications Processor

Hardware Specification

The MPC8555E integrates a PowerPC™ processor core

built on Power Architecture™ technology with system logic

required for networking, telecommunications, and wireless

infrastructure applications. The MPC8555E is a member of

the PowerQUICC™ III family of devices that combine

system-level support for industry-standard interfaces with

processors that implement the embedded category of the

Power Architecture technology. For functional

characteristics of the processor, refer to the

MPC8555E

PowerQUICC™ III Integrated Communications Processor

Reference Manual.

To locate any published errata or updates for this document

refer to http://www.freescale.com or contact your Freescale

sales office.

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Contents

Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 8

Power Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 13

Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

RESET Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . 16

DDR SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

DUART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Ethernet: Three-Speed, MII Management . . . . . . . . . . 22

Local Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

CPM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43

JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

I2C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

PCI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

Package and Pin Listings . . . . . . . . . . . . . . . . . . . . . . . 56

Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66

Thermal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69

System Design Information . . . . . . . . . . . . . . . . . . . . . 78

Document Revision History . . . . . . . . . . . . . . . . . . . . 85

Device Nomenclature . . . . . . . . . . . . . . . . . . . . . . . . . 86

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