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MT8889CN1

Description
IC txrx dtmf 24ssop
CategoryWireless rf/communication    Telecom circuit   
File Size361KB,24 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Environmental Compliance
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MT8889CN1 Overview

IC txrx dtmf 24ssop

MT8889CN1 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerMicrosemi
Parts packaging codeSSOP
package instructionSSOP, SSOP24,.3
Contacts24
Reach Compliance Codecompliant
JESD-30 codeR-PDSO-G24
JESD-609 codee3
length8.2 mm
Number of functions1
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP24,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height2 mm
Maximum slew rate11 mA
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Telecom integrated circuit typesDTMF SIGNALING CIRCUIT
Temperature levelINDUSTRIAL
Terminal surfaceMATTE TIN
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperature30
width5.3 mm
MT8889C
Integrated DTMF Transceiver
with Adaptive Micro Interface
Data Sheet
Features
Central office quality DTMF transmitter/receiver
Low power consumption
High speed adaptive micro interface
Adjustable guard time
Automatic tone burst mode
Call progress tone detection to -30 dBm
Ordering Information
MT8889CE
MT8889CS
MT8889CN
MT8889CE1
MT8889CS1
MT8889CN1
MT8889CSR
MT8889CSR1
*Pb
20 Pin PDIP
20 Pin SOIC
24 Pin SSOP
20 Pin PDIP*
20 Pin SOIC*
24 Pin SSOP*
20 Pin SOIC
20 Pin SOIC*
Free Matte Tin
Tubes
Tubes
Tubes
Tubes
Tubes
Tubes
Tape & Reel
Tape & Reel
July 2008
Applications
Credit card systems
Paging systems
Repeater systems/mobile radio
Interconnect dialers
Personal computers
-40°C to +85°C
Description
The MT8889C is a monolithic DTMF transceiver with
call progress filter. It is fabricated in CMOS technology
offering low power consumption and high reliability.
The receiver section is based upon the industry
standard MT8870 DTMF receiver while the transmitter
utilizes a switched capacitor D/A converter for low
distortion, high accuracy DTMF signalling. Internal
counters provide a burst mode such that tone bursts
can be transmitted with precise timing. A call progress
filter can be selected allowing a microprocessor to
analyze call progress tones.
The MT8889C utilizes an adaptive micro interface,
which allows the device to be connected to a number
of popular microcontrollers with minimal external logic.
TONE
D/A
Converters
Row and
Column
Counters
Transmit Data
Register
Status
Register
Control
Register
A
Control
Register
B
Data
Bus
Buffer
D0
D1
D2
D3
IRQ/CP
Tone Burst
Gating Cct.
IN+
IN-
GS
OSC1
OSC2
Oscillator
Circuit
Bias
Circuit
V
DD
V
Ref
V
SS
+
-
Dial
Tone
Filter
Control
Logic
Interrupt
Logic
High Group
Filter
Low Group
Filter
Control
Logic
Digital
Algorithm
and Code
Converter
DS/RD
I/O
Control
CS
R/W/WR
RS0
Steering
Logic
Receive Data
Register
ESt
St/GT
Figure 1 - Functional Block Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003-2008, Zarlink Semiconductor Inc. All Rights Reserved.

MT8889CN1 Related Products

MT8889CN1 MT8889CE1 MT8889CS1 MT8889CSR
Description IC txrx dtmf 24ssop IC txrx dtmf 20dip IC txrx dtmf 20soic DTMF Signaling Circuit, CMOS, PDSO20,
Is it lead-free? Lead free Lead free Lead free Contains lead
Is it Rohs certified? conform to conform to conform to incompatible
Maker Microsemi Microsemi Microsemi Microsemi
Parts packaging code SSOP DIP SOIC SOIC
Contacts 24 20 20 20
Reach Compliance Code compliant compli unknown unknown
JESD-30 code R-PDSO-G24 R-PDIP-T20 R-PDSO-G20 R-PDSO-G20
Number of terminals 24 20 20 20
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP DIP SOP SOP
Encapsulate equivalent code SSOP24,.3 DIP20,.3 SOP20,.4 SOP20,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE SMALL OUTLINE
power supply 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Maximum slew rate 11 mA 10 mA 10 mA 11 mA
Nominal supply voltage 5 V 5 V 5 V 5 V
surface mount YES NO YES YES
technology CMOS CMOS CMOS CMOS
Telecom integrated circuit types DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT DTMF SIGNALING CIRCUIT
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING
Terminal pitch 0.65 mm 2.54 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL
package instruction SSOP, SSOP24,.3 DIP, DIP20,.3 0.300 INCH, LEAD FREE, MS-013AC, SOIC-20 -
JESD-609 code e3 e3 e3 -
length 8.2 mm 25.905 mm 12.8 mm -
Number of functions 1 1 1 -
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED 260 -
Maximum seat height 2 mm 5.33 mm 2.65 mm -
Terminal surface MATTE TIN MATTE TIN MATTE TIN -
Maximum time at peak reflow temperature 30 NOT SPECIFIED 30 -
width 5.3 mm 7.62 mm 7.5 mm -
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