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MCIMX257DJM4

Description
32-BIT, 400MHz, MICROPROCESSOR, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size1MB,153 Pages
ManufacturerFREESCALE (NXP)
Environmental Compliance
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MCIMX257DJM4 Overview

32-BIT, 400MHz, MICROPROCESSOR, PBGA400, 17 X 17 MM, 0.80 MM PITCH, ROHS COMPLIANT, PLASTIC, MAPBGA-400

MCIMX257DJM4 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1738905098
Parts packaging codeBGA
package instructionMAPBGA-400
Contacts400
Reach Compliance Codecompliant
ECCN code5A002
YTEOL0
Other featuresALSO REQUIRES 3.3 V I/O SUPPLY
JESD-30 codeS-PBGA-B400
length17 mm
Humidity sensitivity level3
Number of terminals400
Maximum operating temperature70 °C
Minimum operating temperature-20 °C
Package body materialPLASTIC/EPOXY
encapsulated codeLFBGA
Encapsulate equivalent codeBGA400,20X20,32
Package shapeSQUARE
Package formGRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.6 mm
Maximum supply voltage1.52 V
Minimum supply voltage1.38 V
Nominal supply voltage1.45 V
surface mountYES
technologyCMOS
Temperature levelOTHER
Terminal surfaceTIN SILVER COPPER OVER NICKEL
Terminal formBALL
Terminal pitch0.8 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperature40
width17 mm
uPs/uCs/peripheral integrated circuit typeSoC
Freescale Semiconductor
Data Sheet: Technical Data
Document Number: IMX25CEC
Rev. 10, 07/2013
i.MX25 Applications
Processor for
Consumer and
Industrial Products
Silicon Version 1.2
MCIMX25
Package Information
Plastic package
Case 5284 17 x 17 mm, 0.8 mm Pitch
Case 2107 12 x 12 mm, 0.5 mm Pitch
1
Introduction
Ordering Information
See
Table 1 on page 3
for ordering information.
The i.MX25 multimedia applications processor has
the right mix of high performance, low power, and
integration to support the growing needs of the
industrial and general embedded markets.
At the core of the i.MX25 is Freescale's fast,
proven, power-efficient implementation of the
ARM® 926EJ-S™ core, with speeds of up to
400 MHz. The i.MX25 includes support for up to
133 MHz DDR2 memory, integrated 10/100
Ethernet MAC, and two on-chip USB PHYs. The
device is suitable for a wide range of applications,
including the following:
• Graphical remote controls
• Human Machine Interface (HMI)
• Residential and commercial control panels
• Residential gateway (smart metering)
• Handheld scanners and printers
• Electronic point-of-sale terminals
• Patient-monitoring devices
1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1. Special Signal Considerations . . . . . . . . . . . . . . . . 9
3. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1. i.MX25 Chip-Level Conditions . . . . . . . . . . . . . . . . 11
3.2. Supply Power-Up/Power-Down Requirements and
Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3.3. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18
3.4. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 20
3.5. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6. AC Electrical Characteristics . . . . . . . . . . . . . . . . 24
3.7. Module Timing and Electrical Parameters . . . . . . 41
4. Package Information and Contact Assignment . . . . . . 124
4.1. 400 MAPBGA—Case 17x17 mm, 0.8 mm Pitch . 124
4.2. Ground, Power, Sense, and Reference Contact
Assignments Case 17x17 mm, 0.8 mm Pitch . . . 125
4.3. Signal Contact Assignments—17 x 17 mm, 0.8 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127
4.4. i.MX25 17x17 Package Ball Map . . . . . . . . . . . . 135
4.5. 347 MAPBGA—Case 12 x 12 mm, 0.5 mm Pitch 138
4.6. Ground, Power, Sense, and Reference Contact
Assignments Case 12x12 mm, 0.5 mm Pitch . . . 139
4.7. Signal Contact Assignments—12 x 12 mm, 0.5 mm
Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
4.8. i.MX25 12x12 Package Ball Map . . . . . . . . . . . . 148
5. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
© 2009-2013 Freescale Semiconductor, Inc. All rights reserved.
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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