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33505

Description
protoboard smt for .65mm ON semi
Categoryaccessories   
File Size209KB,1 Pages
ManufacturerCapital Advanced Technologies
Environmental Compliance  
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33505 Overview

protoboard smt for .65mm ON semi

SURFBOARDS
THE BREADBOARDING MEDIUM
FOR
R
SURFACE MOUNT
TM
IDS33505
REV A- 10-2011
33000
SERIES
APPLICATION SPECIFIC ADAPTERS
MODEL
33505
ACCEPTS
SC-70-5, SC-88A, SOT-323-5, SOT-353
PARTIAL LISTING
KEC
PANASONIC
5 LEAD
.65 mm
PITCH DEVICES
DEVICE LEAD WIDTH 2.1 To Max 3.8 MM
USV
SMini5-F1, SMini5-G1
SMini5-DA
CMPAK-5 (T)
UMD5, UMT5
DCK (R-PDSO-N5)
UFV, USV
RENESAS
ROHM
TEXAS INST.
TOSHIBA
ALWAYS CONSULT DEVICE DATA SHEET TO INSURE PROPER FIT
DRAWINGS
NOT TO
SCALE
Feature Pins on .1 in. Centers designed for use with
Solderless breadboards, Conventional Breadboards,
and Sockets with standard .1 in. centers. Use For
Prototyping, Device Test or Evaluation and SMD to
Through Hole Conversion.
FIG.
MM
12.7
10.16
2.54
2.7
.65
1.6
.4
1.1
3.8
2.1
3.3
1.57
.5
IN.
.500
.400
.100
.106
.025
.063
.016
.043
.149
.082
.130
.062
.020
NOTE:
BOARD WIDTH
+- .5mm .020in.
BOARD HEIGHT
+-.5mm .020in.
SIP PIN SPACE
+-.20mm .008in.
PAD CENTERLINE
DEVICE LEAD PITCH
PAD LENGTH
PAD WIDTH
GAP
MAX LEAD WIDTH
TYPICAL LEAD WIDTH
LENGTH FROM SHOULDER
+-.5mm .020in.
SINGLE-IN-LINE ( SIP ) PINS
ON .100 in. CENTERS
PAD SET
EXAMPLE DEVICE ( J )
AND MAX WIDTH ( I )
A
B
C
D
E
F
G
H
MOUNTING PADS ARE OVERSIZED IN LENGTH TO
ACCEPT A WIDER RANGE OF DEVICE WIDTHS AND
TOLERANCES AND TO PERMIT HAND SOLDERING.
SEE WEBSITE FOR SOLDERING SUGGESTIONS
BOARD SPECIFICATIONS
BOARD MATERIAL:
.8mm, +-.13mm .031in+-..005 in.
Thick G-10 FR-4 Glass Epoxy or equivalent.
CIRCUITS:
1 oz. Copper with RoHS compliant Lead Free
solder coating. Patten Position on board +- .5mm .020in.
I
J
P
S
PIN SHOULDER HEGHT
PIN WIDTH
RoHS
Compliant
EC 2002/95
W
TOLERANCES:
If not noted are +- 20%. Nominal values are given. Controlling unit is Millimeters.
Values rounded to nearest decimal. Slight Variations due to manufacturing process can occur.
Copyright 2011
by
Capital Advanced Technologies, Inc.
All rights reserved. Surfboards is a registered trademark of Capital Advanced Technologies, Inc. The Breadboarding medium for surface mount, and the Leaf Circuit Logo
are trademarks of Capital Advanced Technologies, Inc. All other trademarks are the property of their respective owners. Specifications, availability, and price is subject to change without notice. All information given is believed to
be accurate but is not guaranteed. The user of information given or products represented by such information is responsible for determining the suitability of said information or products for a given purpose. No inducement is
intended or permission granted for infringement of any patent or unauthorized use of any intellectual property of Capital Advanced Technologies or others.
CAPITAL ADVANCED TECHNOLOGIES, INC.
CAROL STREAM, ILLINOIS. USA
PHONE 630-690-1696
FAX 630-690-2498
MADE
IN
WWW.CapitalAdvanced.Com
USA

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