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RMKHT2010E3881WA06

Description
Fixed Resistor, Thin Film, 1W, 3880ohm, 300V, 0.05% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP, GREEN
CategoryPassive components    The resistor   
File Size121KB,7 Pages
ManufacturerVishay
Websitehttp://www.vishay.com
Environmental Compliance
Download Datasheet Parametric View All

RMKHT2010E3881WA06 Overview

Fixed Resistor, Thin Film, 1W, 3880ohm, 300V, 0.05% +/-Tol, 30ppm/Cel, Surface Mount, 2010, CHIP, GREEN

RMKHT2010E3881WA06 Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerVishay
package instructionSMT, 2010
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresHIGH PRECISION
structureChip
Manufacturer's serial numberRMKHT
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature230 °C
Minimum operating temperature-55 °C
Package height0.45 mm
Package length5.23 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.64 mm
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance3880 Ω
Resistor typeFIXED RESISTOR
seriesRMKHT
size code2010
surface mountYES
technologyTHIN FILM
Temperature Coefficient30 ppm/°C
Terminal surfaceAluminum (Al)
Terminal shapeONE SURFACE
Tolerance0.05%
Operating Voltage300 V
Base Number Matches1
RMKHT (CNHT)
www.vishay.com
Vishay Sfernice
High Temperature (230 °C) Wirebondable Thin Film Chip Resistors
and Resistor Networks
FEATURES
• Operating temperature range: - 55 °C; + 215 °C
• Storage temperature: - 55 °C; + 230 °C
• Wirebondable (aluminum pads)
• Aluminum or gold pads
• Large selection of sizes available
• Custom networks available on request (CNHT)
• Temperature coefficient down to 15 ppm/°C
(- 55 °C; + 215 °C)
• Tolerance down to 0.05 %
• Temperature coefficient remains at 15 ppm/°C after long
term storage at 230 °C
• Material categorization: For definitions of compliance
please see
www.vishay.com/doc?99912
INTRODUCTION
For applications such as down hole applications, the need
for parts able to withstand very severe conditions
(temperature as high as 215 °C powered or up to 230 °C
un-powered) has leaded Vishay Sfernice to push out the
limit of the thin film technology.
Designers might read the application note “Power
Dissipation Considerations in High Precision Vishay
Sfernice Thin Film Chip Resistors and Arrays
(P, PRA, etc…) (High Temperature Application)
www.vishay.com/doc?53047
in conjunction with this
datasheet to help them to properly design their PCBs and
get the best performances of the RMKHT.
Vishay Sfernice research and development engineers will
be willing to support any customer design considerations.
TYPICAL PERFORMANCE
ABS
TCR
TOL.
25 ppm/°C
ABS
0.05 %
Note
(1)
When applicable (networks only)
TRACKING
(1)
2 ppm/°C
RATIO
(1)
0.02 %
MECHANICAL SPECIFICATIONS
Resistive element
Substrate material
Bonding pads
Passivation
Back metallization
(2)
(2)
Nichrome (NiCr)
Silicon (size 22, 33, 55, 515) - alumina (other sizes)
Aluminum (Al) or gold (Au)
Silicon nitride (Si3N4)
Gold on nickel barrier
Note
When applicable (only on alumina substrate)
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
2000
Drift (%)
With Pd (T
j
= 230 °C)
T = 185 °C
T = 200 °C
T = 215 °C
T = 230 °C
4000
6000
8000
t (h)
10 000
12 000
14 000
Note
• TCR (- 55 °C; + 215 °C) remains unchanged after 15 000 h storage
Revision: 26-Mar-13
Document Number: 60075
1
For technical questions, contact:
sferthinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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