AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 4-Input, TTL, PDFP14, PLASTIC, DFP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Parts packaging code | DFP |
| package instruction | PLASTIC, DFP-14 |
| Contacts | 14 |
| Reach Compliance Code | compliant |
| series | TTL/H/L |
| JESD-30 code | R-PDFP-F14 |
| JESD-609 code | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE |
| MaximumI(ol) | 0.02 A |
| Number of functions | 1 |
| Number of entries | 4 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | DFP |
| Encapsulate equivalent code | FL14,.3 |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Prop。Delay @ Nom-Sup | 11 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Filter level | 38535Q/M;38534H;883B |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | TTL |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| Base Number Matches | 1 |

| 54H55FMQB | 54H55DMQB | 74LS55FC | 74H55FC | 74LS55DC | 74LS55PC | |
|---|---|---|---|---|---|---|
| Description | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 4-Input, TTL, PDFP14, PLASTIC, DFP-14 | AND-OR-Invert Gate, TTL/H/L Series, 1-Func, 4-Input, TTL, CDIP14, CERAMIC, DIP-14 | AND-OR-Invert Gate, TTL, CDFP14, | AND-OR-Invert Gate, TTL, CDFP14, | AND-OR-Invert Gate, TTL, CDIP14, | AND-OR-Invert Gate, TTL, PDIP14, |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| package instruction | PLASTIC, DFP-14 | CERAMIC, DIP-14 | DFP, FL14,.3 | DFP, FL14,.3 | DIP, DIP14,.3 | DIP, DIP14,.3 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 code | R-PDFP-F14 | R-CDIP-T14 | R-XDFP-F14 | R-XDFP-F14 | R-XDIP-T14 | R-PDIP-T14 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 |
| Logic integrated circuit type | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE | AND-OR-INVERT GATE |
| Number of terminals | 14 | 14 | 14 | 14 | 14 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| Package body material | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY |
| encapsulated code | DFP | DIP | DFP | DFP | DIP | DIP |
| Encapsulate equivalent code | FL14,.3 | DIP14,.3 | FL14,.3 | FL14,.3 | DIP14,.3 | DIP14,.3 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | FLATPACK | IN-LINE | FLATPACK | FLATPACK | IN-LINE | IN-LINE |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Schmitt trigger | NO | NO | NO | NO | NO | NO |
| surface mount | YES | NO | YES | YES | NO | NO |
| technology | TTL | TTL | TTL | TTL | TTL | TTL |
| Temperature level | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | FLAT | THROUGH-HOLE | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| Is it lead-free? | - | - | Contains lead | Contains lead | Contains lead | Contains lead |
| Humidity sensitivity level | - | - | 2A | 2A | 2A | 2A |
| Peak Reflow Temperature (Celsius) | - | - | 250 | 250 | 250 | 250 |
| Maximum time at peak reflow temperature | - | - | 30 | 30 | 30 | 30 |