54AC534LM datasheet, PDF - EEWORLD Datasheet

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54AC534LM: DescriptionIC,FLIP-FLOP,OCTAL,D TYPE,AC-CMOS,LLCC,20PIN,CERAMIC; Categorylogic logic; File Size270KB，5 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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54AC534LM Overview

IC,FLIP-FLOP,OCTAL,D TYPE,AC-CMOS,LLCC,20PIN,CERAMIC

54AC534LM Parametric

Parameter Name	Attribute value
Maker	Texas Instruments
package instruction	QCCN, LCC20,.35SQ
Reach Compliance Code	unknown
JESD-30 code	S-XQCC-N20
Load capacitance (CL)	50 pF
Logic integrated circuit type	D FLIP-FLOP
MaximumI(ol)	0.024 A
Number of functions	8
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Output characteristics	3-STATE
Package body material	CERAMIC
encapsulated code	QCCN
Encapsulate equivalent code	LCC20,.35SQ
Package shape	SQUARE
Package form	CHIP CARRIER
power supply	3.3/5 V
Certification status	Not Qualified
surface mount	YES
technology	CMOS
Temperature level	MILITARY
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Trigger type	POSITIVE EDGE
Base Number Matches	1

54AC534LM Related Products

	54AC534LM	54AC534FM	54AC534DM	74AC534PC
Description	IC,FLIP-FLOP,OCTAL,D TYPE,AC-CMOS,LLCC,20PIN,CERAMIC	IC,FLIP-FLOP,OCTAL,D TYPE,AC-CMOS,FP,20PIN,CERAMIC	IC,FLIP-FLOP,OCTAL,D TYPE,AC-CMOS,DIP,20PIN,CERAMIC	AC SERIES, 8-BIT DRIVER, INVERTED OUTPUT, PDIP20, PLASTIC, DIP-20
Maker	Texas Instruments	Texas Instruments	Texas Instruments	Texas Instruments
package instruction	QCCN, LCC20,.35SQ	DFP, FL20,.3	DIP, DIP20,.3	DIP, DIP20,.3
Reach Compliance Code	unknown	unknown	unknown	unknown
JESD-30 code	S-XQCC-N20	R-XDFP-F20	R-XDIP-T20	R-PDIP-T20
Load capacitance (CL)	50 pF	50 pF	50 pF	50 pF
Logic integrated circuit type	D FLIP-FLOP	D FLIP-FLOP	D FLIP-FLOP	BUS DRIVER
MaximumI(ol)	0.024 A	0.024 A	0.024 A	0.024 A
Number of functions	8	8	8	1
Number of terminals	20	20	20	20
Maximum operating temperature	125 °C	125 °C	125 °C	85 °C
Minimum operating temperature	-55 °C	-55 °C	-55 °C	-40 °C
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC	CERAMIC	CERAMIC	PLASTIC/EPOXY
encapsulated code	QCCN	DFP	DIP	DIP
Encapsulate equivalent code	LCC20,.35SQ	FL20,.3	DIP20,.3	DIP20,.3
Package shape	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE	IN-LINE
power supply	3.3/5 V	3.3/5 V	3.3/5 V	3.3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	NO	NO
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	MILITARY	MILITARY	MILITARY	INDUSTRIAL
Terminal form	NO LEAD	FLAT	THROUGH-HOLE	THROUGH-HOLE
Terminal pitch	1.27 mm	1.27 mm	2.54 mm	2.54 mm
Terminal location	QUAD	DUAL	DUAL	DUAL
Trigger type	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE	POSITIVE EDGE
Base Number Matches	1	1	1	1

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