Y163210K0000T0R datasheet, PDF

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Y163210K0000T0R: Descriptionres 10k ohm .4W .01% 2010; CategoryPassive components; File Size225KB，4 Pages; ManufacturerVishay; Websitehttp://www.vishay.com

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Y163210K0000T0R Overview

res 10k ohm .4W .01% 2010

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VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)

Vishay Foil Resistors

UltraUltra High-Precision with ofFlip Chip Resistorng W TCR of gn

High-Pr sion Flip p stor TCR ±0.05

eci Z-Foil Chi Resi Z-Foil

ppm/°C, Space with ound

35%

Savi vs. rapar Desi

±0.05 ppm/°C, 35% Space Saving vs. Wraparound Design

and PCR of 5 ppm at Rated Power

FEATURES

• Temperature coefficient of resistance (TCR):

± 0.05 ppm/°C nominal (0°C to + 60°C)

± 0.2 ppm/°C nominal (–55°C to +125°C, +25°C ref.)

(see Table 1 and Figure 2)

• Tolerance: to ±0.01% (100 ppm)

• Power coefficient “∆R due to self heating” 5 ppm at

rated power

• Load-life stability (70°C for 2000 h): ±0.005% (50 ppm)

• Power rating to: 600 mW at +70°C

• Electrostatic discharge (ESD): at least to 25 kV

• Resistance range: 5 Ω to 125 kΩ (for lower and higher

values, please contact us)

• Foil resistors are not restricted to standard values;

specific “as required” values can be supplied at no

extra cost or delivery (e.g., 1K2345 vs. 1K)

• Non-inductive, non-capacitive design

• Thermal stabilization time: <1 s (within 10 ppm of

steady state value)

• Short time overload: ≤0.005% (50 ppm)

• Non hot spot design

• Rise time: 1 ns effectively no ringing

• Current noise: <0.010 μV

rms

/ V of applied voltage

(<–40 dB)

• Voltage coefficient: <0.1 ppm/V

• Non-inductive: <0.08 μH

• Terminal finishes available: lead (Pb)-free, tin/lead alloy

• Compliant to RoHS directive 2002/95/EC*

• Matched sets are available per request

• Prototype quantities available in just 5 working days or

sooner. For more information, please contact us.

in the most critical applications by eliminating the need for

corrective circuitry and reducing the large land patterns

needed for a wrap-around configuration. The device’s flip-

chip configuration saves up to 35% PCB space compared

with a surface-mount chip with wraparound terminations

while also providing better strain relief to eliminate

cracked substrates and board delamination.

In addition to its remarkably improved load-life stability,

the VFCP Series is noise-free and provides ESD

protection of 25 kV or more for increased reliability. The

device’s solid element alloy is matched to the substrate,

forming a single entity with balanced resistance versus

temperature characteristics for an unusually low and

predictable TCR over a wide temperature range from

–55°C to more than +125°C. The adhesive that holds the

foil to the flat substrate withstands high temperatures,

pulsing power, moisture incursions, shock and vibration,

and low-temperature exposure while still holding securely

to the foil element. Resistance patterns are photo-etched

into the element to permit the trimming of resistance

values to very tight tolerances as low as 0.01%.

The Flip Chips devices are qualified as anti-sulfurated

resistors for use in environments with high levels of

contamination. Such environments include alternative

energy applications, industrial control systems,

sensors, RTDs, electric instrumentation, weather and

communication base stations, and any electronic

appliance used in high concentrations of sulfur. The

combination of flip-chip terminations and Z-Foil

construction and materials results in the most stable

resistors available, requiring the lowest error allowance.

This means that more error allowance can be transferred

to active devices—resulting in lower costs—or applied

to the foil resistors themselves, allowing for looser initial

tolerances than would be required for other resistor

technologies.

INTRODUCTION

Based on VFR’s next-generation Bulk Metal

Z-Foil

technology, the VFCP Series (foil resistor flip-chip)

excels over all previous stability standards for precision

resistors with an order of magnitude improvement in

high-temperature stability, load-life stability, and moisture

resistance. These new benchmark levels of performance

provide design engineers with the tools to build circuits

not previously achievable while reducing costs and space

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