PHP00805H53R6BST1 datasheet, PDF

PHP

www.vishay.com

Vishay Dale Thin Film

High Power Thin Film Wraparound Chip Resistor

FEATURES

•

PHP series chip resistors are designed with enlarged

backside terminations to reduce the thermal resistance

between the topside resistor layer and the solder joint on the

end users circuit board.

Actual power handling capability is limited by the end user

mounting process. As with any high power chip resistor the

ability to remove the generated heat is critical to the overall

performance of the device.

•

High purity ceramic substrate

Power rating to 2.5 W

Resistance range 10



to 30.1 k

Resistor tolerance to ± 0.1 %

TCR to ± 25 ppm/°C

Flame resistant UL 94 V-0

Power supplies

Power switching

Braking system

Test and measurement equipment

Motor deflection circuits

APPLICATIONS

TYPICAL PERFORMANCE

ABSOLUTE

TCR

TOL.

25

0.1

STANDARD ELECTRICAL SPECIFICATIONS

TEST

Material

Resistance Range

TCR: Absolute

Tolerance: Absolute

Power Rating: Resistor

Stability: Absolute

Stability: Ratio

Voltage Coefficient

Working Voltage

Operating Temperature Range

Storage Temperature Range

Noise

Shelf Life Stability: Absolute

SPECIFICATIONS

Nichrome

10



to 30.1 k

25 ppm/°C, 50 ppm/°C (standard)

and, 100 ppm/°C

0.1 %, 0.5 %, 1.0 % and, 5.0 %

0.375 W - 2.5 W

(1)

R

0.1 %

Not applicable

< 0.1 ppm/V

75 V to 200 V

-55 °C to +155 °C

< -30 dB

± 0.01 %

CONDITIONS

-

-55 °C to +125 °C

+25 °C

Maximum at +70 °C

2000 h at +70 °C

-

1 year at +25 °C

COMPONENT RATINGS

CASE SIZE

POWER RATING (mW)

0603

375

(1)

0805

625

(1)

1206

1000

(1)

2512

2500

(1)

Note

(1)

Dependent on component mounting by user.

WORKING VOLTAGE (V)

75

100

200

RESISTANCE RANGE ()

10 to 30.1K

ENVIRONMENTAL TESTS

(Vishay Performance vs. MIL-PRF-55342 Requirements)

ENVIRONMENTAL TEST

Resistance Temperature Characteristic

Maximum Ambient Temperature at Rated Wattage

Maximum Ambient Temperature at Power Derating

Thermal Shock

Low Temperature Operation

Short Time Overload

High Temperature Exposure

Resistance to Soldering Heat

Moisture Resistance

Life at +70 °C for 2000 h

Revision: 27-Jun-16

LIMITS MIL-PRF-55342

CHARACTERISTIC “E”

± 25 ppm/°C

+70 °C

+150 °C

± 0.1 %

± 0.2 %

± 0.5 %

TYPICAL VISHAY PERFORMANCE

± 15 ppm/°C

+70 °C

+150 °C

± 0.04 %

± 0.001 %

± 0.003 %

± 0.030 %

± 0.007 %

± 0.002 %

± 0.100 %

Document Number: 60076

1

For technical questions, contact:

thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

DIMENSIONS

in inches

D

T

E

L

W

CASE SIZE

0603

0805

1206

2512

LENGTH

0.064 ± 0.006

0.080 ± 0.006

0.126 ± 0.008

0.259 + 0.009/- 0.015

WIDTH

W (± 0.005)

0.032

0.050

0.063

0.124

THICKNESS

MIN./MAX.

0.020 max.

0.015/0.033

TOP PAD

D (± 0.005)

0.012

0.016

0.020 + 0.005/- 0.010

0.02

BOTTOM PAD

E (± 0.005)

0.021

0.025

0.040

0.050

LAND PATTERN DIMENSIONS

in inches

0603 Land Pattern

0.0920

0.0340

0.0710

0.0140

0.0390

0.0755

0.0220

1206 Land Pattern

0.1730

0805 Land Pattern

0.1050

2512 Land Pattern

0.2910

0.0520

0.0200

0.0425

0.1260

0.1090

0.0910

STANDARD MATERIAL SPECIFICATIONS

Resistive Element

Substrate Material

Terminations (Tin/Lead)

Terminations (Lead (Pb)-free)

Nichrome

Alumina (Al

2

O

3

)

Tin/lead solder over nickel barrier

Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier

Revision: 27-Jun-16

Document Number: 60076

2

For technical questions, contact:

thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

PHP CHIP TEMP. VS. APPLIED POWER

5.00

4.50

4.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

0805 - 100

Ω

0805 - 5 kΩ

0805 - 20 kΩ

PHP CHIP TEMP. VS. APPLIED POWER

5.00

4.50

4.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

0603 - 100

Ω

0603 - 5 kΩ

0603 - 18.8 kΩ

Applied Power (W)

70

150

200

Applied Power (W)

70

150

200

Chip

Surface

Temperature (°C)

Chip

Surface

Temperature (°C)

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C.

Note

• Chip surface temperature measured using FLIR SC645 thermal

imaging system with an approximate test card surface

temperature of 85 °C.

PHP CHIP TEMP. VS. APPLIED POWER

5.00

4.50

4.00

3.50

3.00

2.50

2.00

1.50

1.00

0.50

0.00

1206 - 100

Ω

1206 - 5 kΩ

1206 - 10 kΩ

PHP CHIP TEMP. VS. APPLIED POWER

10.00

9.00

8.00

7.00

6.00

5.00

4.00

3.00

2.00

1.00

0.00

2512 - 10

Ω

2512 - 10 kΩ

2512 - 30 kΩ

Applied Power (W)

70

150

200

70

150

200

Chip

Surface

Temperature (°C)

Notes

• Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C.

• Thermal imaging was conducted under ambient conditions

resulting in a steady state test card surface temperature of 85 °C

over the full range of power levels.

• Thermal imaging and load life testing was conducted mounting

one device to 2" x 3" test cards with 2.5 mil copper plating on

both surfaces. Thermal vias on 120 mil centers were utilized for

heat transfer between surfaces of the test card.

Chip

Surface

Temperature (°C)

Notes

• Chip surface temperature measured using FLIR A40 thermal

imaging system with an approximate test card surface

temperature of 25 °C.

Case Size

Resistance

Value

Temperature

70

150

200

2512

Up to 10



2512

Up to 10 k

Power (W)

2.44

6.82

9.33

1.81

4.89

6.63

1.87

5.19

7.09

2512

Up to 30 k

Revision: 27-Jun-16

Document Number: 60076

3

For technical questions, contact:

thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

PHP

www.vishay.com

Vishay Dale Thin Film

SINGLE PULSE CURVES

1000

100

Ω

- 2512

100

Ω

- 1206

Pulse Power (W)

100

10

1

100

Ω

- 0805

100

Ω

- 0603

0.1

0.00001

0.0001

0.001

0.01

0.1

1

10

Pulse Duration (s)

DERATING CURVE

100

Percent of Rated Power

80

60

40

20

0

70

125

155

Ambient Temperature °C

GLOBAL PART NUMBER INFORMATION

P

GLOBAL

MODEL

PHP

H

P

0

CASE

SIZE

0603

0805

1206

2512

1

2

0

6

E

1

0

2

B

T

1

SUBSTRATE

0

= Alumina

TCR

E

=

± 25 ppm/°C

H

=

± 50 ppm/°C

K

=

± 100 ppm/°C

RESISTANCE

The first 3 digits

are significant

figures and the

last digit

specifies the

number of

zeros to follow.

“R” designates

the decimal

point.

Example:

10R0 = 10



1000 = 100



1001 = 1 k

TOLERANCE

TERMINATION

PACKAGING

BS

= BULK

100 min., 1 mult

WS

= WAFFLE

100 min., 1 mult

WI

= WAFFLE



(item single lot

day code)

100 min., 1 mult



TAPE AND REEL

T1

= 1000 min.,



1000 mult

T3

= 300 min., 300 mult

T5

= 500 min., 500 mult

TF

= Full reel

TS

= 100 min., 1 mult

TI

= 100 min., 1 mult



(item single lot

date code)

TP

= 100 min., 1 mult



(package unit

single lot date)

B

= ± 0.1 %

B

= Wraparound

Sn/Pb solder

D

= ± 0.5 %

w/nickel barrier

F

= ± 1.0 %

G

= ± 2.0 %



J

= ± 5.0 %

S

= Wraparound

lead (Pb)-free solder



SAC-305

RoHS-compliant - e1

Revision: 27-Jun-16

Document Number: 60076

4

For technical questions, contact:

thinfilm@vishay.com

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

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Vishay

Disclaimer



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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.

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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other

disclosure relating to any product.

Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or

the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all

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typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding

statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a

particular product with the properties described in the product specification is suitable for use in a particular application.

Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over

time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s

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including but not limited to the warranty expressed therein.

Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining

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Revision: 08-Feb-17

1

Document Number: 91000

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