DSC1206AS1M62JT1 datasheet, PDF

DSC1206AS1M62JT1: DescriptionFixed Resistor, Thick Film, 0.33W, 1620000ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP; File Size725KB，4 Pages; ManufacturerTT Electronics plc; Websitehttp://www.ttelectronics.com/; Environmental Compliance

Download Datasheet Parametric View All

DSC1206AS1M62JT1 Overview

Fixed Resistor, Thick Film, 0.33W, 1620000ohm, 200V, 5% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	145057685907
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	UK
ECCN code	EAR99
YTEOL	7.8
Other features	ANTI-SULFUR, LASER TRIMMABLE
structure	Rectangular
JESD-609 code	e3
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	155 °C
Minimum operating temperature	-55 °C
Package height	0.7 mm
Package length	3.2 mm
Package form	SMT
Package width	1.6 mm
method of packing	TR, 7 INCH
Rated power dissipation(P)	0.33 W
Rated temperature	70 °C
resistance	1620000 Ω
Resistor type	FIXED RESISTOR
size code	1206
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	100 ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
Tolerance	5%
Operating Voltage	200 V

Synchronous and asynchronous understanding test: How to understand setup/hold? The macroscopic synchronization is asynchronous in the microscopic view, but this asynchrony meets the timing requirements we defined. How to understand asynchronous conv...; 5525 FPGA/CPLD

Use of LM4F232 series modules: I used MDK4.22 before , but I found it a bit problematic. It seemed to report errors when compiling , so I switched to 4.21 .The attached is a compressed project package, which includes PWM , timer, s...; Yehhon Microcontroller MCU

Show off the MXCHIP wireless development board I just received: I received the wireless development board from MXCHIP, and I was very excited. I couldn't wait to unbox it and try it out. Here are the pictures first. 1. Mainboard + core board + LCD: 2. Connect 5V p...; muxb RF/Wirelessly

ASM eagle60 W/B BSOB: Recently, my boss has made some junk products. BSOB is used in production, but the second point is that the line is either warped or not printed. Many parameters have been used, and I don’t know what ...; 学习来了 PCB Design

RFIC and RFID are completely different, right?: Baidu's answer, please elaborate: RFIC is the Block in the RF System made into IC, and the finished product is basically IC; while RFID is Radio-frequency identification, which is a system with specif...; bootloader RF/Wirelessly

An error occurred while installing CE6 SP1: toolMsmCA(Error):Setup package issue or CoreCon...: When installing CE6 SP1, an error occurred: "ToolMsmCA (Error): Setup package issue or CoreCon DataStore corrupted: CDeviceSDKInstallShin Add/Remove failed. HR=0x80004005. I installed VS2005 before. I...; huanglx Embedded System

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components