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INS8298ED

Description
IC,ROM,8KX8,MOS,DIP,24PIN,CERAMIC
Categorystorage    storage   
File Size314KB,5 Pages
ManufacturerNational Semiconductor(TI )
Websitehttp://www.ti.com
Stay tuned Parametric

INS8298ED Overview

IC,ROM,8KX8,MOS,DIP,24PIN,CERAMIC

INS8298ED Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid101296946
package instructionDIP, DIP24,.6
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL0
Maximum access time450 ns
JESD-30 codeR-XDIP-T24
JESD-609 codee0
memory density65536 bit
Memory IC TypeMASK ROM
memory width8
Number of terminals24
word count8192 words
character code8000
Maximum operating temperature70 °C
Minimum operating temperature
organize8KX8
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP24,.6
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Maximum slew rate0.13 mA
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyMOS
Temperature levelCOMMERCIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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