Modem, CMOS, CDIP28,
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Objectid | 1435618110 |
| package instruction | DIP, DIP28,.6 |
| Reach Compliance Code | compliant |
| YTEOL | 0 |
| JESD-30 code | R-XDIP-T28 |
| JESD-609 code | e0 |
| Humidity sensitivity level | 2A |
| Number of terminals | 28 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Package body material | CERAMIC |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP28,.6 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Certification status | Not Qualified |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | MODEM |
| Temperature level | INDUSTRIAL |
| Terminal surface | TIN LEAD |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |