NOTICE OF REVISION (NOR)
THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED.
1. DATE
(YYMMDD)
99-04-05
Form Approved
OMB No. 0704-0188
Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing
instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the
collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information,
including suggestions for reducing this burden, to Department of Defense, Washington Headquarters Services, Directorate
for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the
Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503.
PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED
FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY
NUMBER LISTED IN ITEM 2 OF THIS FORM.
2. PROCURING
ACTIVITY NO.
3. DODAAC
b. ADDRESS
(Street, City, State, Zip Code)
Defense Supply Center, Columbus
3990 East Broad Street
Columbus, OH 43216-5000
5. CAGE CODE
67268
6. NOR NO.
5962-R048-99
4. ORIGINATOR
a. TYPED NAME
(First, Middle Initial,
Last)
9. TITLE OF DOCUMENT
MICROCIRCUIT, DIGITAL, RADIATION HARDENED, ADVANCED CMOS,
QUAD 2-INPUT NAND SCHMITT TRIGGER, MONOLITHIC SILICON
a. CURRENT
Initial
12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES
All
13. DESCRIPTION OF REVISION
Sheet 1: Revisions ltr column; add "A".
Revisions description column; add "Changes in accordance with NOR 5962-R048-99".
Revisions date column; add "99-04-05".
Revision level block; add "A".
Rev status of sheets; for sheets 1, 4 and 17 through 23, add "A".
7. CAGE CODE
67268
10. REVISION LETTER
8. DOCUMENT NO.
5962-98625
11. ECP NO.
No users listed.
b. NEW
A
Sheet 4: Add new paragraph which states; "3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to
this document."
Revision level block; add "A".
Sheets
17 through 23: Add attached appendix A.
CONTINUED ON NEXT SHEETS
14. THIS SECTION FOR GOVERNMENT USE ONLY
a.
(X one)
X
(1) Existing document supplemented by the NOR may be used in manufacture.
(2) Revised document must be received before manufacturer may incorporate this change.
(3) Custodian of master document shall make above revision and furnish revised document.
b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR
GOVERNMENT
DSCC-VAC
d. TITLE
CHIEF, CUSTOM MICROELECTRONICS TEAM
15a. ACTIVITY ACCOMPLISHING REVISION
DSCC-VAC
DD Form 1695, APR 92
e. SIGNATURE
MONICA L. POELKING
b. REVISION COMPLETED
(Signature)
JOSEPH A. KERBY
Previous editions are obsolete.
f. DATE SIGNED
(YYMMDD)
99-04-05
c. DATE SIGNED
(YYMMDD)
99-04-05
c. TYPED NAME
(First, Middle Initial, Last)
MONICA L. POELKING
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-98625
Document No: 5962-98625
Revision: A
NOR No: 5962-R048-99
Sheet: 2 of 8
10. SCOPE
10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified
Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers
approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices
using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes
consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or
Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN.
10.2 PIN. The PIN shall be as shown in the following example:
5962
F
98625
01
V
9
A
Federal
Stock class
designator
RHA
designator
(see 10.2.1)
Device
type
(see 10.2.2)
Device
class
designator
(see 10.2.3)
Die
code
Die
Details
(see 10.2.4)
Drawing Number
10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A
dash (-) indicates a non-RHA die.
10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
Generic number
ACS132
Circuit function
Radiation Hardened, SOS, advanced CMOS,
quad 2-input NAND Schmitt trigger.
10.2.3 Device class designator.
Device class
Q or V
Device requirements documentation
Certification and qualification to the die requirements of MIL-PRF-38535.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98625
SHEET
A
17
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-98625
Document No: 5962-98625
Revision: A
NOR No: 5962-R048-99
Sheet: 3 of 8
10.2.4 Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions,
bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each
product and variant supplied to this appendix.
10.2.4.1 Die Physical dimensions.
Die Type
01
Figure number
A-1
10.2.4.2 Die Bonding pad locations and Electrical functions.
Die Type
01
10.2.4.3 Interface Materials.
Die Type
01
10.2.4.4 Assembly related information.
Die Type
01
Figure number
A-1
Figure number
A-1
Figure number
A-1
10.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details.
10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details.
20. APPLICABLE DOCUMENTS
20.1 Government specifications, standards, bulletin, and handbooks. Unless otherwise specified, the following
specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of
Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98625
SHEET
A
18
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-98625
Document No: 5962-98625
Revision: A
NOR No: 5962-R048-99
Sheet: 4 of 8
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Methods and Procedures for Microelectronics.
HANDBOOK
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standardized Military Drawings (SMD’s).
(Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific
acquisition functions should be obtained from the contracting activity or as directed by the contracting activity).
20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the
text of this drawing shall take precedence.
30. REQUIREMENTS
30.1 Item Requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The
modification in the QM plan shall not effect the form, fit or function as described herein.
30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as
specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein.
30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1.
30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be
as specified in 10.2.4.2 and on figure A-1.
30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1.
30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1.
30.2.5 Truth table. The truth table shall be as defined within paragraph 3.2.3 of the body of this document.
30.2.6 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.6 of the body of
this document.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98625
SHEET
A
19
APPENDIX A
APPENDIX A FORMS A PART OF SMD 5962-98625
Document No: 5962-98625
Revision: A
NOR No: 5962-R048-99
Sheet: 5 of 8
30.3 Electrical performance characteristics and post- irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this
document.
30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing
sufficient to make the packaged die capable of meeting the electrical performance requirements in table I.
30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a
customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN
listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535.
30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of
compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the
manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein.
30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535
shall be provided with each lot of microcircuit die delivered to this drawing.
40. QUALITY ASSURANCE PROVISIONS
40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in
accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The
modifications in the QM plan shall not effect the form, fit or function as described herein.
40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the
manufacturer’s QM plan. As a minimum it shall consist of:
a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007.
b) 100% wafer probe (see paragraph 30.4).
c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010
or the alternate procedures allowed within MIL-STD-883 TM5004.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-98625
SHEET
A
20
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