CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Device Ratings and Specifications
Series DA and DB Varistors are listed under UL file #E75961 as a UL recognized component.
MAXIMUM RATINGS (85
o
C)
CONTINUOUS
TRANSIENT
PEAK
CURRENT
(8/20µs)
I
TM
(A)
30000
30000
30000
30000
30000
40000
40000
40000
40000
40000
40000
VARISTOR VOLTAGE AT
1mA DC TEST
CURRENT
MIN
(V)
184
212
354
389
462
610
670
735
805
940
1080
V
N(DC)
(V)
200
240
390
430
510
680
750
820
910
1050
1200
MAX
(V)
228
268
429
473
561
748
825
910
1000
1160
1320
SPECIFICATIONS (25
o
C)
MAX CLAMP-
ING VOLT V
C
AT 200A
CURRENT
(8/20µs)
V
C
(V)
345
405
650
730
830
1130
1240
1350
1480
1720
2000
PART NUMBER AND
DEVICE BRANDING
DA
V131DA40
V151DA40
V251DA40
V271DA40
V321DA40
V421DA40
V481DA40
V511DA40
V571DA40
V661DA40
V751DA40
DB
V131DB40
V151DB40
V251DB40
V271DB40
V321DB40
V421DB40
V481DB40
V511DB40
V571DB40
V661DB40
V751DB40
V
RMS
V
M(AC)
(V)
130
150
250
275
320
420
480
510
575
660
750
V
DC
V
M(DC)
(V)
175
200
330
369
420
560
640
675
730
850
970
ENERGY
(2ms)
W
TM
(J)
270
300
370
400
460
600
650
700
770
900
1050
TYPICAL
CAPACI-
TANCE
f = 1MHz
(pF)
10000
8000
5000
4500
3800
3000
2700
2500
2200
2000
1800
NOTE: Average power dissipation of transients not to exceed 2.0W.
4-52
DA/DB Series
Power Dissipation Ratings
Should transients occur in rapid succession, the average
power dissipation required is simply the energy (watt-
seconds) per pulse times the number of pulses per second.
The power so developed must be within the specifications
shown on the Device Ratings and Specifications table for the
specific device. Furthermore, the operating values need to
be derated at high temperatures as shown in Figure 1.
Because varistors can only dissipate a relatively small
amount of average power they are, therefore, not suitable for
repetitive applications that involve substantial amounts of
average power dissipation.
1.
100
PERCENT OF RATED VALUE
90
80
70
60
50
40
30
20
10
0
-55
50
60
70
80
90
100
110
120
130
140
150
AMBIENT TEMPERATURE (
o
C)
FIGURE 1. CURRENT, ENERGY AND POWER DERATING
CURVE
PERCENT OF PEAK VALUE
100
90
50
O
1
= Virtual Origin of Wave
T = Time From 10% to 90% of Peak
T
1
= Virtual Front time = 1.25
•
t
T
2
= Virtual Time to Half Value (Impulse Duration)
Example: For an 8/20µs Current Waveform:
8µs = T
1
= Virtual Front Time
20µs = T
2
= Virtual Time to Half Value
10
O
1
T
T
1
T
2
TIME
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM
Transient V-I Characteristics Curve
6,000
5,000
4,000
MAXIMUM PEAK VOLTS (V)
3,000
2,000
T
A
= -55
o
C to 85
o
C
MAXIMUM CLAMPING VOLTAGE
DISC SIZE 40mm
V751DA/DB40
130 TO 750 VM(AC) RATING
V661DA/DB40
V571DA/DB40
V511DA/DB40
V481DA/DB40
V421DA/DB40
1,000
900
800
700
600
500
400
300
V151DA/DB40
V131DA/DB40
200
10
-2
10
-1
10
0
V321DA/DB40
V271DA/DB40
V251DA/DB40
10
1
10
2
10
3
PEAK AMPERES (A)
10
4
10
5
FIGURE 3. CLAMPING VOLTAGE FOR V131DA40, V131DB40 - V751DA40, V751DB40
4-53
DA/DB Series
Pulse Rating Curves
50,000
1
20,000
10,000
SURGE CURRENT (A)
SURGE CURRENT (A)
5,000
2,000
10
2
10
4 5
10
6
10
2
10
DISC SIZE 40mm
V131DA40 - V321DA40
V131DB40 - V321DB40
50,000
20,000
10,000
5,000
2,000
1,000
500
200
100
50
INDEFINITE
20
100
1,000
IMPULSE DURATION (µs)
10,000
20
10
20
INDEFINITE
100
1,000
IMPULSE DURATION (µs)
10,000
10
2
10
3
1
2
DISC SIZE 40mm
V421DA40 - V751DA40
V421DB40 - V751DB40
10
4 5
10
6
10
10
3
1,000 10
500
200
100
50
20
10
FIGURE 4. SURGE CURRENT RATING CURVES FOR
V131DA40, V131DB40 - V321DA40, V321DB40
FIGURE 5. SURGE CURRENT RATING CURVES FOR
V421DA40, V421DB40 - V751DA40
NOTE: If pulse ratings are exceeded, a shift of V
N(DC)
(at specified current) of more than
±10%
could result. This type of shift, which normally results
in a decrease of V
N(DC)
, may result in the device not meeting the original published specifications, but it does not prevent the device from continuing
to function, and to provide ample protection.
Mechanical Dimensions
DA SERIES
“A” DIMENSION:
FILISTER HEAD SCREW - 51mm (2.01)
PAN HEAD SCREW - 53mm (2.09)
A
4.3mm
(0.170)
60.3
(2.37)
44.45
±
0.75
(1.75
±
0.03)
DB SERIES
ALL DIMENSIONS ARE MAXIMUM
EXCEPT WHERE NOTED
15mm (0.59)
46.8
(1.84)
23mm
±
1mm
(0.90
±
0.04)
M4 INTERNATIONAL
THREAD
HOLES 0.21 THRU
BORE 0.343 x 0.328 DP
40.5
(1.6)
12.7
(0.50)
12.7
(0.50)
2 HOLES
6.35
(0.25)
23
(0.90)
41
(1.61)
6.35
(0.25)
25.4
±
0.75
(1.00
±
0.03)
67mm
(2.64)
57mm
(2.24)
1.6
(0.06)
62mm
(2.44)
4.5mm (0.18)
Dimensions in millimeters and (inches).
All Harris Semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Harris Semiconductor products are sold by description only. Harris Semiconductor reserves the right to make changes in circuit design and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Harris is believed to be accurate
and reliable. However, no responsibility is assumed by Harris or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may
result from its use. No license is granted by implication or otherwise under any patent or patent rights of Harris or its subsidiaries.
For information regarding Harris Semiconductor and its products, call
Traditionally, lock-in amplifiers are used to measure100mΩ to1MΩ , beyond which limitations become more pronounced. Even within this range, new instruments using the DC inversion method [1] offer adva...
bq24090[1]1A Single Input Single Cell Li-Ion Battery Charger with 10kΩ NTCbq24040[1]800mA Single Input Single Cell Li-Ion Battery Charger with Auto-Start Functionbq24200[1]500mA 4.2V Monolithic Li-Ion...
[i=s]This post was last edited by Qintianqintian0303 on 2022-4-20 23:02[/i]Thanks to EEWorld for inviting you to the disassembly (fourth issue): the popular power bank disassembly event. As we all kno...
I want to ask if any experts have used the W5100 protocol stack chip. This chip does not seem to be very stable. I am working on a UDP protocol project. When sending data, I can occasionally detect th...
After Liqi Technology successfully launched a complete power management solution for motherboards, Liqi has launched a series of complete power management solutions for the graphics card market. Inclu...
In recent years, with the increasing demand for manufacturing and automated production management, industrial barcode scanners have gradually become an indispensable part of the industrial manufact...[Details]
If the ultimate form of a car is a silicon-based life form, then in
the field of
intelligent driving
, it has gradually taken on the appearance of a "veteran driver." In
the field of
the ...[Details]
Wave soldering is a crucial electronic component soldering technique used in the production of a wide range of electronic devices, from home appliances to computers to avionics. The process is wide...[Details]
The jammer is a signal blocker, mainly composed of a chip and a radio transmitter. When the car owner presses the remote control lock button, the jammer interferes with the electronic lock receivin...[Details]
Recently, South Korean robotics giant WIRobotics launched its first general-purpose humanoid robot, ALLEX, at the Robotics Innovation Center (RIH) at the Korea University of Science and Technology....[Details]
In the summer of 2025, BlueOval SK, a joint venture between Ford and SK On, officially started production at its first battery factory in Kentucky.
According to the original plan, this w...[Details]
Keysight Technologies is combining its electromagnetic simulator with Synopsys' AI-driven RF design migration flow to create an integrated design flow for migrating from TSMC's N6RF+ process techno...[Details]
The practice of warming up a car originated with gasoline-powered vehicles. Warming up the engine allows it to enter a better working state and ensures good lubrication. This has become a habit for...[Details]
Plessey Semiconductors has been acquired by Haylo Labs, which was established in March last year with a $100 million, five-year loan from Chinese technology company Goertek.
Haylo Labs w...[Details]
For today's new energy vehicles, they have different configurations from fuel vehicles, and some configurations have also become a selling point for manufacturers. Compared with traditional vehicle...[Details]
Introduction: In digital circuit calculations, there is no concept of decimal points. You know where the decimal is, but the circuit does not know where the decimal point is. Therefore, you need to...[Details]
Definitions of VR
, AR, and MR:
What is Virtual Reality?
Virtual Reality (VR), also known as "spiritual realm" or "illusion," is a high-tech technology that has emerged in recent ye...[Details]
Today,
the Intel®
Universal
Quick Connector (UQD) Interchangeability Alliance was officially established
. At the inaugural ceremony, Intel and its first certified partners—Invicta...[Details]
At the 2025 KeyBanc Investor Conference,
ON
Semiconductor CEO Hassane S. El-Khoury, framing global industrial transformation as the basis for
his strategic layout in two high-growth sect...[Details]
Mr. Wang, a BYD owner, recently experienced a "5-minute charge" at a highway service area, boasting a 400-kilometer range. He marveled at the rapid evolution of new energy technol...[Details]
Analogue and Mixed Signal
京公网安备 11010802033920号
EEWORLD
