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Z357PA21-DEV-P-TC

Description
board dev rapidse zigbee usb PA
CategoryDevelopment board/suite/development tools   
File Size531KB,13 Pages
ManufacturerMMB
Websitehttp://mmbnetworks.com/
Environmental Compliance  
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Z357PA21-DEV-P-TC Overview

board dev rapidse zigbee usb PA

MMB Networks EM357 ZigBee Module
Z357PA10-SMT, Z357PA10-USN, Z357PA10-UFL
The MMB Networks EM357 ZigBee Module is a drop-in ZigBee Smart
Energy and Home Automation solution. Preloaded with MMB Networks’
RapidSE ZigBee Smart Energy application or RapidHA Home Automation
application, it offers hardware vendors an easy way to integrate a
fully-implemented, automated ZigBee Smart Energy or ZigBee Home
Automation platform into their existing devices.
MMB Networks offers a variety of hardware and software development
tools to facilitate integration. For more information, please visit
http://www.mmbnetworks.com
Document Rev 4.0
Contents
1 |
General Information...................................................................................................................... 2
2 |
Memory ........................................................................................................................................... 2
3 |
Module Pinout ................................................................................................................................ 2
3.1 | Debug and Programming Interface .........................................................................................................................3
4 |
Electrical Specifications ................................................................................................................ 3
4.1 | Absolute Maximum Ratings ..........................................................................................................................................3
4.2 | Recommended Operating Conditions ...................................................................................................................3
4.3 | DC Electrical Characteristics...........................................................................................................................................4
5 |
RF Specifications ............................................................................................................................ 4
5.1 | Receive Specifications .......................................................................................................................................................4
5.2 | Transmit Specifications .....................................................................................................................................................6
5.3 | Synthesizer................................................................................................................................................................................6
6 |
Functional Specifications ............................................................................................................. 6
6.1 | Serial Ports.................................................................................................................................................................................6
6.2 | GPIO ..............................................................................................................................................................................................8
6.3 | Analog to Digital Converter (ADC) ............................................................................................................................8
7 |
Mechanical Specifications............................................................................................................ 9
7.1 | Physical Dimensions ...........................................................................................................................................................9
7.2 | Recommended Land Pattern (Surface Mount)...............................................................................................10
7.3 | Connector Specifications .............................................................................................................................................11
7.4 | Labelling..................................................................................................................................................................................11
8 |
Soldering Temperature Time Profile for reflow soldering (Lead-free solder)...................11
9 |
Regulatory Approvals .................................................................................................................12
9.1 | Federal Communications Commission (FCC - US)........................................................................................12
9.2 | EU ................................................................................................................................................................................................12
10
| Ordering Information ...............................................................................................................13
Rev 4.0 MMB Research 2014
Page 1
Z357PA10 Module Data Sheet

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Z357PA21-DEV-P-TC Z357PA21-DEV-P-PC ZDEVM-10-PC ZDEVM-10-TC Z357PA10-SMT-N Z357PA10-USN-P-TC Z357PA10-USN-P-PC Z357PA10-SMT-P-TC Z357PA10-SMT-P-PC
Description board dev rapidse zigbee usb PA board dev rapidse zigbee usb PA kit dev zigbee - production kit dev zigbee - test RF zigbee smart energy mod smd RF zigbee smart energy mod smd RF zigbee smart energy mod smd RF zigbee smart energy mod smd RF zigbee smart energy mod smd
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